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CN-224224219-U - Rotatable wire cutting machine of silicon ingot

CN224224219UCN 224224219 UCN224224219 UCN 224224219UCN-224224219-U

Abstract

The utility model provides a rotatable silicon ingot linear cutting machine which comprises a frame, a bearing table and a cutting mechanism, wherein the Z-direction feeding mechanism drives the cutting mechanism to lift in the height direction to cut a silicon ingot on the bearing table, the X-direction feeding mechanism comprises an X-direction linear guide rail, an X-direction sliding block and a rotary workbench, the rotary workbench comprises a workbench base and a rotary driving mechanism, the workbench base is fixed on the X-direction sliding block, and the bearing table is arranged on the workbench base and is driven by the rotary driving mechanism to rotate on a horizontal plane. The utility model has reasonable structural design, and utilizes the Z-direction feeding mechanism to cut the silicon ingot up and down in the height direction. The silicon ingot cutting and blocking device not only can realize the cutting and blocking of the silicon ingot, but also can repair the surface and shape of the silicon ingot in the circumferential direction, the cutting and shape repairing are integrated in the same machine, the operation processing procedure is effectively simplified, the processing error caused by repeated disassembly and assembly can be reduced when the same silicon ingot is processed, and the cutting precision is further improved.

Inventors

  • XIA YUN
  • CHEN XIAOTU

Assignees

  • 常州首嘉精密制造有限公司

Dates

Publication Date
20260512
Application Date
20250408

Claims (10)

  1. 1. The rotatable wire cutting machine for the silicon ingot is characterized by comprising a frame, a bearing table and a wire cutting mechanism, wherein the silicon ingot is loaded and arranged on the bearing table, and an X-direction feeding mechanism and a Z-direction feeding mechanism are respectively arranged on the frame; The Z-direction feeding mechanism drives the wire cutting mechanism to lift in the height direction to cut the silicon ingot on the bearing table; The X-direction feeding mechanism comprises X-direction linear guide rails, X-direction sliding blocks and a rotary workbench, wherein the X-direction linear guide rails are distributed on the frame in pairs along the horizontal direction, and each X-direction linear guide rail is provided with the X-direction sliding block in a sliding manner; The rotary workbench comprises a workbench base and a rotary driving mechanism, wherein the workbench base is fixed on the X-direction sliding block, and the bearing table is arranged on the workbench base and is driven by the rotary driving mechanism to rotate on a horizontal plane.
  2. 2. The rotatable linear cutting machine of silicon ingots according to claim 1, wherein the machine frame is provided with a Z-direction linear guide rail along the height direction, the Z-direction linear guide rail is provided with a Z-direction sliding block in a sliding manner, the Z-direction sliding block is fixedly provided with a Z-direction lifting workbench, the Z-direction feeding mechanism drives the Z-direction sliding block to move along the Z-direction linear guide rail, and the driving guide wheel of the cutting mechanism is rotatably arranged on the Z-direction lifting workbench.
  3. 3. A rotatable wire cutting machine for silicon ingots is characterized in that a first winding and unwinding mechanism, a first tensioning mechanism and a first auxiliary guide wheel are arranged on the wire cutting mechanism corresponding to a first driving guide wheel, a second winding and unwinding mechanism, a second tensioning mechanism and a second auxiliary guide wheel are arranged on the wire cutting mechanism corresponding to a second driving guide wheel, and a cut metal wire initial section is wound around the first auxiliary guide wheel after being unwound into the first tensioning mechanism through the first winding and unwinding mechanism and is wound by the first winding and unwinding mechanism after passing through the first driving guide wheel, the second auxiliary guide wheel and the second tensioning mechanism.
  4. 4. The rotatable wire cutting machine of silicon ingot of claim 3, wherein the first tensioning mechanism and the second tensioning mechanism have the same structure and comprise a tensioning guide wheel, a tensioning arm rocker and a tensioning servo motor, wherein the tensioning servo motor is fixed on the frame, one end of the tensioning arm rocker is fixed at the output end of the tensioning servo motor, and the other end of the tensioning arm rocker is rotatably provided with the tensioning guide wheel.
  5. 5. The rotatable wire cutting machine of silicon ingot of claim 4, wherein the first winding and unwinding mechanism and the second winding and unwinding mechanism have the same structure and comprise winding and unwinding motors, winding and unwinding wire storage drums and winding and unwinding wire guide wheel sets, the winding and unwinding wire storage drums are arranged at the output ends of the winding and unwinding motors in a transmission mode, one ends of the cut wires are fixed with the winding and unwinding wire storage drums and are wound on the winding and unwinding wire storage drums, and the other ends of the cut wires are correspondingly connected with tensioning guide wheels at corresponding sides after passing through the winding and unwinding wire guide wheel sets.
  6. 6. The rotatable wire cutting machine of silicon ingots is characterized in that the winding and unwinding guide wheel group comprises an upper longitudinal guide wheel, a lower longitudinal guide wheel and a transverse guide wheel which are sequentially arranged, wherein the upper longitudinal guide wheel, the lower longitudinal guide wheel and the transverse guide wheel are arranged from top to bottom in the height direction, and the section of a cut metal wire between two adjacent guide wheels is distributed at 90 degrees.
  7. 7. A rotatable wire cutting machine for silicon ingots is characterized in that a deviation rectifying device is further arranged between the winding and unwinding mechanism and the winding and unwinding guide wheel group at each side, the deviation rectifying device comprises a deviation rectifying wheel, and a cutting metal wire between the winding and unwinding wire storage cylinder and the upper longitudinal guide wheel is contacted with the deviation rectifying wheel and guided and supported by the deviation rectifying wheel.
  8. 8. The rotatable linear cutting machine of silicon ingots is characterized in that the X-direction feeding mechanism further comprises an X-direction servo motor and a horizontal moving ball screw, the horizontal moving ball screw is arranged on the frame in parallel with the X-direction linear guide rail through a supporting seat, the X-direction servo motor is arranged on the frame, the output end of the X-direction servo motor is in transmission connection with the horizontal moving ball screw, and the X-direction sliding block is matched with the horizontal moving ball screw.
  9. 9. The rotatable wire cutting machine of silicon ingot of claim 1, wherein the rotary driving mechanism comprises a rotary motor, a driving gear and a rotary gear, the rotary motor is fixed on a workbench base, the rotary gear and the driving gear are respectively arranged on the workbench base in a rotating way, the output end of the rotary motor is in transmission connection with the driving gear and drives the driving gear to rotate, the driving gear is in transmission connection with the rotary gear, and the bearing table is fixed on the upper end face of the rotary gear.
  10. 10. A rotatable wire cutting machine for silicon ingots is characterized in that the surface of the bearing table is rectangular, each side of the rectangle corresponding to the rectangle in the rectangular plane is provided with a cut Pi Cao parallel to each side, the rectangular plane is internally provided with at least one group of cross-shaped grooves, each group of cross-shaped grooves comprises two cutting grooves, and the two cutting grooves are arranged in a 90-degree crossed mode.

