CN-224227275-U - Electroplating device for circuit board processing

CN224227275UCN 224227275 UCN224227275 UCN 224227275UCN-224227275-U

Abstract

The utility model discloses an electroplating device for circuit board processing, which comprises a hanger, an electrically driven hanger rail, a precipitation base table, a main collecting bin and a VCP jet liquid precipitation collecting unit, wherein in the using process of the electroplating device, when a moving table drives a board to move to a spraying area, the spraying bin in the side spraying frame area is started to supply electric plating liquid to an electromagnetic spray head, then the electromagnetic spray head is driven to uniformly spray and electroplate from two sides of the board, so that the electroplating liquid level is ensured to be effectively attached to the surface of a board layer, the first collection inclined plane that collects the main cavity top sets up for the arc, this just makes the plating solution that falls on a surface of collecting the inclined plane flow into along collecting the inclined plane smoothly and collects the main cavity, improves the collection efficiency of plating solution, collects the main cavity in the bottom and is provided with the water conservancy diversion inclined plane, and the buffer column of water conservancy diversion inclined plane top installation can carry out the deceleration to the plating solution velocity of flow simultaneously for the plating solution shunts smoothly from two sets of water conservancy diversion inclined planes and gets into the sedimentation chamber, and then guarantees the recycle to the plating solution.

Inventors

Lei Shuiqiang
YI LONG
ZHOU HONG
LIU SHENGHUA
WANG YUGUO
Xiao shunlan

Assignees

重庆深进新电子科技有限公司

Dates

Publication Date: 20260512
Application Date: 20250616

Claims (7)

1. The electroplating device for circuit board processing is characterized by comprising two hanging frames (1), an electric driving hanging rail (2), a precipitation base frame (3), a collecting main bin (4) and VCP jet liquid precipitation collecting units, wherein the hanging frames (1) are symmetrically arranged, the electric driving hanging rail (2) is arranged between the adjacent hanging frames (1), the precipitation base frame (3) is arranged on the bottom surface of the hanging frames (1), the collecting main bin (4) is arranged at the top of the precipitation base frame (3), and the VCP jet liquid precipitation collecting units are arranged on two sides of the collecting main bin (4) and used for circularly recovering jet liquid.
2. The electroplating device for circuit board processing according to claim 1, wherein the VCP jet liquid precipitation collection unit comprises a main collection portion, the main collection portion comprises a buffer column (44), a collection main cavity (41) is arranged in the collection main bin (4), a collection inclined plane I (42) is arranged at the top of the collection main cavity (41) and close to the electric drive hanging rail (2), the collection inclined plane I (42) is symmetrically arranged, a diversion inclined plane (43) is arranged in the bottom area of the collection main cavity (41), the diversion inclined plane (43) is symmetrically arranged, and the buffer column (44) is arranged at the top of the diversion inclined plane (43).
3. The electroplating device for circuit board processing according to claim 2, wherein the VCP jet liquid precipitation collection unit further comprises an auxiliary collection portion, the auxiliary collection portion comprises two groups of collection auxiliary bins (5), the two groups of collection auxiliary bins (5) are arranged on two sides of the collection main bin (4), a collection auxiliary cavity (51) is arranged in the collection auxiliary bin (5), a collection inclined plane II (52) is arranged at the top of the collection auxiliary cavity (51), a converging inclined plane (53) is arranged at the bottom of the collection auxiliary cavity (51), and the bottom of the converging inclined plane (53) faces the flow guiding inclined plane (43).
4. The electroplating device for circuit board processing according to claim 1, wherein a movable table (21) is mounted on the movable end of the electrically driven hanger rail (2), splash-proof baffle covers (22) are symmetrically mounted on two sides of the bottom of the movable table (21), and the splash-proof baffle covers (22) are L-shaped.
5. The electroplating device for circuit board processing according to claim 4, wherein a fixed seat (23) is arranged at the bottom of the movable table (21).
6. The electroplating device for circuit board processing according to claim 5, wherein two groups of plate clamps (24) are symmetrically arranged at the bottom of the fixing seat (23).
7. A plating apparatus for circuit board processing according to claim 3, wherein the top of the deposition table (3) is provided with two sets of deposition chambers (6), the deposition chambers (6) being in communication with the main collection chamber (41).

