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CN-224227199-U - Semiconductor processing equipment

CN224227199UCN 224227199 UCN224227199 UCN 224227199UCN-224227199-U

Abstract

The application provides semiconductor process equipment, which comprises a process box body, a loading and unloading box body positioned below the process box body, a first box body used for accommodating a controller, a second box body used for accommodating an exhaust device and a third box body used for accommodating an air inlet device, wherein the second box body, the third box body and the loading and unloading box body are sequentially arranged along a first horizontal direction, orthographic projections of the second box body and the first box body on the horizontal plane are arranged along a second horizontal direction, and the second horizontal direction is mutually perpendicular to the first horizontal direction.

Inventors

  • HAN XING
  • LI HONGLI
  • CHANG JIANG

Assignees

  • 北京北方华创微电子装备有限公司

Dates

Publication Date
20260512
Application Date
20250520

Claims (10)

  1. 1. The utility model provides a semiconductor process equipment, includes the technology box and is located the loading and unloading box of technology box below, its characterized in that still includes the first box that is used for holding the controller, is used for holding exhaust apparatus's second box and is used for holding air inlet unit's third box, wherein: The second box body, the third box body and the loading and unloading box body are sequentially arranged along the first horizontal direction; The orthographic projection of the second box body and the first box body on the horizontal plane is arranged along a second horizontal direction, and the second horizontal direction is mutually perpendicular to the first horizontal direction.
  2. 2. The semiconductor processing apparatus of claim 1, further comprising a transition box; the transition box body is positioned above the second box body and the third box body, and the transition box body and the process box body are arranged along the first horizontal direction; And a pipeline in the exhaust device and a pipeline in the air inlet device pass through the transition box body and are connected with the process chamber in the process box body.
  3. 3. The semiconductor processing apparatus of claim 2, wherein the transition box has a first sidewall adjacent the process box, the first sidewall having a first opening disposed therein, the conduit in the gas inlet device extending through the first opening to the exterior of the transition box and being connected to the process chamber in the process box; The transition box body is further provided with a second side wall adjacent to the first box body, a second opening is formed in the second side wall, and a pipeline in the exhaust device penetrates through the second opening to extend to the outside of the transition box body and is connected with the process chamber in the process box body.
  4. 4. A semiconductor process plant according to any one of claims 1-3, characterized in that the piping in the exhaust means and the piping in the inlet means are arranged side by side in the second horizontal direction.
  5. 5. The semiconductor processing apparatus of claim 2, further comprising a fourth tank for housing a valve control device, the fourth tank being positioned below the first tank and the fourth tank and the second tank being arranged in the second horizontal direction.
  6. 6. The semiconductor processing apparatus of claim 5, wherein the first enclosure is positioned above the second enclosure.
  7. 7. The semiconductor processing apparatus of claim 5 wherein said process tank, said first tank and said transition tank are two; The semiconductor process equipment further comprises a first maintenance space, wherein the two process boxes are arranged on one side of the first maintenance space in the first horizontal direction side by side, the two first boxes are arranged on the other side of the first maintenance space in the first horizontal direction side by side, and the two transition boxes are symmetrically arranged on two sides of the first maintenance space in the second horizontal direction.
  8. 8. The semiconductor processing apparatus of claim 7, wherein said loading and unloading enclosure, said second enclosure, said third enclosure, and said fourth enclosure are two; The semiconductor process equipment further comprises a second maintenance space, wherein the second maintenance space is located below the first maintenance space and is mutually communicated, the two loading and unloading box bodies are arranged side by side and located below the two process box bodies respectively, the two fourth box bodies are located on one side of the second maintenance space in the first horizontal direction side by side, the two third box bodies are symmetrically located on two sides of the second maintenance space in the second horizontal direction side by side, and the two fourth box bodies are symmetrically located on two sides of the second maintenance space in the second horizontal direction side by side.
  9. 9. The semiconductor processing apparatus of claim 7 wherein two of said first tanks are in communication with each other.
  10. 10. The semiconductor processing apparatus of claim 1, further comprising a wafer transfer enclosure and a wafer containment enclosure, the wafer transfer enclosure being located on a side of the load-and-unload enclosure remote from the third enclosure; The wafer conveying box body is internally provided with a manipulator which is used for conveying wafers between the wafer storage box body and the loading and unloading box body.

