Search

CN-224224290-U - Plastic mould cooling mechanism

CN224224290UCN 224224290 UCN224224290 UCN 224224290UCN-224224290-U

Abstract

The utility model discloses a cooling mechanism of a plastic mold, which comprises a frame, wherein a switch is fixedly arranged on the inner wall of the frame, a box body is fixedly connected to the top of the inner side of the frame, a conveying pump is fixedly arranged on the outer side of the box body, a plurality of heat-conducting net plates are arranged to be in contact with cooling liquid for carrying out heat exchange and refrigeration operation, then two motors drive fan blades to rotate, the heat-conducting plates carry out auxiliary heat dissipation operation on heat generated in the operation of the semiconductor refrigeration assembly, the cooling liquid in the box body for completing refrigeration operation is further conveyed into a coil pipe through the conveying pump, and then the heat-conducting rectangular frame carries out heat exchange operation on cool air in the cooling liquid and heat generated in the operation of a lower mold, so that the cooling operation of the plastic mold is completed, and meanwhile, the conveying pump, the semiconductor refrigeration assembly and the motors are continuously operated, so that the cooling mechanism can continuously carry out circulation cooling operation on the plastic mold, and the cooling effect of the plastic mold is further improved.

Inventors

  • LI YANYUN
  • HE FENG
  • HE CHAOYUE

Assignees

  • 深圳市顺航达塑胶模具有限公司

Dates

Publication Date
20260512
Application Date
20250506

Claims (6)

  1. 1. A plastic mold cooling mechanism comprises a frame (1) and is characterized in that a switch (2) is fixedly arranged on the inner wall of the frame (1), a box body (3) is fixedly connected to the inner side top of the frame (1), a conveying pump (4) is fixedly arranged on the outer side of the box body (3), a semiconductor refrigerating assembly (5) is installed through and embedded in the bottom of the box body (3), a plurality of heat conducting screen plates (6) are fixedly connected to one side of the semiconductor refrigerating assembly (5) after extending into the box body (3) at equal intervals, a heat conducting plate (7) is fixedly connected to the outer side of the other side of the semiconductor refrigerating assembly (5), two fixing frames (8) are symmetrically connected to the bottom of the heat conducting plate (7), a motor (9) is fixedly arranged inside the fixing frames (8) through fixing rods, fan blades (10) are fixedly connected to the output shaft of the motor (9), a die holder (11) is fixedly connected to the top of the frame (1), a mounting plate (12) is installed through and embedded in the center of the die holder (11), a mounting plate (11) is connected to the inner side of the die holder (11), a rectangular coil holder (13) is arranged inside the electric push rod (11), and a heat conducting channel (15) is embedded in the fixing frame (14).
  2. 2. The cooling mechanism of plastic molds according to claim 1, wherein a liquid inlet pipe is fixedly connected to a liquid inlet of the front surface of the case (3), a valve is arranged on the liquid inlet pipe, a liquid outlet pipe is fixedly connected to a liquid outlet of the front surface of the case (3), and a valve is arranged on the liquid outlet pipe.
  3. 3. The cooling mechanism of plastic molds according to claim 1, wherein the case (3) is provided with an opening for the semiconductor refrigeration assembly (5) to be fixedly embedded and penetrated, and the heat conducting plate (7) is fixedly connected with the bottom of the case (3) through a fixing rod.
  4. 4. The cooling mechanism of plastic molds according to claim 1, wherein the mounting plate (12) is provided with a mounting through hole, the electric push rod (13) is fixedly mounted on the top of the frame (1), and the push rod end of the electric push rod (13) is fixedly connected with the bottom of the mounting plate (12).
  5. 5. The plastic mold cooling mechanism of claim 1, wherein the groove for fixedly embedding the heat-conducting rectangular frame (14) is formed in the groove on the mold base (11), the channel for embedding and connecting the coil pipe (15) is formed in the mold base (11), the outer side of the coil pipe (15) is tightly attached to the outer side of the heat-conducting rectangular frame (14), a liquid outlet of the coil pipe (15) is fixedly connected with a liquid inlet of the box body (3) through a guide pipe, the liquid inlet of the coil pipe (15) is fixedly connected with a liquid outlet of the conveying pump (4) through a guide pipe, and the liquid inlet of the conveying pump (4) is fixedly connected with the liquid outlet of the box body (3) through a guide pipe.
  6. 6. The cooling mechanism for plastic molds according to claim 1, wherein said transfer pump (4), semiconductor refrigerating component (5), motor (9) and electric push rod (13) are electrically connected with switch (2) through wires, said switch (2) is electrically connected with external power supply through wires.

