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CN-224226936-U - Ultrathin conductive adhesive tape with exhaust function

CN224226936UCN 224226936 UCN224226936 UCN 224226936UCN-224226936-U

Abstract

The utility model discloses an ultrathin conductive adhesive with an exhaust function, which relates to the field of conductive adhesive, and comprises a conductive adhesive body, wherein the conductive adhesive body comprises a black double-sided adhesive, an omnibearing conductive double-sided adhesive and an antistatic ionization film, and the black double-sided adhesive comprises a surface layer, a bottom layer, a polyester release film, an acrylic adhesive layer, a bionic spider-web structure aramid nanofiber, a photoinitiating layer, a temperature control adhesive layer and a reversible Diels-Alder bond layer. According to the ultrathin conductive adhesive tape with the exhaust function, through the cooperative design of the honeycomb microstructure conductive base material and the low-viscosity conductive filler, the conductive adhesive tape body can form a directional air guide channel in the attaching process, so that the bubble residual rate can be reduced, the conductive adhesive tape body can be suitable for curved surfaces and special-shaped structures, the attaching yield can be effectively improved, the shearing strength of the conductive adhesive tape body can be improved through the arranged graphene reinforced composite adhesive layer, and the reliability requirement of outdoor equipment in high-latitude areas can be met.

Inventors

  • YIN GUOYUAN

Assignees

  • 苏州佳值电子工业有限公司

Dates

Publication Date
20260512
Application Date
20250414

Claims (9)

  1. 1. An ultrathin conductive adhesive tape with an exhaust function comprises a conductive adhesive tape body (1), and is characterized in that the conductive adhesive tape body (1) comprises a black double-sided adhesive tape (2), an omnibearing conductive double-sided adhesive tape (3) and an antistatic film (4); The black double-sided adhesive tape (2) comprises a surface layer (15), a bottom layer (16), a polyester release film (17), an acrylic adhesive layer (18), bionic cobweb structure aramid nanofibers (20), a photoinitiation layer (21), a temperature control adhesive layer (22) and a reversible Diels-Alder bond layer (23); The omnibearing conductive double-sided adhesive (3) comprises a honeycomb microstructure conductive substrate (9), a low-viscosity conductive filler (10), a graphene reinforced composite adhesive layer (11), a flexible supporting layer (12), a thermal response self-repairing adhesive (13) and an intelligent conductive monitoring module (14); The antistatic release film (4) comprises a release agent (5), a first antistatic coating (6), a PET substrate (7) and a second antistatic coating (8).
  2. 2. The ultrathin conductive adhesive with an exhaust function according to claim 1, wherein the outer part of the bottom layer (16) is arranged at a polyester release film (17), the polyester release film (17) is arranged at a bionic spider-web structure aramid nanofiber (20), the bionic spider-web structure aramid nanofiber (20) is arranged at a photoinitiating layer (21), the temperature control adhesive layer (22) is arranged at the photoinitiating layer (21), the reversible Diels-Alder bond layer (23) is arranged at the temperature control adhesive layer (22), the acrylic adhesive layer (18) is arranged at the reversible Diels-Alder bond layer (23), and the surface layer (15) is arranged at the acrylic adhesive layer (18).
  3. 3. The ultrathin conductive adhesive tape with the exhaust function according to claim 2, wherein the surface layer (15) is low-viscosity acrylic acid and contains glass bead placeholders, the bottom layer (16) is high-viscosity crosslinked acrylic acid, and a V-shaped groove (19) is formed in the polyester release film (17).
  4. 4. The ultrathin conductive adhesive with the exhaust function according to claim 2, wherein the bionic cobweb-structured aramid nanofiber (20) is used for improving creep resistance of the conductive adhesive body (1), the temperature control adhesive layer (22) is a paraffin-based phase change microcapsule and is used for absorbing heat at a high temperature to prevent the conductive adhesive body (1) from softening, releasing heat at a low temperature to accelerate curing of the conductive adhesive body (1), and the reversible Diels-Alder bond layer (23) is used for achieving residue-free debonding after the conductive adhesive body (1) is heated.
  5. 5. The ultrathin conductive adhesive patch with an exhaust function according to claim 1, wherein the honeycomb-shaped microstructure conductive substrate (9) is etched at a low-viscosity conductive filler (10) through laser, the graphene reinforced composite adhesive layer (11) is installed at the low-viscosity conductive filler (10), the flexible supporting layer (12) is installed at the graphene reinforced composite adhesive layer (11), the thermal response self-repairing adhesive (13) is installed at the flexible supporting layer (12), and the intelligent conductive monitoring module (14) is installed at the thermal response self-repairing adhesive (13).
  6. 6. The ultrathin conductive adhesive with an exhaust function according to claim 5, wherein the honeycomb-like microstructure conductive substrate (9) is used for accelerating air bubble exhaust through a physical air guide structure, and the low-viscosity conductive filler (10) comprises an acrylic adhesive and a low-viscosity silver nanowire conductive filler and is used for reducing the viscosity of the graphene reinforced composite adhesive layer (11) and improving the fluidity during pressurization.
  7. 7. The ultrathin conductive adhesive with the exhaust function according to claim 6, wherein the graphene reinforced composite adhesive layer (11) is used for improving the shearing strength of the conductive adhesive body (1), the flexible supporting layer (12) is a flexible polyimide supporting layer and used for dispersing stress concentration, the thermal response self-repairing adhesive (13) is thermal response acrylic resin containing dynamic disulfide bonds and used for realizing micro crack self-repairing when the temperature is improved, and the intelligent conductive monitoring module (14) is a printing and thermal response self-repairing adhesive (13) position resistance sensor and used for monitoring the resistance change of the conductive adhesive body (1) in real time and early warning the connection failure of the conductive adhesive body (1).
  8. 8. The ultrathin conductive adhesive patch with an exhaust function according to claim 1, wherein the release agent (5) is arranged at the first antistatic coating (6), the PET substrate (7) is arranged at the first antistatic coating (6), and the second antistatic coating (8) is arranged at the PET substrate (7).
  9. 9. The ultrathin conductive adhesive with the exhaust function according to claim 8, wherein the release agent (5) is one of a fluorine modified organosilicon release agent, a conductive carbon doped release agent and a photo-thermal response release agent, the first antistatic coating (6) and the second antistatic coating (8) are one of a PEDOT (polyethylene terephthalate) aqueous coating, an ITO (indium tin oxide) nanowire coating and a carbon nano tube/polyurethane composite layer, and the PET substrate (7) is one of a copper nickel alloy coating, a carbon black/silicon dioxide composite master batch layer and a PET microporous membrane.

