CN-224226093-U - Lifting device, wafer-level aging test device, equipment and system

CN224226093UCN 224226093 UCN224226093 UCN 224226093UCN-224226093-U

Abstract

The utility model discloses a lifting device, a wafer-level aging test device, equipment and a system, wherein the wafer-level aging test device comprises a heat sink assembly and a probe board assembly, the lifting device comprises at least two lifting assemblies, a bearing platform and a bottom plate, the bearing platform is used for bearing the heat sink assembly and is fixed in longitudinal position, the bottom plate is provided with at least two supporting positions which are distributed, the lifting assembly comprises a connecting piece and a moving piece which are movably connected, the connecting piece is fixedly connected with the supporting positions, the moving piece is fixedly connected with the probe board assembly, and each moving piece can cooperatively drive the probe board assembly to move towards the heat sink assembly to form a wafer aging test cavity in a die closing mode. According to the utility model, the lifting assemblies are respectively arranged on at least two supporting positions, so that the lifting assemblies are stressed in a dispersed manner, the compression resistance is good, and each moving part can cooperatively drive the probe plate assembly to lift, so that the lifting precision and stability of the probe plate assembly are improved, and the noise is reduced.

Inventors

MA ZHAO
WANG YONG
XU PENGSONG
YANG MINFENG

Assignees

苏州联讯仪器股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250427

Claims (13)

1. The lifting device is used for a wafer-level burn-in testing device and comprises a heat sink assembly and a probe board assembly, and is characterized by comprising at least two lifting assemblies, a bearing platform and a bottom plate, wherein the bearing platform is used for bearing the heat sink assembly and is fixed in longitudinal position, and the bottom plate is provided with at least two supporting positions which are distributed; The lifting assembly comprises a connecting piece and moving pieces which are movably connected, the connecting piece is fixedly connected with the supporting position, the moving pieces are fixedly connected with the probe board assembly, and each moving piece can cooperatively drive the probe board assembly to move towards the heat sink assembly so as to form a wafer aging test cavity through die assembly.
2. The lifting device according to claim 1, wherein the lifting assembly further comprises a driving device and a screw rod, the driving device is in driving connection with the screw rod, the screw rod is in driving connection with the moving piece, the screw rod is vertically arranged, and the driving device can drive the moving piece and the probe board assembly to translate along the screw rod under the condition that the driving device drives the screw rod to rotate.
3. The lifting device according to claim 2, wherein the moving member comprises a first connecting portion, the first connecting portion is sleeved on the screw rod, the screw rod is provided with external threads, the first connecting portion is provided with internal threads, and the screw rod is in threaded connection with the first connecting portion.
4. The lifting device according to claim 1, wherein one of the connecting piece and the moving piece is provided with a sliding block, and the other is provided with a linear guide rail which is in sliding connection with the sliding block, and the sliding block slides relative to the linear guide rail, so that the moving piece can be limited to cooperate with the lifting direction of the probe board assembly.
5. The lift device of any one of claims 1-4, further comprising a plurality of stop members located on the load bearing platform, the stop members being capable of abutting a side of the probe card assembly facing the load bearing platform with the heat sink assembly in a clamped condition with the probe card assembly.
6. The lift device of any one of claims 1-4, further comprising a pressure sensing element for detecting pressure between the probe card assembly and the load bearing platform during lifting of the moving member; The pressure sensing element can be located on a side of the probe card assembly facing the loadbearing platform or the pressure sensing element can be located on a side of the loadbearing platform facing the probe card assembly.
7. The lift device of any one of claims 1-4, further comprising a first moving assembly and a second moving assembly, the first moving assembly being located between the floor and the second moving assembly, the load bearing platform being connected to the second moving assembly; The first moving assembly is movably connected with the bottom plate, can drive the second moving assembly and the bearing platform to cooperatively move along a first horizontal direction, the second moving assembly is movably connected with the first moving assembly, can drive the bearing platform to move along a second horizontal direction, and the first horizontal direction is intersected with the second horizontal direction.
8. The lifting device of claim 1, further comprising a support frame, wherein one end of the support frame is fixedly connected to the base plate, and the other end of the support frame is fixedly connected to a side of the connecting member facing away from the load bearing platform.
9. The lifting device of claim 8, wherein the supporting frame comprises a plurality of first frames and a plurality of second frames, the first frames are vertically arranged, the bottom plate and the connecting piece are fixedly connected through the first frames, and two adjacent first frames are connected through the second frames on the same supporting position.
10. A wafer level burn-in apparatus comprising a probe card assembly, a heat sink assembly and a lifting device according to any one of claims 1-9, wherein the longitudinal position of the heat sink assembly is fixed, and the lifting device is used to drive the probe card assembly to move towards the heat sink assembly to clamp the mold to form a wafer burn-in cavity.
11. The wafer level burn-in apparatus of claim 10, wherein said probe card assembly comprises a fixed plate and a needle plate, said fixed plate being fixedly connected to said moving member, said needle plate being removably fixedly connected to said fixed plate, said needle plate being positioned on a side of said fixed plate facing said heat sink assembly, said heat sink assembly being capable of clamping said needle plate.
12. Wafer level burn-in apparatus comprising a plurality of wafer level burn-in devices according to any of claims 10 to 11.
13. A wafer level burn-in system comprising a wafer level loading and unloading apparatus, a wafer level transport apparatus, and a wafer level burn-in apparatus as claimed in claim 12.

