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CN-224227183-U - Magnetron sputtering coating and plasma nitriding integrated device

CN224227183UCN 224227183 UCN224227183 UCN 224227183UCN-224227183-U

Abstract

The utility model relates to the technical field of vacuum coating equipment, in particular to a magnetron sputtering coating and plasma nitriding integrated device which comprises a vacuum chamber, a workpiece rotating frame arranged in the vacuum chamber, a magnetron sputtering component and a plasma nitriding component, wherein the magnetron sputtering component is arranged on the side wall of the vacuum chamber and faces the workpiece rotating frame, the plasma nitriding component comprises a filament ionization source and an auxiliary anode which are oppositely arranged in the vertical direction, the filament ionization source is arranged at the top of the vacuum chamber, the auxiliary anode is arranged at the bottom of the vacuum chamber, the workpiece rotating frame is positioned between the filament ionization source and the auxiliary anode, and the workpiece rotating frame can be used as a cathode to form a glow discharge loop in a matched mode with the auxiliary anode.

Inventors

  • QIU LE
  • CHEN JIALE
  • YUAN ZHEYU
  • LI HAOJIE
  • FANG TIEHUI
  • LANG WENCHANG
  • YIN CHAOCHAO

Assignees

  • 温州大学

Dates

Publication Date
20260512
Application Date
20260415

Claims (10)

  1. 1. The magnetron sputtering coating and plasma nitriding integrated device is characterized by comprising a vacuum chamber (1), a workpiece rotating frame (5), a magnetron sputtering component (2) and a plasma nitriding component, wherein the workpiece rotating frame (5), the magnetron sputtering component (2) and the plasma nitriding component are arranged in the vacuum chamber (1), the magnetron sputtering component (2) is arranged on the side wall of the vacuum chamber (1), the magnetron sputtering component (2) faces the workpiece rotating frame (5), the plasma nitriding component comprises a filament ionization source (3) and an auxiliary anode (31) which are oppositely arranged in the vertical direction, the filament ionization source (3) is arranged at the top of the vacuum chamber (1), the auxiliary anode (31) is arranged at the bottom of the vacuum chamber (1), the workpiece rotating frame (5) is arranged between the filament ionization source (3) and the auxiliary anode (31), and the workpiece rotating frame (5) can be used as a cathode to be matched with the auxiliary anode (31) to form a glow discharge loop.
  2. 2. The magnetron sputtering coating and plasma nitriding integrated device according to claim 1, wherein the magnetron sputtering assembly (2) comprises a target (21), a target fixing plate (22), a magnetron layer (24) and a magnetron sputtering assembly water-cooling disc (23), the target fixing plate (22) is fixed on the side wall of the vacuum chamber (1), the target (21) is arranged on one side, facing the inside of the vacuum chamber (1), of the target fixing plate (22), the magnetron layer (24) is arranged on one side, facing away from the target (21), of the target fixing plate (22), and the magnetron sputtering assembly water-cooling disc (23) is covered on the outer side, facing away from the target fixing plate (22), of the magnetron layer (24).
  3. 3. The magnetron sputtering coating and plasma nitriding integrated device according to claim 2, wherein a plurality of groups of permanent magnets are packaged in the magnetron layer (24), and a cooling water circulation interface is arranged on the magnetron sputtering assembly water-cooled disc (23).
  4. 4. The magnetron sputtering coating and plasma nitriding integrated device according to claim 1, wherein the filament ionization source (3) comprises a ventilation device (301), a filament ionization source water-cooled disc (302) and a filament (303), the filament ionization source water-cooled disc (302) is fixed on the top inner wall of the vacuum chamber (1), the ventilation device (301) is connected with the filament (303) through the filament ionization source water-cooled disc (302), and the filament (303) is installed on one side, facing the inside of the vacuum chamber (1), of the filament ionization source water-cooled disc (302).
  5. 5. The magnetron sputtering coating and plasma nitriding integrated device according to claim 1, wherein the auxiliary anode (31) comprises an auxiliary anode water cooling disc (305), an anode emission source (304) and an auxiliary anode water cooling and power supply integrated box (32), the auxiliary anode water cooling disc (305) is fixed at the bottom of the vacuum chamber (1), the anode emission source (304) is arranged on the auxiliary anode water cooling disc (305), and the auxiliary anode water cooling and power supply integrated box (32) is arranged outside the vacuum chamber (1) and penetrates through the bottom wall of the vacuum chamber (1) to be connected with the auxiliary anode water cooling disc (305).
  6. 6. The magnetron sputtering coating and plasma nitriding integrated device according to claim 1, wherein an opening is formed in at least one side of the vacuum chamber (1), the vacuum chamber (1) is further rotatably connected with a vacuum chamber side door (11) through a hinge (12), and the vacuum chamber side door (11) can rotate relative to the vacuum chamber (1) to close or open the opening.
  7. 7. The magnetron sputtering coating and plasma nitriding integrated device according to claim 6, wherein the magnetron sputtering component (2) is fixedly arranged on a side wall surface of the side door (11) of the vacuum chamber facing the inside of the vacuum chamber (1), and the filament ionization source (3) and the auxiliary anode (31) are oppositely arranged at the top and the bottom of the inner side of the side door (11) of the vacuum chamber.
  8. 8. The magnetron sputtering coating and plasma nitriding integrated device according to claim 1, wherein the workpiece rotating frame (5) is vertically arranged at the center of the vacuum chamber (1), a rotary driving mechanism is connected to the bottom of the workpiece rotating frame (5), and a conductive interface for connecting a negative bias power supply is arranged on the workpiece rotating frame (5).
  9. 9. The magnetron sputtering coating and plasma nitriding integrated device according to any one of claims 1 to 8, wherein heating assemblies (4) are fixedly arranged on the inner wall surface of the vacuum chamber (1), and the heating assemblies (4) are distributed along the circumferential direction of the vacuum chamber (1).
  10. 10. The magnetron sputtering coating and plasma nitriding integrated device according to claim 5, wherein the auxiliary anode water-cooled disc (305) is detachably connected with a protective cover (306) which is covered around the anode emission source (304), at least one sliding block (307) is protruded on the inner wall of the protective cover (306), at least one sliding groove (308) and an in-out groove (309) communicated with the sliding groove (308) are recessed on the outer wall of the auxiliary anode water-cooled disc (305), the depth of one end of the sliding groove (308) far away from the in-out groove (309) is smaller than the depth of one end close to the in-out groove (309), the sliding block (307) slides into or slides out of the sliding groove (308) along the in-out groove (309), a limiting block (310) is further arranged on the inner wall of the in-out groove (309), and guide inclined planes (311) are respectively arranged on the side walls of the upper side and the lower side of the limiting block (310).

