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CN-224230947-U - Semiconductor chip wafer patch ring flatness detection device

CN224230947UCN 224230947 UCN224230947 UCN 224230947UCN-224230947-U

Abstract

The utility model relates to a semiconductor chip wafer patch ring flatness detection device which comprises a base, a rotary table rotatably arranged on the base, a driving mechanism for driving the rotary table to rotate, a detection mechanism for detecting flatness and an upper computer, wherein the rotary table comprises a rotary table and a placing groove arranged along the circumferential direction of the rotary table, the detection mechanism comprises a flatness detector fixed right above the placing groove, a position sensor arranged on the base and positioned on the side edge of the rotary table, and an induction end arranged on the side face of the rotary table, the signal receiving and transmitting end of the flatness detector faces the placing groove, the signal receiving and transmitting end of the position sensor faces the side face of the rotary table, and the upper computer is respectively and electrically connected with the driving mechanism, the flatness detector and the position sensor. The wafer surface mounting ring flatness detection device can realize automatic detection of the flatness of the wafer surface mounting ring, avoids defective products caused by surface mounting ring processing errors or improper transportation, thereby avoiding influencing subsequent wafer processing, reducing cost loss and improving product quality.

Inventors

  • GENG DANDAN
  • GUI WENMING
  • DING PENGFEI
  • LU HONGFEI
  • WANG CHUNFENG

Assignees

  • 苏州中搏成机电设备有限公司

Dates

Publication Date
20260512
Application Date
20250613

Claims (10)

  1. 1. The semiconductor chip wafer patch ring flatness detection device is characterized by comprising a base (1), a rotary table (2) rotationally arranged on the base (1) and used for loading patch rings, a driving mechanism (3) used for driving the rotary table (2) to rotate, a detection mechanism (4) used for detecting the flatness of the patch rings, and an upper computer (5) used for controlling the detection device, wherein the rotary table (2) comprises a rotary table (21) rotationally connected on the base (1) around a vertically arranged rotating shaft, a placing groove (22) circumferentially arranged on the surface edge of the rotary table (21) and used for placing the patch rings, the detection mechanism (4) comprises a flatness detector (41) fixedly arranged right above the placing groove (22), a position sensor (42) arranged on the base (1) and positioned on the side edge of the rotary table (21), an induction end (43) arranged on the side surface of the rotary table (2) and used for transmitting signals with the position sensor (42), a signal receiving end of the flatness detector (41) faces the placing groove (22) at the surface edge of the surface of the rotary table (21), and the signal receiving end (42) faces the rotary table (3) and the signal receiving end (42) respectively The flatness detector 41 and the position sensor 42 are electrically connected.
  2. 2. The semiconductor chip wafer patch ring flatness detection apparatus as set forth in claim 1, wherein the driving mechanism (3) comprises a driving wheel (31) rotatably connected to the base (1) around a vertically arranged rotation axis, a driving motor (32) for driving the driving wheel (31) to rotate, and a driving belt (33) sleeved on the driving wheel (31) and the turntable (21) and used for driving the turntable (21) to rotate, wherein an inner wall of the driving belt (33) is respectively abutted against a side surface of the turntable (21) and a side surface of the driving wheel (31).
  3. 3. The semiconductor chip wafer patch ring flatness detection apparatus as claimed in claim 2, wherein the driving mechanism (3) further includes at least one tension assembly (34) for pressing the belt (33), the tension assembly including a tension wheel (341) provided between the driving wheel (31) and the turntable (21) so as to be capable of sliding horizontally and rotating about a vertically disposed rotation axis, the tension wheel (341) having at least two working positions by sliding, the tension wheel (341) being away from the belt (33) when it is in the first working position, the tension wheel (341) being close to the belt (33) when it is in the second working position, and a side wall of the tension wheel (341) being in pressing contact with an outer side surface of the belt (33).
  4. 4. The semiconductor chip wafer patch ring flatness detection apparatus according to claim 3, wherein the tensioning assembly (34) further comprises a chute (342) provided on the surface of the base (1), a slider (343) slidably connected in the chute (342), and a limiting member connected between the chute (342) and the slider (343) and used for limiting sliding of the slider (343), and the tensioning wheel (341) is rotatably connected to the slider (343) around a vertically arranged rotation axis.
  5. 5. The device for detecting the flatness of the chip wafer patch ring of the semiconductor chip wafer according to claim 1, wherein the detecting mechanism (4) further comprises a bracket (44) fixedly arranged on the base (1) and a code scanner (45) arranged on the bracket (44) and used for reading the product information of the chip wafer patch ring, the code scanner (45) is positioned right above the placing groove (22), and the code scanner (45) is electrically connected with the upper computer (5).
  6. 6. The semiconductor chip wafer patch ring flatness detection apparatus of claim 5, wherein the flatness detector (41) is fixedly connected to the holder (44).
  7. 7. The semiconductor chip wafer patch ring flatness detection apparatus as claimed in claim 1, wherein the flatness detector (41) is provided as a laser ranging sensor.
  8. 8. The device for detecting the flatness of a wafer patch ring of a semiconductor chip according to claim 1, wherein the rotary table (2) further comprises at least two positioning members (23) arranged on the edge of the surface of the rotary table (21), the positioning members (23) are located on the outer side of the placement groove (22), and the positioning members (23) are abutted against the outer side surface of the patch ring placed in the placement groove (22).
  9. 9. The semiconductor chip wafer patch ring flatness detection apparatus as claimed in claim 1, wherein a diameter of the turntable (21) is larger than a diameter of the patch ring.
  10. 10. The device for detecting the flatness of the wafer patch ring of the semiconductor chip according to claim 1, wherein the device further comprises a machine (6) and a detection platform (7) arranged on the machine (6), and the base (1) is fixedly connected to the detection platform (7).