Description

Plastic mould cooling mechanism Technical Field The utility model relates to the technical field related to plastic molds, in particular to a cooling mechanism for a plastic mold. Background The plastic mould is a kind of combined mould for compression moulding, extrusion moulding, injection, blow moulding and low foaming moulding, and the mould male and female moulds and auxiliary moulding system are changed in coordination, so that a series of plastic parts with different shapes and sizes can be processed. Through retrieving, patent application number is 202322485771.1, discloses a plastic mould cooling mechanism, which comprises a die holder, the top both sides of die holder all are fixed with the support column, the top of die holder is provided with the lower mould, the heat-conducting plate is installed to the top of die holder, the below of heat-conducting plate is provided with heat radiation fins, the cooling tube is installed to one side of heat radiation fins, the inlet tube is installed to one end of cooling tube, the outlet pipe is installed to the other end of cooling tube, first flange is installed to one side of inlet tube, this plastic mould cooling mechanism uses through the cooperation of heat-conducting plate, heat radiation fins, cooling tube, outlet pipe, inlet tube, water tank and water pump, and the heat that the lower mould produced is conducted through the heat-conducting plate when using, and the heat-conducting plate passes to heat radiation fins on, carries out the heat exchange by heat radiation fins and cooling tube and cools off the lower mould, and cooling effect is better, can be convenient for use the hydrologic cycle in the cooling tube through the setting of water tank and water pump, has reduced the use cost of the device. The cooling mechanism is used for carrying out heat exchange and cooling operation by directly contacting a heat conducting plate arranged above the die holder with the bottom of the lower die, but the cooling effect of the die is poor due to limited contact surface of the heat conducting plate and the lower die, so that the plastic die cooling mechanism is provided for optimizing and solving the problems. Disclosure of utility model The present utility model is directed to a cooling mechanism for plastic molds, which solves the above-mentioned problems in the prior art. In order to achieve the above purpose, the present utility model provides the following technical solutions: The utility model provides a plastic mould cooling mechanism, includes the frame, fixed mounting has the switch on the frame inner wall, the inboard top fixedly connected with box of frame, box outside fixed mounting has the delivery pump, the bottom half runs through and inlays and establishes and install semiconductor refrigeration subassembly, equidistance fixedly connected with a plurality of heat conduction otter boards behind semiconductor refrigeration subassembly one side stretching into the box, semiconductor refrigeration subassembly opposite side outside fixedly connected with heat conduction board, heat conduction board bottom symmetry is connected with two mounts, the inside motor that has through dead lever fixed mounting of mount, motor output shaft fixedly connected with flabellum, frame top fixedly connected with die holder, the die holder central point puts the department and runs through and has seted up the channel, sliding connection has the mounting panel in the channel, the inside electric putter that is provided with of channel on the die holder, the channel inner wall on the die holder is fixedly inlayed and is equipped with the heat conduction rectangle frame, fixedly inlayed in the die holder is equipped with the coil pipe. As a further scheme of the utility model, a liquid inlet pipe is fixedly connected to the liquid inlet of the front surface of the box body, a valve is arranged on the liquid inlet pipe, a liquid outlet pipe is fixedly connected to the liquid outlet of the front surface of the box body, and the valve is arranged on the liquid outlet pipe. As a still further proposal of the utility model, the box body is provided with an opening for the semiconductor refrigeration component to be fixedly embedded and penetrated, and the heat conducting plate is fixedly connected with the bottom of the box body through a fixing rod. As a still further proposal of the utility model, the mounting plate is provided with a mounting through hole, the electric push rod is fixedly arranged at the top of the frame, and the end part of the push rod of the electric push rod is fixedly connected with the bottom of the mounting plate. The heat conducting rectangular frame is characterized in that a groove for fixedly embedding the heat conducting rectangular frame is formed in a groove on the die holder, a channel for embedding and connecting a coil is formed in the die holder, the outer side of the coil is tightly attached to the outer side of the heat conducti