Description

Rotatable wire cutting machine of silicon ingot Technical Field The utility model relates to the technical field of wire cutting machines, in particular to a silicon ingot rotatable wire cutting machine. Background In the process of silicon material processing, a silicon ingot grown by processes such as a Czochralski method or a directional solidification method is always in an irregular cylinder shape, crystal edges can appear on the outer side, and the head and the tail are provided with conical ends. Such irregular shapes are detrimental to subsequent cutting and processing of the wafer. Through the evolution, the silicon ingot can be cut into regular shapes, such as rectangles or squares, so that the silicon ingot meets the requirements of subsequent processing. In the existing silicon ingot line cutting machine, abrasive materials are brought into a semiconductor processing area to be ground through high-speed reciprocating motion of metal wires (such as steel wires), so that silicon ingots are cut. The silicon ingot is usually placed on a bearing table, and is precisely cut by matching a driving motor with a cutting line group. The existing wire cutting machine is usually a large-scale cutting device, such as a multi-wire cutting machine, and a plurality of groups of wire sets are designed in the cutting wire sets to complete the cutting operation of a large-scale silicon ingot in a matched and synchronous manner. Under the operation of the Z-direction feeding mechanism, the multiple groups of wire cutting machines move in the height direction to finish the cutting operation of the silicon ingot. This squaring operation is typically performed on large silicon ingots, and there are disadvantages to fine cutting of the silicon ingot. Meanwhile, in the process of generating the silicon ingot, an irregular surface exists on the outer peripheral surface, when the existing wire cutting machine is used for cutting, the wire cutting machine is used for cutting the skin and trimming the silicon ingot, or after the silicon ingot is opened, the small silicon ingots after the silicon ingot is opened one by one are further trimmed, the operation procedure is complicated, and still there is room for improvement. Disclosure of utility model The utility model aims to solve the technical problems that the utility model provides the rotatable wire cutting machine for the silicon ingot, which can drive the wire cutting mechanism to act in the height direction to cut the silicon ingot, and simultaneously can provide linear feeding and horizontal rotation in the horizontal direction as required, so that the feeding and circumferential rotation actions of the silicon ingot are realized, and the cutting and circumferential trimming operations of the silicon ingot are facilitated. The technical scheme includes that the rotatable wire cutting machine for the silicon ingot comprises a frame, a bearing table and a wire cutting mechanism, the silicon ingot is loaded and arranged on the bearing table, an X-direction feeding mechanism and a Z-direction feeding mechanism are respectively arranged on the frame, the wire cutting mechanism comprises a cutting metal wire, a first driving guide wheel and a second driving guide wheel, the cutting metal wire passes through the first driving guide wheel and the second driving guide wheel and forms a cutting wire parallel to the horizontal direction, the Z-direction feeding mechanism drives the wire cutting mechanism to lift the silicon ingot on the bearing table in the height direction, the X-direction feeding mechanism comprises X-direction linear guide rails, X-direction sliding blocks and a rotary worktable, the X-direction linear guide rails are distributed on the frame in pairs along the horizontal direction, each X-direction linear guide rail is provided with the X-direction sliding blocks in a sliding mode, the rotary worktable comprises a worktable base and a rotary driving mechanism, the worktable base is fixed on the X-direction sliding blocks, and the bearing table base is arranged on the worktable base and is driven by the rotary driving mechanism to rotate on the horizontal plane. In the scheme, the Z-direction feeding mechanism drives the cutting mechanism to lift so as to cut the silicon ingot on the bearing table. In the X-direction feeding mechanism, through the cooperation of the X-direction linear guide rail and the X-direction sliding block, the silicon ingot can be driven to linearly feed along the horizontal direction, and meanwhile, through the arrangement of the rotary workbench, the rotary feeding can be further provided on the basis of the horizontal linear feeding, so that the silicon ingot can be correspondingly rotated, and the turned silicon ingot is cut. Further, a Z-direction linear guide rail is arranged on the frame along the height direction, a Z-direction sliding block is arranged on the Z-direction linear guide rail in a sliding mode, a Z-direction lift