CN-224227184-U - Wafer bearing device

CN224227184UCN 224227184 UCN224227184 UCN 224227184UCN-224227184-U

Abstract

The utility model discloses a wafer bearing device which comprises a heating disc, magnetic fluid, a lifting mechanism and a rotating mechanism, wherein the heating disc is connected with the magnetic fluid, the lifting mechanism and the rotating mechanism are connected with the magnetic fluid, and the lifting mechanism and the rotating mechanism drive the heating disc to lift and rotate through the magnetic fluid. The wafer bearing device provided by the utility model can drive the heating plate to rise and fall in height and rotate through the lifting mechanism and the rotating mechanism, thereby being beneficial to the quality improvement of the wafer surface film deposition process.

Inventors

CHEN ZHE
ZHAO XUE
WU CHUNMU
LI LIN
CHEN LIPING

Assignees

青岛思锐智能科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250228

Claims (5)

1. The wafer bearing device is characterized by comprising a heating disc, magnetic fluid, a lifting mechanism and a rotating mechanism, wherein the heating disc is connected with the magnetic fluid, The heating plate comprises a plate body and a support column, wherein an air flow channel is arranged in the plate body, a plurality of outlets are formed on the side peripheral wall of the plate body by the air flow channel, a gas blowing hole is formed in the support column, the gas blowing hole is communicated with the air flow channel, The support column is connected with the main shaft of the magnetic fluid, the support column is coaxially arranged with the main shaft, an air blowing channel is formed in the main shaft, the air blowing channel is communicated with the air blowing hole, An air suction channel is arranged in the main shaft, an air suction hole is arranged in the supporting column, a plurality of adsorption holes are formed on the bearing surface of the tray body, the adsorption holes are communicated with the air suction hole, the air suction hole is communicated with the air suction channel, The lifting mechanism and the rotating mechanism are connected with the magnetic fluid, and the lifting mechanism and the rotating mechanism drive the heating plate to lift and rotate through the magnetic fluid.
2. The wafer carrier of claim 1, wherein the lifting mechanism comprises an electric cylinder and a moving block, the moving block being coupled to the electric cylinder, the electric cylinder driving the moving block to lift.
3. The wafer carrier of claim 2, wherein an adjustment assembly is disposed on the moving block, the adjustment assembly being coupled to the magnetic fluid, the adjustment assembly being configured to adjust the magnetic fluid level.
4. The wafer carrier apparatus of claim 2, wherein the rotation mechanism comprises a gear motor coupled to a spindle of the magnetic fluid.
5. The wafer carrier of claim 1, wherein the tray body is provided with a heating wire therein, the support column is provided with a wiring hole therein, the spindle of the magnetic fluid is provided with a wiring channel therein, The end part of the main shaft is provided with an electric slip ring, and a power line and a signal line of the heating wire are connected with the electric slip ring.

Description

Wafer bearing device Technical Field The present utility model relates to the field of wafer processing technology, and more particularly, to a wafer carrier. Background In various process steps in the semiconductor manufacturing process (such as photolithography, chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD)), a wafer needs to be heated, and a wafer heating plate is generally used, which plays a critical role in the semiconductor manufacturing process, and its technical indexes and technical support directly affect the stability of the process and the quality of the product. The wafer heating plate is formed by welding a plurality of layers of metal plates or ceramic plates, heating wires or other heating elements are embedded in the wafer heating plate, and the wafer is placed on the surface of the heating plate and heated through heat conduction. The existing wafer heating disc has single function and only has the heating function of the wafer. Disclosure of utility model In order to overcome the defects in the prior art, the utility model innovatively provides a wafer bearing device, which can solve the technical problems in the prior art. In order to achieve the technical aim, the utility model discloses a wafer bearing device which comprises a heating disc, magnetic fluid, a lifting mechanism and a rotating mechanism, wherein the heating disc is connected with the magnetic fluid, The lifting mechanism and the rotating mechanism are connected with the magnetic fluid, and the lifting mechanism and the rotating mechanism drive the heating plate to lift and rotate through the magnetic fluid. Further, the heating plate comprises a plate body and a supporting column, an air flow channel is arranged in the plate body, a plurality of outlets are formed on the side peripheral wall of the plate body in the air flow channel, And a gas blowing hole is formed in the support column and communicated with the gas flow channel. Further, the support column is connected with the main shaft of the magnetic fluid, the support column is coaxially arranged with the main shaft, And an air blowing channel is formed in the main shaft and is communicated with the air blowing hole. Further, an air suction channel is arranged in the main shaft, air suction holes are arranged in the supporting columns, a plurality of adsorption holes are formed in the bearing surface of the tray body, the adsorption holes are communicated with the air suction holes, and the air suction holes are communicated with the air suction channel. Further, the lifting mechanism comprises an electric cylinder and a moving block, wherein the moving block is connected with the electric cylinder, and the electric cylinder drives the moving block to lift. Further, an adjusting component is arranged on the moving block and connected with the magnetic fluid, and the adjusting component is used for adjusting the magnetic fluid level. Further, the rotating mechanism comprises a gear motor, and the gear motor is connected with the main shaft of the magnetic fluid. Further, a heating wire is arranged in the tray body, a wiring hole is formed in the supporting column, a wiring channel is arranged in the main shaft of the magnetic fluid, The end part of the main shaft is provided with an electric slip ring, and a power line and a signal line of the heating wire are connected with the electric slip ring. The beneficial effects of the utility model are as follows: the wafer bearing device provided by the utility model can drive the heating plate to rise and fall in height and rotate through the lifting mechanism and the rotating mechanism, thereby being beneficial to the quality improvement of the wafer surface film deposition process. Drawings FIG. 1 is a schematic view of a wafer carrier according to an embodiment of the present utility model; FIG. 2 is a schematic view showing a partial cross-section of a heating plate and magnetic fluid according to an embodiment of the present utility model; FIG. 3 illustrates a schematic side view of an adjustment assembly in accordance with an embodiment of the present utility model; Fig. 4 shows a schematic bottom view of an adjustment assembly according to an embodiment of the utility model. In the drawing the view of the figure, 1. A heating plate; 11, a disk body, 12, a support column, 2, magnetic fluid, 21, a main shaft, 3, a lifting mechanism, 31, a motor, 32, a lead screw, 33, a moving block, 4, a rotating mechanism, 5, an adjusting assembly, 51, a connecting plate, 52, a side support plate, 53, a fixed plate, 54, a first adjusting plate, 55, a middle plate, 56, a second adjusting plate, 57, a sliding block, 581, a first adjusting bolt, 582, a second adjusting bolt, 59, a magnetic fluid mounting plate, 510, an adjusting screw, 6, an electric slip ring, 7 and a motor mounting seat. Detailed Description The wafer carrying device provided by the utility model is explained and illustrated in detail below with r