CN-224224393-U - Semiconductor plastic package material pretreatment device

Abstract

The utility model provides a pretreatment device for semiconductor plastic packaging materials, and relates to the technical field of semiconductor plastic packaging. The utility model comprises a cleaning box, a cleaning pipe is arranged on the cleaning box, an air pipe is arranged at the side part of the cleaning box and is communicated with the inside of the cleaning box, a fan is arranged on the air pipe, wherein the top of the cleaning pipe is communicated with a feeding pipe, a second gate valve is arranged on the feeding pipe, the bottom of the cleaning pipe extends out of the cleaning box, a first gate valve is arranged on the cleaning pipe at the bottom of the cleaning box, and a plurality of through holes are distributed on the cleaning pipe in the cleaning box. The utility model pretreats the injection molding material for injection molding, and removes impurities and moisture in the injection molding material by generating air flow so as to improve the product quality.

Inventors

• LIU MINGHUA
• JIANG MINGZHI

Assignees

• 成都尚明工业有限公司

Dates

Publication Date

20260512

Application Date

20250630

Claims (10)

1. 1. The utility model provides a semiconductor plastic envelope material preprocessing device which characterized in that includes: a cleaning tank; The cleaning pipe is arranged on the cleaning box; the air pipe is connected with the air pipe, the side part of the cleaning box is communicated with the inside of the cleaning box; the fan is arranged on the air pipe; The cleaning device comprises a cleaning box, a cleaning pipe, a first gate valve, a second gate valve, a cleaning pipe and a plurality of through holes, wherein the top of the cleaning pipe is communicated with the feeding pipe, the feeding pipe is provided with the second gate valve, the bottom of the cleaning pipe extends out of the cleaning box, the cleaning pipe at the bottom of the cleaning box is provided with the first gate valve, and the cleaning pipe in the cleaning box is provided with the plurality of through holes.
2. 2. The pretreatment device for semiconductor plastic package materials according to claim 1, wherein a rotating column in a coaxial state is rotationally arranged in the cleaning tube, a plurality of rotating rods are arranged on the rotating column, and a second motor in transmission connection with the rotating column is arranged at the top of the cleaning tube.
3. 3. The pretreatment device for semiconductor molding compound as claimed in claim 2, wherein the rotating rods are arranged perpendicular to the rotating column and along the radial direction of the cleaning tube, and the rotating rods are uniformly arranged on the rotating column.
4. 4. The semiconductor plastic package material pretreatment device according to claim 2, wherein the inside of the rotating column and the rotating rod is of a communicated hollow structure, the rotating rod is fully provided with a plurality of air holes, the outer wall of the top of the rotating column is rotatably sleeved with an air inlet sleeve, the air inlet sleeve is fixed in the cleaning pipe through a pull rod, and the air inlet sleeve is communicated with the air pipe.
5. 5. The pretreatment device for semiconductor molding compound of claim 4, wherein said feed pipe is connected to a cleaning pipe at the lower part of said air inlet sleeve.
6. 6. The pretreatment device for the semiconductor plastic package material according to claim 4, wherein the inside of the air inlet sleeve is of a cavity structure, the air pipe is communicated with the cavity inside the air inlet sleeve, a plurality of through holes are formed in the rotating column at the cavity inside the air inlet sleeve, and the rotating columns at the upper part and the lower part of the through holes are rotationally sealed with the air inlet sleeve.
7. 7. The pretreatment device for semiconductor plastic package materials according to claim 4, wherein the air hole is internally provided with an air dispersing block, a plurality of holes through which air can pass are distributed in the air dispersing block, and an elastic air film is connected between the air dispersing block and the inner wall of the air hole.
8. 8. The semiconductor plastic package material pretreatment device according to any one of claims 1 to 7, wherein the cleaning box comprises a top plate and a bottom plate, a plurality of shielding covers are arranged between edges of the top plate and the bottom plate, and the air pipe is arranged on the shielding covers.
9. 9. The semiconductor molding compound pretreatment device according to claim 8, wherein the shield is gradually reduced in size in a direction from the inside to the outside of the cleaning tank.
10. 10. The pretreatment device for the semiconductor plastic package material of claim 8, wherein the top plate and the bottom plate are rectangular, four blocking covers in a quadrangular frustum pyramid shape are arranged between the edges of the top plate and the bottom plate, the small-caliber ends of the blocking covers face to the outer side, and the air pipes are arranged at the small-caliber ends of the blocking covers.