Description

Magnetron sputtering coating and plasma nitriding integrated device Technical Field The utility model relates to the technical field of vacuum coating equipment, in particular to a magnetron sputtering coating and plasma nitriding integrated device. Background In the modern industry, the surface performance requirements of metal parts are increasingly improved, and the single nitriding treatment or coating treatment is difficult to meet the comprehensive requirements of high wear resistance, high corrosion resistance, high bonding strength and the like. The nitriding treatment can form a hardening layer on the surface of the workpiece, so that the hardness and fatigue strength of the substrate are improved, but the surface corrosion resistance is relatively limited, and the magnetron sputtering coating can deposit various functional films, so that the wear resistance, corrosion resistance and special functional characteristics of the surface are obviously improved. In order to obtain more excellent composite performance, a composite process route of firstly carrying out plasma nitriding and then depositing a coating film or firstly depositing a coating film and then carrying out plasma nitriding is often adopted in practice. However, in the conventional production mode, the two processes are required to be completed in a nitriding device and a coating device respectively, and the workpiece must be taken out of the device, transferred and reloaded into another device after the previous process is completed. The process not only results in low production efficiency and increased labor cost, but also has the important effect that the surface of the workpiece is oxidized or polluted when the workpiece is exposed to the atmospheric environment, so that the quality of the subsequent process and the bonding strength between the final film layer and the substrate are seriously affected. Especially when the conversion of nitriding before plating or plating before nitriding is carried out, the new process chamber is required to be vacuumized again, so that time and energy are consumed, and uncertainty and quality risks of process connection are increased. Therefore, the prior art lacks an integrated device capable of continuously completing two processes of plasma nitriding and magnetron sputtering coating without breaking vacuum and without transferring a workpiece. The method becomes a key bottleneck for restricting the popularization and application of the high-efficiency and high-quality composite surface treatment technology. The device which has compact structure, is simple and convenient to operate and can realize the integrated continuous operation of the two processes is developed, and has important practical significance for improving the treatment efficiency, guaranteeing the binding force of the film layer and reducing the production cost. Disclosure of utility model The utility model aims to overcome the defects and the shortcomings of the prior art and provide a magnetron sputtering coating and plasma nitriding integrated device, the utility model integrates the magnetron sputtering and the plasma nitriding functions in the same vacuum chamber, thereby remarkably improving the treatment efficiency and the film bonding force. The technical scheme includes that the magnetron sputtering coating and plasma nitriding integrated device comprises a vacuum chamber, a workpiece rotating frame, a magnetron sputtering component and a plasma nitriding component, wherein the workpiece rotating frame, the magnetron sputtering component and the plasma nitriding component are arranged in the vacuum chamber, the magnetron sputtering component is arranged on the side wall of the vacuum chamber, the magnetron sputtering component faces the workpiece rotating frame, the plasma nitriding component comprises a filament ionization source and an auxiliary anode which are oppositely arranged in the vertical direction, the filament ionization source is arranged at the top of the vacuum chamber, the auxiliary anode is arranged at the bottom of the vacuum chamber, the workpiece rotating frame is positioned between the filament ionization source and the auxiliary anode, and the workpiece rotating frame can serve as a cathode to be matched with the auxiliary anode to form a glow discharge loop. The magnetron sputtering assembly comprises a target, a target fixing plate, a magnetron layer and a magnetron sputtering assembly water-cooled disk, wherein the target fixing plate is fixed on the side wall of the vacuum chamber, the target is arranged on one side of the target fixing plate facing the inside of the vacuum chamber, the magnetron layer is arranged on one side of the target fixing plate facing away from the target, and the magnetron sputtering assembly water-cooled disk is covered on the outer side of the magnetron layer facing away from the target fixing plate. And a plurality of groups of permanent magnets are packaged in the