CN-224226173-U - Wafer transportation equipment and wafer aging test system

CN224226173UCN 224226173 UCN224226173 UCN 224226173UCN-224226173-U

Abstract

The utility model discloses wafer conveying equipment and a wafer aging test system, wherein the wafer conveying equipment comprises at least two wafer conveying boxes which are sequentially connected, each wafer conveying box comprises a first fixing piece and a moving mechanism, the moving mechanism is arranged on the first fixing piece and extends in the horizontal direction, the moving mechanisms of the two adjacent wafer conveying boxes are connected, a wafer conveying device is connected with the moving mechanisms in a sliding mode and used for sliding on the moving mechanisms to achieve wafer conveying, and a leveling assembly is arranged on each first fixing piece and used for leveling the corresponding first fixing piece so as to enable the moving mechanisms of the two adjacent wafer conveying boxes to be aligned. The utility model can realize high-precision splicing between the moving mechanisms of two adjacent wafer transport boxes and improve the precision and stability of long-distance wafer transport.

Inventors

MA ZHAO
WANG YONG
XU PENGSONG
YANG MINFENG

Assignees

苏州联讯仪器股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250427

Claims (11)

1. A wafer transport apparatus, characterized in that the wafer transport apparatus comprises: Each wafer transport box comprises a first fixing piece and a moving mechanism, the moving mechanisms are arranged on the first fixing pieces, the moving mechanisms extend along the horizontal direction, and the moving mechanisms of the two adjacent wafer transport boxes are connected; The wafer conveying device is connected with the moving mechanisms in a sliding manner and is used for sliding on each moving mechanism to realize the wafer conveying; And the leveling assembly is arranged on each first fixing piece and used for leveling the corresponding first fixing piece so as to align the moving mechanisms of the two adjacent wafer transport boxes.
2. The wafer transport apparatus of claim 1, wherein the leveling assembly comprises a first horizontal leveling assembly, a second horizontal leveling assembly, and a vertical leveling assembly, the movement mechanism is disposed on one side of the first fixture, the first horizontal leveling assembly and the second horizontal leveling assembly are disposed on the other side of the first fixture, and the vertical leveling assembly is disposed at a bottom of the first fixture; The first horizontal leveling assembly is used for leveling the first fixing piece in the extending direction of the moving mechanism so as to align the moving mechanisms of two adjacent wafer transport cases; The second horizontal leveling assembly is used for leveling the first fixing piece in the direction perpendicular to the side face of the first fixing piece so as to align the moving mechanisms of the two adjacently arranged wafer transport cases; The vertical leveling assembly is used for leveling the first fixing piece in a direction parallel to the side face of the first fixing piece so as to align the moving mechanisms of the two adjacent wafer transport casings.
3. The wafer transport apparatus of claim 2, wherein the first horizontal leveling assembly comprises a first leveling member and a second leveling member, the other side of the first securing member being provided with a second securing member in parallel, the second securing member being smaller in size than the first securing member; The second leveling piece is arranged on the second fixing piece, the first leveling piece is arranged on the first fixing piece, and the first leveling piece and the second leveling piece are oppositely arranged.
4. The wafer transport apparatus of claim 2, wherein a third mount is disposed in parallel on the other side of the first mount, the third mount being smaller in size than the first mount, the second horizontal leveling assembly being disposed on the third mount, the second horizontal leveling assembly including at least four leveling screws.
5. The wafer transport apparatus of claim 1, further comprising a first connection structure that spans a first mount of two adjacently disposed wafer transport pods to connect them.
6. The wafer transport apparatus of claim 1, further comprising a second connection structure, each of the wafer transport pods further comprising a housing, the first fixture, the moving mechanism, and the wafer transport device each being disposed within the housing, the housings of two adjacently disposed wafer transport pods being connected by the second connection structure.
7. The wafer transport apparatus of claim 6, wherein the second connection structure comprises a first sub-connection structure and a second sub-connection structure, the first sub-connection structure and the second sub-connection structure being disposed on housings of two of the wafer transport pods disposed adjacently, respectively; The first sub-connecting structure and the second sub-connecting structure are spliced to enable the shells of two adjacently arranged wafer transport boxes to be connected.
8. The wafer transport apparatus according to any one of claims 1 to 7, further comprising leveling detection means for detecting whether leveling alignment is provided between the moving mechanisms of two of the wafer transport pods disposed adjacently.
9. The wafer transport apparatus according to any one of claims 1 to 7, wherein the moving mechanism includes a first guide extending in a horizontal direction and a first driving mechanism connected between the first guides of two of the wafer transport casings disposed adjacently, the first driving mechanism being drivingly connected to the wafer transport device, the wafer transport device being slidably connected to the first guide, the first driving mechanism being configured to drive the wafer transport device to move horizontally along the first guide.
10. The wafer transport apparatus of any one of claims 1 to 7, wherein the wafer transport device comprises a wafer pick-and-place device and a lifting mechanism, the lifting mechanism and the moving mechanism being slidably connected, the wafer pick-and-place device and the lifting mechanism being slidably connected; The lifting mechanism is used for enabling the wafer taking and discharging device to move vertically, the moving mechanism is used for enabling the lifting mechanism to move horizontally in the at least two wafer conveying boxes so as to achieve wafer conveying, and the wafer taking and discharging device is used for executing the loading and unloading operation of the wafers.
11. A wafer burn-in system comprising a wafer transport apparatus according to any one of claims 1 to 10.