Description

Lifting device, wafer-level aging test device, equipment and system Technical Field The present utility model relates to the field of semiconductor devices, and in particular, to a lifting device, a wafer level burn-in test device, a device, and a system. Background In the existing wafer-level burn-in test equipment, a test cavity is formed by clamping a probe plate assembly positioned above and a heat sink assembly positioned below, inert gas is introduced into the test cavity between the probe plate assembly and the heat sink assembly to form a high-pressure test environment, so that the wafer burn-in test under the conditions of high temperature and high pressure is realized, and under the conditions of high pressure, the probe plate assembly bears larger pressure due to the upward action of the high-pressure gas, and the heat sink assembly also bears larger pressure due to the downward action of the high-pressure gas. The existing lifting structure is arranged below the heat sink assembly and is matched with the probe plate assembly in a lifting manner by driving the heat sink assembly, but the whole moving platform part carrying the heat sink assembly to move is more, the lifting structure bears high pressure, the operation is unstable when the heat sink assembly is driven to lift and clamp the dies, the noise is large, the alignment precision when the test cavity is formed by clamping the probe plate assembly and the heat sink assembly is greatly reduced, and the high pressure gas can further bring higher pressure in the wafer aging test process, so that the existing lifting structure is difficult to bear the high pressure required by the wafer-level aging test equipment, the position offset is easy to occur between the heat sink assembly and the probe plate assembly, and the operation precision, the operation stability and the safety of the whole equipment are not facilitated. Disclosure of utility model Aiming at the problems in the prior art, the utility model provides a lifting device, a wafer-level aging test device, equipment and a system, wherein the technical scheme is as follows: The utility model provides a lifting device which is used for a wafer-level aging test device, and comprises a heat sink assembly and a probe board assembly, wherein the lifting device comprises at least two lifting assemblies, a bearing platform and a bottom plate, the bearing platform is used for bearing the heat sink assembly and is fixed in longitudinal position, and the bottom plate is provided with at least two supporting positions which are distributed; The lifting assembly comprises a connecting piece and moving pieces which are movably connected, the connecting piece is fixedly connected with the supporting position, the moving pieces are fixedly connected with the probe board assembly, and each moving piece can cooperatively drive the probe board assembly to move towards the heat sink assembly so as to form a wafer aging test cavity through die assembly. Further, the lifting assembly further comprises a driving device and a screw rod, the driving device is in driving connection with the screw rod, the screw rod is in transmission connection with the moving piece, the screw rod is vertically arranged, and under the condition that the driving device drives the screw rod to rotate, the moving piece and the probe board assembly can be driven to translate along the screw rod. Further, the moving part comprises a first connecting part, the first connecting part is sleeved on the screw rod, the screw rod is provided with external threads, the first connecting part is provided with internal threads, and the screw rod is in threaded connection with the first connecting part. Further, one of the connecting piece and the moving piece is provided with a sliding block, the other is provided with a linear guide rail which is in sliding connection with the sliding block, the sliding block slides relative to the linear guide rail, and the moving piece can be limited to cooperate with the lifting direction of the probe board assembly. Further, the probe plate assembly clamping device further comprises a plurality of limiting pieces, wherein the limiting pieces are located on the bearing platform, and the limiting pieces can be abutted with one side, facing the bearing platform, of the probe plate assembly under the condition that the heat sink assembly and the probe plate assembly are clamped. Further, the probe card assembly comprises a pressure sensing element, wherein the pressure sensing element is used for detecting the pressure between the probe card assembly and the bearing platform in the lifting process of the moving part; The pressure sensing element can be located on a side of the probe card assembly facing the loadbearing platform or the pressure sensing element can be located on a side of the loadbearing platform facing the probe card assembly. Further, the device also comprises a first moving assembly and a se