CN-224224453-U - Solve thermosetting material mould gas pocket and mould structure of lacking material

Abstract

The utility model discloses a die structure for solving air holes and material shortage of a thermosetting material die, which comprises an upper die holder, a lower die holder, an upper die core and a lower die core, wherein the upper die core and the lower die core are arranged on the upper die holder, the die structure also comprises a thimble lifting mechanism, a storage group thimble plate driven by the thimble lifting mechanism to lift and a storage thimble fixed on the storage group thimble plate, the upper die core and the lower die core form a cavity material storage area, the lower die core is provided with a channel communicated with the cavity material storage area, the thimble lifting mechanism can drive the storage thimble to slide in the channel, and when the storage thimble is in an original position, the top of the storage thimble forms a thimble material storage area in the channel.

Inventors

• JIANG HAO

Assignees

• 浙江傲邦科技有限公司

Dates

Publication Date

20260512

Application Date

20250530

Claims (4)

1. 1. The utility model provides a solve mould structure of thermosetting material mould gas pocket and lacks material, includes upper die base (8), die holder (9), installs go up mould benevolence (1), lower mould benevolence (2) on upper die base (8), its characterized in that still includes and installs thimble climbing mechanism (7) on die holder (9), by thimble climbing mechanism (7) drive storage group thimble board (6) that go up and down and fix storage thimble (5) on storage group thimble board (6), go up mould benevolence (1) and lower mould benevolence (2) and form die cavity storage area (3), lower mould benevolence (2) be equipped with the communicating passageway of die cavity storage area (3), thimble climbing mechanism (7) can drive storage thimble (5) are in the passageway is slided, when storage thimble (5) are in the home position, storage thimble (5) top is in form thimble storage area (4) in the passageway.
2. 2. The mold structure according to claim 1, characterized in that when the stock ejector pin (5) moves upward in the ejector pin lifting mechanism (7), the material stored in the ejector pin stock area (4) is pressed into the cavity stock area (3).
3. 3. The die structure according to claim 1, wherein the ejector pin lifting mechanism (7) is a hydraulic cylinder or an air cylinder or an electric push rod.
4. 4. A mould structure according to claim 3, characterized in that the storage group ejector pin plate (6) is mounted at the driving end of the ejector pin lifting mechanism (7), and the storage ejector pin (5) is mounted at the upper part of the storage group ejector pin plate (6).

Description

Solve thermosetting material mould gas pocket and mould structure of lacking material Technical Field The utility model relates to the technical field of molds, in particular to a mold structure for solving the problems of air holes and material shortage of a thermosetting material mold. Background Thermoset materials are widely used in the modern industry due to their unique physical and chemical properties, such as high strength, heat resistance, chemical resistance, etc. Such materials undergo chemical reactions upon heating during the manufacturing process to form infusible solids, and are therefore particularly suitable for use in the manufacture of components that are required to withstand high temperature or high pressure environments. In particular, in the field of white goods and electrical switches, the use of thermosetting materials is particularly widespread, becoming an indispensable key material in the manufacture of these products. However, these excellent properties of thermosets also present certain production challenges. Due to the complexity of the curing process and the high sensitivity to injection molding processes, problems of blow holes and starvation often occur during production. The air holes are usually formed by the fact that the gas in the material is not discharged in time and is sealed inside the product in the curing process, and the lack of the material can be caused by insufficient injection pressure, unreasonable mold structure or poor material fluidity. These problems not only seriously affect the appearance quality and performance of the product, but also often lead to rejection of the product, thereby increasing production costs. Disclosure of utility model Aiming at the defects of the prior art, the utility model provides a die structure for solving the problems of air holes and material shortage of a thermosetting material die and solves the problems of the prior art. In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a solve thermosetting material mould gas pocket and lack mould structure of material, includes upper die base, die holder, installs go up mould benevolence, the lower mould benevolence on the upper die base, still include install thimble climbing mechanism on the die holder, by the storage group thimble board that thimble climbing mechanism drove to go up and down and fix the storage thimble on the storage group thimble board, go up mould benevolence and lower mould benevolence and form die cavity storage area, the lower mould benevolence be equipped with the communicating passageway of die cavity storage area, thimble climbing mechanism can drive the storage thimble is in slide in the passageway, when the storage thimble is in the home position, storage thimble top is in form thimble storage area in the passageway. When the material storage thimble moves upwards in the thimble jacking mechanism, the material stored in the thimble storage area is extruded into the cavity storage area. As a further preferential technical scheme of the utility model, the thimble lifting mechanism is a hydraulic cylinder or an air cylinder or an electric push rod. The ejector plate of the storage group is arranged at the driving end of the ejector pin lifting mechanism, and the storage ejector pin is arranged at the upper part of the ejector plate of the storage group. The utility model provides a die structure for solving the problem of air holes and shortage of a thermosetting material die. Compared with the prior art, the method has the following beneficial effects: According to the mold structure for solving the problem of air holes and shortage of the thermosetting material mold, the effective compensation of the materials in the mold cavity is realized through the thimble structure designed in the lower mold core, and the quality and the production efficiency of the product are obviously improved. Specifically, the storage thimble is designed to be lower than the position of the cavity storage area in the die cavity in advance, that is to say, the top of the storage thimble forms a thimble storage area in the channel, the designed data are accurately determined according to the size of a product and the required storage amount, and the thimble storage area can accurately and effectively store materials under the cooperation of the storage thimble. When the pressure is maintained after the device emits the discharge quantity, the material storage thimble moves upwards under the drive of the thimble jacking mechanism, and materials stored above the material storage thimble (thimble storage area) are accurately extruded into the cavity storage area, so that air holes and poor filling possibly existing in injection molding are effectively filled. The innovative design not only greatly reduces the product rejection rate caused by air holes and material shortage and reduces the production cost,