Description

Ultrathin conductive adhesive tape with exhaust function Technical Field The utility model relates to the field of conductive adhesive tapes, in particular to an ultrathin conductive adhesive tape with an exhaust function. Background The conductive adhesive is an adhesive with certain conductivity after solidification or drying, can connect various conductive materials together to form an electric path between the connected materials, is an indispensable new material in the electronic industry, has various varieties, can be divided into two types of general conductive adhesive and special conductive adhesive from the application angle, has certain requirements on the conductivity and bonding strength of the conductive adhesive, has certain special requirements on the conductivity and bonding strength, such as high temperature resistance, ultralow temperature resistance, instant solidification, anisotropy, transparency and the like, and can be divided into silver conductive adhesive, gold conductive adhesive, copper conductive adhesive, carbon conductive adhesive and the like according to the variety of conductive particles in the conductive adhesive, and the most widely applied is silver conductive adhesive. Traditional conductive adhesive tape can be because of the unsmooth bubble residue that leads to of exhaust when using for contact resistance can appear undulantly, and under dynamic vibration environment, the glue film microcrack leads to the resistance value drift along with time, and its shear strength can not obtain guaranteeing, can lead to the residue increase from the type membrane when high temperature, initiates the pollution of glue film, and after conductive adhesive tape dismantles, the easy residue that appears can damage microelement, still can appear static absorption dust simultaneously and lead to the problem that equipment fault rate risees after the maintenance. Therefore, it is necessary to provide an ultra-thin conductive paste with an exhaust function to solve the above problems. Disclosure of utility model The utility model mainly aims to provide an ultrathin conductive adhesive tape with an exhaust function, which can effectively solve the problems in the background technology. In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: An ultrathin conductive adhesive tape with an exhaust function comprises a conductive adhesive tape body, wherein the conductive adhesive tape body comprises black double-sided adhesive tape, omnibearing conductive double-sided adhesive tape and an antistatic release film; the black double-sided adhesive comprises a surface layer, a bottom layer, a polyester release film, an acrylic adhesive layer, bionic cobweb structure aramid nanofibers, a photoinitiation layer, a temperature control adhesive layer and a reversible Diels-Alder bond layer; The omnibearing conductive double-sided adhesive comprises a honeycomb microstructure conductive substrate, a low-viscosity conductive filler, a graphene reinforced composite adhesive layer, a flexible supporting layer, a thermal response self-repairing adhesive and an intelligent conductive monitoring module; The antistatic release film comprises a release agent, a first antistatic coating, a PET substrate and a second antistatic coating. Preferably, the outside of bottom is installed in polyester release film department, polyester release film installs in bionical spider's web structure aramid nanofiber department, bionical spider's web structure aramid nanofiber installs in photoinitiated layer department, temperature control glue film installs in photoinitiated layer department, reversible Diels-Alder bond layer installs in temperature control glue film department, acrylic acid glue film installs in reversible Diels-Alder bond layer department, the top layer is installed in acrylic acid glue film department. Preferably, the surface layer is low-viscosity acrylic acid and contains glass bead placer, the bottom layer is high-viscosity cross-linked acrylic acid, and the polyester release film is provided with V-shaped grooves. Preferably, the bionic cobweb-structured aramid nanofiber is used for improving creep resistance of the conductive adhesive body, the temperature control adhesive layer is paraffin-based phase change microcapsules and is used for absorbing heat at high temperature to prevent the conductive adhesive body from softening and releasing heat at low temperature to accelerate curing of the conductive adhesive body, and the reversible Diels-Alder bond layer is used for achieving residue-free debonding after heating the conductive adhesive body. Preferably, the honeycomb microstructure conductive substrate is etched at the low-viscosity conductive filler by laser, and the graphene reinforced composite glue layer is mounted at the low-viscosity conductive filler. The flexible supporting layer is arranged at the graphene reinforced composite adhesive lay