Description

Semiconductor plastic package material pretreatment device Technical Field The utility model relates to the technical field of semiconductor plastic packaging, in particular to a pretreatment device for semiconductor plastic packaging materials. Background The semiconductor refers to a material with the conductivity between the conductor and the insulator at room temperature, the conductivity of the semiconductor material can be changed by doping, and the concentration and polarity of impurities doped into the intrinsic semiconductor can greatly influence the conductivity of the semiconductor. The semiconductor doped with donor impurities, the conductive carriers are mainly electrons in conduction bands, and the semiconductor doped with acceptor impurities belongs to hole type conduction. The semiconductor packaging process includes cutting wafer from wafer front process into small chips, adhering the cut chips onto small islands of corresponding substrate (lead frame) frame with glue, connecting bonding pads of the chips to corresponding pins of the substrate with superfine metal (gold-tin-copper-aluminum) wire or conductive resin to form required circuit, packaging and protecting the independent chips with plastic casing, performing a series of operations after plastic packaging, testing the finished products after packaging, and storing and delivering the finished products. In the prior art, a semiconductor and a lead frame which are subjected to lead bonding are placed in a die, then a plastic packaging compound is injected to wrap gold wires on a wafer and the lead frame, a protection element is not damaged, an internal chip is prevented from being oxidized by gas, safety and stability of a product are guaranteed, when the plastic is injected, the plastic is generally directly fed into a charging barrel through a hopper at present, the plastic is heated and melted in the charging barrel, a screw rotates in the charging barrel and extrudes the plastic for injection, and impurities including dust and moisture possibly existing in the plastic can influence the quality of a plastic package body after injection. Disclosure of utility model The utility model aims to develop a semiconductor plastic package material pretreatment device for pretreating injection molding materials for injection molding, which removes impurities and moisture in the injection molding materials by generating air flow so as to improve the product quality. The utility model is realized by the following technical scheme: A semiconductor plastic package material pretreatment device comprises: a cleaning tank; The cleaning pipe is arranged on the cleaning box; the air pipe is connected with the air pipe, the side part of the cleaning box is communicated with the inside of the cleaning box; the fan is arranged on the air pipe; The cleaning device comprises a cleaning box, a cleaning pipe, a first gate valve, a second gate valve, a cleaning pipe and a plurality of through holes, wherein the top of the cleaning pipe is communicated with the feeding pipe, the feeding pipe is provided with the second gate valve, the bottom of the cleaning pipe extends out of the cleaning box, the cleaning pipe at the bottom of the cleaning box is provided with the first gate valve, and the cleaning pipe in the cleaning box is provided with the plurality of through holes. Optionally, the cleaning tube is rotationally provided with a rotating column which is in a coaxial state with the cleaning tube, the rotating column is provided with a plurality of rotating rods, and the top of the cleaning tube is provided with a second motor which is in transmission connection with the rotating column. Alternatively, the rotating rods are perpendicular to the rotating column and are arranged along the radial direction of the cleaning pipe, and the rotating rods are uniformly arranged on the rotating column. Optionally, the inside hollow structure that is linked together of revolving post and bull stick, be covered with a plurality of gas pockets on the bull stick, revolving post top outer wall rotates the cover and is equipped with the cover that admits air, the cover that admits air is fixed in the cleaning tube through the pull rod, the intercommunication has the gas-supply pipe on the cover that admits air. Optionally, the feeding pipe is communicated with the cleaning pipe at the lower part of the air inlet sleeve. Optionally, the inside cavity structure that is of cover that admits air, gas-supply pipe and the inside cavity intercommunication of cover that admits air are equipped with a plurality of through-holes on the steering column of the inside cavity department of cover that admits air, the steering column and the cover rotary seal that admits air of through-hole upper portion and lower part. Optionally, an air dispersing block is arranged in the air hole, a plurality of holes through which air can pass are distributed in the air dispersing block, and an elasti