Description

Semiconductor processing equipment Technical Field The application relates to the field of semiconductor manufacturing, in particular to semiconductor process equipment. Background In the field of integrated circuit fabrication, semiconductor vertical furnaces, particularly low pressure chemical vapor deposition (Low Pressure ChemicalVapor Deposition, LPCVD) vertical furnaces, are key devices in front-end of line processes for wafer fabrication. The device is mainly used for key process steps such as silicon oxide, polysilicon (Poly), silicon nitride (SiN) and the like, and is important for forming key structures and functional layers in an integrated circuit. As device linewidths continue to shrink, semiconductor process technology is continually innovated, and higher requirements are placed on device performance by the wafer film thickness uniformity, particle level, and other metrics. The existing vertical furnace equipment mainly comprises a process box body with a process chamber, a Load Area (LA) box body arranged below the process box body, and an exhaust box body, an air inlet box body and a controller box body which are sequentially arranged along the horizontal direction far away from the Load Area. The controller comprises a storage part and a control part such as temperature control and vacuum, and is used for realizing control operation of the machine, an air inlet device is arranged in the air inlet box, a pipeline of the air inlet device is connected with the process chamber and is used for meeting the supply requirement of process gas, an air exhaust device is arranged in the air exhaust box, and the pipeline of the air exhaust device extends into the process box from the upper part of the air exhaust box and is connected with an air outlet of the process chamber and is used for rapidly exhausting residual gas in the process chamber. However, the existing vertical furnace equipment has the defects that the overall length of the machine is increased, the occupied space is large, the space utilization efficiency of the equipment is limited, and the wind resistance in a pipeline of an air inlet device is large and the leakage risk exists due to unreasonable layout of an exhaust box body, an air inlet box body and a controller box body. Disclosure of utility model The application aims to at least solve one of the technical problems in the prior art, and provides semiconductor process equipment which can solve the problems of the prior art that the length of a machine is increased, the occupied space is large, the leakage risk exists in a pipeline of an air inlet device and the like. In order to achieve the object of the application, a semiconductor process device is provided, comprising a process box body, a loading and unloading box body positioned below the process box body, a first box body used for accommodating a controller, a second box body used for accommodating an exhaust device and a third box body used for accommodating an air inlet device, wherein: The second box body, the third box body and the loading and unloading box body are sequentially arranged along the first horizontal direction; The orthographic projection of the second box body and the first box body on the horizontal plane is arranged along a second horizontal direction, and the second horizontal direction is mutually perpendicular to the first horizontal direction. In some embodiments, the semiconductor processing apparatus further comprises a transition box, wherein the transition box is positioned above the second box and the third box, and the transition box and the processing box are arranged along the first horizontal direction; And a pipeline in the exhaust device and a pipeline in the air inlet device pass through the transition box body and are connected with the process chamber in the process box body. In some embodiments, the transition box has a first sidewall adjacent to the process box, the first sidewall having a first opening disposed therein through which a conduit in the air inlet device extends to the exterior of the transition box and connects with the process chamber in the process box; The transition box body is further provided with a second side wall adjacent to the first box body, a second opening is formed in the second side wall, and a pipeline in the exhaust device penetrates through the second opening to extend to the outside of the transition box body and is connected with the process chamber in the process box body. In some embodiments, the conduit in the exhaust device is disposed side-by-side with the conduit in the intake device in the second horizontal direction. In some embodiments, the semiconductor processing apparatus further includes a fourth housing for housing a valve control device, the fourth housing being positioned below the first housing, and the fourth housing and the second housing being arranged in the second horizontal direction. In some embodiments, the first tank is loc