Description

Electroplating device for circuit board processing Technical Field The utility model relates to the technical field of VCP jet electroplating for circuit board processing, in particular to an electroplating device for circuit board processing. Background The purpose of circuit board electroplating mainly comprises ‌ for enhancing the electric conductivity ‌, reducing the resistance and optimizing the high-frequency signal transmission performance by uniformly depositing metal plating layers (such as copper and gold) on the surfaces of wires, reducing the signal loss and impedance fluctuation, establishing a conductive medium ‌ electroless copper plating process for depositing a 0.5 mu m copper layer on the hole wall, providing conductive leads for subsequent electroplating, and ensuring the interlayer conduction reliability of the multilayer board. Among the prior art, disclose a plating equipment for circuit board processing in publication number "CN222594053U", including the open-ended electroplating tank in top, the top of electroplating tank is provided with the mounting panel of liftable, and the bottom of mounting panel has a mount that is inverted concave shape structure, and is provided with on the mounting panel and is used for making the mount carry out reciprocating motion's rocking mechanism from top to bottom, is provided with the clamping assembly who is used for fixed circuit board on the mount. The utility model can make the fixing frame move up and down in the electroplating liquid under the action of the shaking mechanism, and make the circuit board move up and down continuously in the electroplating liquid, which is helpful for ensuring that the electroplating liquid uniformly covers the whole surface of the circuit board, thereby avoiding the phenomenon of uneven coverage, and the continuous shaking up and down can help break the surface tension, reduce the generation of bubbles in the electroplating liquid and promote the contact between the electroplating liquid and the surface of the circuit board. However, the prior art still has great disadvantages, such as: In the device and the prior art, the circuit board electroplated through the immersion technology is required to be moved gradually to be inserted into various material liquid tanks to be degreased, washed, etched and the like, the board can shake greatly in the moving process of the circuit board, the shaking can reduce the generation of bubbles in the electroplating liquid, but the copper liquid on the surface of the board flows down rapidly when the board is taken out from the electroplating tank, so that copper plating on the surface of the board on a microscopic level is uneven, if electroplating is carried out in a VCP jet flow mode, the electroplating liquid is difficult to recover, and the problem of overhigh electroplating cost of the circuit board is caused. Disclosure of utility model The present utility model is directed to an electroplating device for circuit board processing, which solves the problems set forth in the background art. In order to achieve the purpose, the electroplating device for circuit board processing comprises hanging frames, electric drive hanging rails, a precipitation base frame, a collecting main bin and VCP jet liquid precipitation collecting units, wherein the hanging frames are arranged in two groups, the two groups of hanging frames are symmetrically arranged, the electric drive hanging rails are arranged between adjacent hanging frames, the precipitation base frame is arranged on the bottom surface of the hanging frame, the collecting main bin is arranged on the top of the precipitation base frame, and the VCP jet liquid precipitation collecting units are arranged on two sides of the collecting main bin and used for circularly recovering jet liquid. Preferably, the VCP jet liquid precipitation collection unit includes a main collection portion, the main collection portion includes a buffer column, a collection main chamber is provided inside the collection main chamber, a collection inclined plane one is provided near the electric drive hanger rail portion at the top of the collection main chamber, the collection inclined plane one is symmetrically provided, a collection main chamber bottom area is provided with a diversion inclined plane, the diversion inclined plane is symmetrically provided, and the buffer column is mounted at the top of the diversion inclined plane. Preferably, the VCP jet liquid precipitation collection unit further comprises an auxiliary collection portion, the auxiliary collection portion comprises a collection auxiliary bin, the collection auxiliary bins are arranged into two groups, the two groups of collection auxiliary bins are installed on two sides of the collection main bin, a collection auxiliary cavity is arranged in the collection auxiliary bin, a collection inclined plane II is arranged at the top of the collection auxiliary cavity, a collection inclin