Description

Semiconductor chip wafer patch ring flatness detection device Technical Field The utility model relates to a semiconductor chip wafer patch ring flatness detection device, which is applicable to the technical field of semiconductor chip processing. Background The wafer patch ring of the semiconductor chip is a core component in the wafer manufacturing and packaging process and is usually made of high-purity ceramic or special alloy, the wafer patch ring can protect the wafer from being damaged by chemicals, mechanical scraping and the like in the wafer manufacturing and packaging process, can help the wafer to be positioned, ensures the accurate position of the wafer, can provide support in the wafer transmission process, and can prevent the wafer from being broken due to overlarge stress when the wafer is circulated among devices, and ensure the integrity of the wafer. The precision of the wafer patch ring directly influences the performance and reliability of the chip, so that a chip manufacturer can input a great deal of cost, the quality and stability of the produced wafer patch ring are guaranteed in terms of materials, processes and the like, however, the produced wafer patch ring lacks an effective detection procedure before being input into the wafer manufacturing and packaging process, and therefore, when defective products produced due to processing errors or damaged products in the transportation process flow into the wafer manufacturing process, the wafer packaging quality is easily influenced, and unnecessary cost waste is caused. Disclosure of utility model In order to solve the defects in the prior art, the utility model provides a semiconductor chip wafer patch ring flatness detection device. The technical scheme includes that the semiconductor chip wafer patch ring flatness detection device comprises a base, a rotary table rotatably arranged on the base and used for loading patch rings, a driving mechanism used for driving the rotary table to rotate, a detection mechanism used for detecting the flatness of the patch rings, and an upper computer used for controlling the detection device, wherein the rotary table comprises a rotary table rotatably connected to the base around a vertically arranged rotary shaft, a placing groove arranged on the edge of the surface of the rotary table along the circumferential direction of the rotary table and used for placing the patch rings, the detection mechanism comprises a flatness detector fixedly arranged right above the placing groove, a position sensor arranged on the base and positioned on the side edge of the rotary table, and an induction end arranged on the side face of the rotary table and used for transmitting signals with the position sensor, the signal receiving and transmitting end of the flatness detector faces the placing groove, and the signal receiving end of the position sensor faces the side face of the rotary table, and the upper computer is respectively and electrically connected with the driving mechanism, the flatness detector and the position sensor. When the patch ring is detected, the patch ring is firstly loaded in the placing groove, then the driving mechanism is started by the upper computer to drive the turntable to drive the patch ring to rotate, meanwhile, the upper computer detects the flatness of the position of the patch ring right below the flatness detector through the flatness detector, and along with the rotation of the turntable, all the positions on the patch ring are driven to pass through the position detector in sequence, so that the whole flatness detection of the patch ring is realized, the rotation angle of the turntable is detected through the position sensor and the induction end, specifically, when the turntable is in an initial position, the induction end on the side face of the turntable is positioned opposite to the position sensor, along with the rotation of the turntable, the induction end is staggered with the position sensor, and when the induction end moves to the position opposite to the position sensor again, the turntable rotates one circle, and simultaneously the flatness detector completes the flatness detection of the whole patch ring. Through host computer control actuating mechanism, detection mechanism and revolving stage, can realize the automated inspection to the planarization of wafer paster ring, avoid paster ring machining error or transportation improper and defective products that appear to avoid influencing subsequent wafer processing, reduce cost loss, improve product quality. Further, the driving mechanism comprises a driving wheel which is rotationally connected to the base around a vertically arranged rotating shaft, a driving motor for driving the driving wheel to rotate, and a driving belt which is sleeved on the driving wheel and the turntable and is used for driving the turntable to rotate, wherein the inner wall of the driving belt is respectively abutted against the side