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CN-224227203-U - Spray assembly and semiconductor device

CN224227203UCN 224227203 UCN224227203 UCN 224227203UCN-224227203-U

Abstract

The application discloses a spray assembly and semiconductor equipment, and relates to the technical field of semiconductors, wherein the spray assembly comprises a top plate, a spray plate, an air inlet piece and a pre-diffusion piece; the air inlet piece is positioned above the top plate, the pre-diffusion piece is positioned between the top plate and the spray plate, the pre-diffusion piece is limited with a plurality of diffusion holes, and a plurality of air inlet channels are connected between the pre-diffusion piece and the air inlet piece. According to the spray assembly provided by the application, the gas flows into the pre-diffusion piece from the air inlet piece through the air inlet channel to be pre-diffused, so that the space of the gas flowing through the pipeline can be reduced, and the flow speed is improved. Meanwhile, the diffusion holes of the pre-diffusion piece are used for pre-diffusion, so that the uniformity of gas flowing out of the spray plate is improved, and meanwhile, the flow velocity of the gas is considered, so that the process requirement is met.

Inventors

  • SHI SHIJUN
  • CHAI ZHI

Assignees

  • 江苏微导纳米科技股份有限公司

Dates

Publication Date
20260512
Application Date
20250513

Claims (10)

  1. 1. A spray assembly, comprising: A top plate (200); A shower plate (201); an air inlet (100) located above the top plate (200); The pre-diffusion piece (101) is positioned between the top plate (200) and the spraying plate (201), the pre-diffusion piece (101) limits a plurality of diffusion holes (1011), and a plurality of air inlet channels (102) are connected between the pre-diffusion piece (101) and the air inlet piece (100).
  2. 2. The spray assembly of claim 1, wherein the air intake (100) comprises an air intake (1001) and a land (1002), and the land (1002) is in communication with the air intake (1001) and the air intake passage (102), respectively.
  3. 3. The spray assembly of claim 2, wherein each of the air inlet passages (102) is uniformly spaced along a circumference of the connecting disc (1002).
  4. 4. The spray assembly of claim 2, wherein the air inlet channels (102) are disposed obliquely between the land (1002) and the pre-diffuser (101), and the air inlet channels (102) are conically distributed.
  5. 5. The spray assembly of claim 2, wherein the air inlet channel (102) is connected at both ends to the connecting disc (1002) and the edge of the pre-diffuser (101), respectively.
  6. 6. The spray assembly of claim 1, wherein the air intake passage (102) is an elongated structure.
  7. 7. The spray assembly according to claim 1, characterized in that the spray plate (201) is provided with a plurality of spray holes (2011), the diffusion holes (1011) being offset from the spray holes (2011).
  8. 8. The spray assembly of claim 7, wherein the spray holes (2011) have the same density as the diffuser holes (1011), and/or, The aperture of the spray hole (2011) is the same as the aperture of the diffusion hole (1011).
  9. 9. The spray assembly of any one of claims 1-8, wherein the diffuser holes (1011) are distributed in a uniform array on the pre-diffuser (101).
  10. 10. A semiconductor device comprising a shower assembly as claimed in any one of claims 1 to 9.

Description

Spray assembly and semiconductor device Technical Field The application relates to the technical field of semiconductors, in particular to a spraying assembly and semiconductor equipment. Background In the related art, gas generated by chemical sources or reactants enters between a top plate and a spray plate of a spray device after passing through a mixer, and when the gas flows out of the spray plate, the gas diffuses by virtue of the pumping effect of a pumping ring at the edge of a chamber. But the uniformity of the film thickness of the chip is poor because the uniformity of the gas flowing out of the spray plate cannot be ensured. Therefore, how to improve the uniformity of gas diffusion is a technical problem to be solved by those skilled in the art. Disclosure of utility model Accordingly, the present application is directed to a shower assembly for improving uniformity of gas diffusion. Another object of the present application is to provide a semiconductor device having the above-described shower assembly. In order to achieve the above purpose, the present application provides the following technical solutions: A spray assembly, comprising: A top plate; a spray plate; The air inlet piece is positioned above the top plate; The pre-diffusion piece is positioned between the top plate and the spray plate, a plurality of diffusion holes are formed in the pre-diffusion piece in a limiting mode, and a plurality of air inlet channels are connected between the pre-diffusion piece and the air inlet piece. Optionally, in the above spray assembly, the air intake member includes an air intake pipe and a connecting disc, and the connecting disc communicates with the air intake pipe and the air intake passage, respectively. Optionally, in the above spray assembly, each of the air intake passages is uniformly spaced along a circumference of the connection plate. Optionally, in the above spray assembly, the air inlet channels are obliquely arranged between the connecting disc and the pre-diffusion member, and the air inlet channels are distributed in a tapered shape. Optionally, in the above spray assembly, two ends of the air intake passage are connected to the connecting disc and the edge of the pre-diffuser, respectively. Optionally, in the above spray assembly, the air inlet passage is of an elongated structure. Optionally, in the above spraying assembly, the spraying plate is provided with a plurality of spraying holes, and the diffusion holes and the spraying holes are distributed in a dislocation manner. Optionally, in the above spray assembly, the spray holes have the same density as the diffusion holes, and/or, The aperture of the spray hole is the same as that of the diffusion hole. Optionally, in the above spray assembly, the diffusion holes are distributed in a uniform array over the pre-diffuser. A semiconductor device comprising a showerhead assembly according to any of the preceding claims. According to the spray assembly provided by the application, the air inlet piece is arranged above the top plate, the pre-diffusion piece is arranged between the top plate and the spray plate, and the air inlet piece is connected with the pre-diffusion piece through the plurality of air inlet channels, so that air can flow into the pre-diffusion piece through the air inlet channels, be pre-diffused through the diffusion holes and flow out through the spray plate. As can be seen from the above examples, the spray assembly provided by the application can reduce the space of the gas flowing through the pipeline and increase the flow rate by flowing the gas from the gas inlet piece into the pre-diffusion piece through the gas inlet channel for pre-diffusion. Meanwhile, the diffusion holes of the pre-diffusion piece are used for pre-diffusion, so that the uniformity of gas flowing out of the spray plate is improved, and meanwhile, the flow velocity of the gas is considered, so that the process requirement is met. The technical features mentioned above, the technical features to be mentioned below and the technical features shown in the drawings alone may be arbitrarily combined with each other as long as the combined technical features are not contradictory. All possible combinations of features are specifically described herein. Any one of the plurality of sub-features contained in the same sentence may be applied independently, and not necessarily with other sub-features. Drawings In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are only embodiments of the present application, and other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art. Fig. 1 is a schematic structural diagram of a spray assemb