Description

Wafer transportation equipment and wafer aging test system Technical Field The present utility model relates to the field of wafer testing technologies, and in particular, to a wafer transportation device and a wafer burn-in system. Background In the semiconductor wafer test process, in order to realize automatic test, wafer transportation work is generally performed by a transportation device, and in the case of transporting a wafer over a long distance, a plurality of transportation devices are required to be connected. In order to be able to achieve a smooth transport of wafers over long distances in a plurality of connected transport devices, the accuracy and stability of the connection between the plurality of transport devices is particularly important. Disclosure of utility model In order to solve the above problems in the prior art, the utility model discloses a wafer transportation device and a wafer aging test system, which can realize high-precision splicing between moving mechanisms of two adjacent wafer transportation boxes and improve the precision and stability of long-distance wafer transportation. The technical scheme disclosed by the utility model is as follows: The present utility model provides a wafer transport apparatus including: Each wafer transport box comprises a first fixing piece and a moving mechanism, the moving mechanisms are arranged on the first fixing pieces, the moving mechanisms extend along the horizontal direction, and the moving mechanisms of the two adjacent wafer transport boxes are connected; The wafer conveying device is connected with the moving mechanisms in a sliding manner and is used for sliding on each moving mechanism to realize the wafer conveying; And the leveling assembly is arranged on each first fixing piece and used for leveling the corresponding first fixing piece so as to align the moving mechanisms of the two adjacent wafer transport boxes. Optionally, the leveling assembly includes a first horizontal leveling assembly, a second horizontal leveling assembly and a vertical leveling assembly, the moving mechanism is arranged at one side of the first fixing piece, the first horizontal leveling assembly and the second horizontal leveling assembly are arranged at the other side of the first fixing piece, and the vertical leveling assembly is arranged at the bottom of the first fixing piece; The first horizontal leveling assembly is used for leveling the first fixing piece in the extending direction of the moving mechanism so as to align the moving mechanisms of two adjacent wafer transport cases; The second horizontal leveling assembly is used for leveling the first fixing piece in the direction perpendicular to the side face of the first fixing piece so as to align the moving mechanisms of the two adjacently arranged wafer transport cases; The vertical leveling assembly is used for leveling the first fixing piece in a direction parallel to the side face of the first fixing piece so as to align the moving mechanisms of the two adjacent wafer transport casings. Optionally, the first horizontal leveling component comprises a first leveling piece and a second leveling piece, a second fixing piece is arranged on the other side of the first fixing piece in parallel, and the size of the second fixing piece is smaller than that of the first fixing piece; The second leveling piece is arranged on the second fixing piece, the first leveling piece is arranged on the first fixing piece, and the first leveling piece and the second leveling piece are oppositely arranged. Optionally, a third fixing piece is arranged on the other side of the first fixing piece in parallel, the size of the third fixing piece is smaller than that of the first fixing piece, the second horizontal leveling assembly is arranged on the third fixing piece, and the second horizontal leveling assembly comprises at least four leveling screws. Optionally, the wafer transport apparatus further includes a first connection structure that spans the first fixing members of the two wafer transport pods disposed adjacently to connect them. Optionally, the wafer transportation device further includes a second connection structure, each wafer transportation box further includes a housing, the first fixing piece, the moving mechanism and the wafer transportation device are all disposed in the housing, and two adjacent housings of the wafer transportation boxes are connected through the second connection structure. Optionally, the second connection structure includes a first sub-connection structure and a second sub-connection structure, where the first sub-connection structure and the second sub-connection structure are respectively disposed on the shells of the two wafer transport pods that are adjacently disposed; The first sub-connecting structure and the second sub-connecting structure are spliced to enable the shells of two adjacently arranged wafer transport boxes to be connected. Optionally, the wafer