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CN-224227208-U - Wafer film deposition jig

CN224227208UCN 224227208 UCN224227208 UCN 224227208UCN-224227208-U

Abstract

The utility model discloses a wafer film deposition jig, which belongs to the technical field of wafer film deposition and adopts the technical scheme that the wafer film deposition jig comprises a connecting component, a placement component, a deposition box and a sealing door, wherein the connecting component is arranged at the rear side of the deposition box, the placement component is arranged in the deposition box, the sealing door is movably connected at the front side of the deposition box, the connecting component can achieve the effect of injecting reaction gas into the deposition box and can also achieve the effect of monitoring the temperature in the deposition box in real time, and the placement component can achieve the effect of conveniently changing a placement seat with the wafer size by the placement component, so that the adaptability of the device is improved, and the problems that the conventional wafer film deposition jig is in a disc-shaped structure mostly, only can be matched with a wafer with one size, is difficult to replace and has low use adaptability are solved.

Inventors

  • ZHU WEI
  • CUI HAO
  • ZHOU PENGYU

Assignees

  • 睿智鑫半导体科技(无锡)有限公司

Dates

Publication Date
20260512
Application Date
20250609

Claims (8)

  1. 1. The wafer film deposition jig comprises a connecting component (1), a placing component (2), a deposition box (3) and a sealing door (4), and is characterized in that the connecting component (1) is arranged at the rear side of the deposition box (3), the placing component (2) is arranged in the deposition box (3), and the sealing door (4) is movably connected at the front side of the deposition box (3); the connecting assembly (1) comprises a connector (101), a valve body (102), a connecting pipe (103) and a temperature sensor (104), wherein the connector (101) is fixedly connected to the rear side of the valve body (102), the valve body (102) is fixedly connected to the rear side of the connecting pipe (103), the connecting pipe (103) is fixedly connected to the rear side of the deposition box (3), and the temperature sensor (104) is fixedly connected to the left side of the deposition box (3).
  2. 2. The wafer film deposition jig according to claim 1, wherein the placement component (2) comprises a placement box (201), the placement box (201) is movably connected to the inside of the deposition box (3), sliding strips (202) are fixedly connected to two sides of the placement box (201), a fixing plate (203) is fixedly connected to the inside of the placement box (201), and a heating plate (204) is fixedly connected to the top of the fixing plate (203).
  3. 3. The wafer film deposition jig according to claim 2, wherein a connecting seat (205) is fixedly connected to the inner wall of the placement box (201), a clamping ring (206) is clamped at the top of the connecting seat (205), and a lifting block (207) is fixedly connected to the top of the clamping ring (206).
  4. 4. The wafer thin film deposition jig according to claim 3, wherein the inner wall of the clamping ring (206) is fixedly connected with a supporting rod (208), and the inner side of the supporting rod (208) is fixedly connected with a placing seat (209).
  5. 5. The wafer film deposition jig according to claim 3, wherein the top of the connection base (205) is provided with a clamping groove (5), and the inner wall of the clamping groove (5) is clamped with the surface of the clamping ring (206).
  6. 6. The wafer film deposition jig according to claim 2, wherein sliding grooves (6) are formed in two sides of the interior of the deposition box (3), and the inner walls of the sliding grooves (6) are slidably connected with the surface of the sliding strip (202).
  7. 7. The wafer film deposition jig according to claim 1, wherein a fixing hole (7) is formed in the left side of the deposition box (3), and the inner wall of the fixing hole (7) is fixedly connected with the surface of the temperature sensor (104).
  8. 8. The wafer film deposition jig according to claim 1, wherein the rear side of the deposition box (3) is provided with a connecting hole (8), and the inner wall of the connecting hole (8) is fixedly connected with the surface of the connecting pipe (103).

Description

Wafer film deposition jig Technical Field The utility model relates to the technical field of wafer film deposition, in particular to a wafer film deposition jig. Background The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, and after grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer, namely the wafer, and the domestic wafer production line is mainly 8 inches and 12 inches. Most of the conventional wafer film deposition jigs are disc-shaped structures, and grooves on the conventional wafer film deposition jigs are single in size and can only be matched with wafers of one size, and are difficult to replace, so that the adaptability of the conventional wafer film deposition jigs to use is low. To this end, a wafer film deposition jig is provided. Disclosure of utility model The utility model aims to provide a wafer film deposition jig, which can solve the problems that most of the conventional wafer film deposition jigs are disc-shaped structures, grooves on the conventional wafer film deposition jigs are single in size and can only be matched with wafers of one size, and the conventional wafer film deposition jigs are difficult to replace, so that the use adaptability of the conventional wafer film deposition jigs is low. In order to achieve the aim, the utility model provides the technical scheme that the wafer film deposition jig comprises a connecting component, a placing component, a deposition box and a sealing door, wherein the connecting component is arranged at the rear side of the deposition box; The connecting assembly comprises a connector, a valve body, a connecting pipe and a temperature sensor, wherein the connector is fixedly connected to the rear side of the valve body, the valve body is fixedly connected to the rear side of the connecting pipe, the connecting pipe is fixedly connected to the rear side of the deposition box, and the temperature sensor is fixedly connected to the left side of the deposition box. Preferably, the placing component comprises a placing box, the placing box is movably connected in the depositing box, sliding strips are fixedly connected to two sides of the placing box, a fixing plate is fixedly connected to the inside of the placing box, and a heating plate is fixedly connected to the top of the fixing plate. Preferably, the inner wall fixedly connected with connecting seat of placing the box, the top joint of connecting seat has the snap ring, the top fixedly connected with of snap ring carries the piece. Preferably, the inner wall fixedly connected with bracing piece of snap ring, the inboard fixedly connected with of bracing piece places the seat. Preferably, the top of the connecting seat is provided with a clamping groove, and the inner wall of the clamping groove is clamped with the surface of the clamping ring. Preferably, sliding grooves are formed in two sides of the interior of the deposition box, and the inner walls of the sliding grooves are connected with the surfaces of the sliding strips in a sliding manner. Preferably, a fixing hole is formed in the left side of the deposition box, and the inner wall of the fixing hole is fixedly connected with the surface of the temperature sensor. Preferably, a connecting hole is formed in the rear side of the deposition box, and the inner wall of the connecting hole is fixedly connected with the surface of the connecting pipe. Compared with the prior art, the utility model has the beneficial effects that: 1. According to the application, through the arrangement of the connecting component, the connecting component can achieve the effect of injecting the reaction gas into the deposition box, and can also achieve the effect of monitoring the temperature in the deposition box in real time; 2. According to the application, through the arrangement of the placement component, the placement component can achieve the effect of being convenient for changing the placement seat matched with the wafer size, so that the adaptability of the device is improved. Drawings FIG. 1 is an overall block diagram of a wafer thin film deposition tool of the present utility model; FIG. 2 is a schematic perspective view of the connection assembly and placement assembly of the present utility model; FIG. 3 is a schematic perspective view of a connection assembly of the present utility model; FIG. 4 is a schematic diagram of the connection of the placement module of the present utility model; fig. 5 is a perspective view of the chute, the fixing hole and the connecting hole of the present utility model. In the figure, 1, a connecting component, 101, a connector, 102, a valve body, 103, a connecting pipe, 104, a temperature sensor, 2, a placing compon