CN-224230994-U - Multi-sensor lead vacuum sealing structure
Abstract
The utility model relates to a multi-sensor lead vacuum sealing structure which only needs to arrange a vacuum cap on an empty device, a plurality of lead holes are arranged on the vacuum cap for a plurality of leads to penetrate out, a pressing plate is uniformly used for pressing the plurality of lead holes simultaneously for sealing and locking, the vacuum sealing structure does not need to be arranged in a plurality of areas of the vacuum device, the lead holes and the vacuum sealing structure are integrated on the vacuum cap, the occupied area is minimized, the vacuum sealing structure is suitable for vacuum sealing of the leads of the vacuum device with different sizes, and the structural strength of the vacuum device is not influenced.
Inventors
- LI ZHIQIANG
- ZHAO YIDANG
- LI ZHIHUA
Assignees
- 珠海恒格微电子装备有限公司
Dates
- Publication Date
- 20260512
- Application Date
- 20250617
Claims (6)
- 1. The multi-sensor lead vacuum sealing structure is characterized by comprising a vacuum cap (100) communicated with the inside of a vacuum device, wherein a plurality of first sealing grooves (101) and a plurality of locking screw holes (102) are formed in the top plane of the vacuum cap (100), first lead holes (103) penetrating through the vacuum cap (100) are formed in the first sealing grooves (101), first sealing glue rings (104) are formed in the first sealing grooves (101), the inner rings of the first sealing glue rings (104) are overlapped with the first lead holes (103), the first sealing glue rings (104) are protruded out of the top plane of the vacuum cap (100), a first pressing plate (105) is connected to the top plane of the vacuum cap (100), a plurality of second lead holes (106) and a plurality of first alignment holes (107) are formed in the first pressing plate (105), and leads of a sensor penetrate through the first lead holes (103), the inner rings of the first sealing glue rings (104) and the second lead holes (106) and the second lead holes (108) of the vacuum device to penetrate through the first pressing plate (105) to the outside of the first pressing plate (102), and then the first pressing plate (105) is screwed into the first pressing plate (102).
- 2. The multi-sensor lead vacuum sealing structure according to claim 1, wherein a plurality of second sealing grooves (109) are formed in the top plane of the first pressing plate (105), the second sealing grooves (109) are in one-to-one correspondence with the second lead holes (106), second sealing rings (110) are arranged in the second sealing grooves (109), inner rings of the second sealing rings (110) are overlapped with the second lead holes (106), the sealing rings protrude out of the top plane of the first pressing plate (105), a second pressing plate (111) is covered on the top plane of the first pressing plate (105), a plurality of third lead holes (112) and a plurality of second alignment holes (113) are formed in the second pressing plate (111), leads of the sensor penetrate through the first lead holes (103), inner rings of the first sealing rings (104), the second lead holes (106), inner rings of the second sealing rings (110), third lead holes (112) are led to the top plane of the first pressing plate (105), and then the second pressing plate (111) are screwed into the second pressing plate (113) through the second pressing plate (102).
- 3. The multi-sensor lead vacuum sealing structure according to claim 2, wherein the first lead hole (103), the second lead hole (106) and the third lead hole (112) are in one-to-one correspondence and are all located on the same vertical line.
- 4. A multi-sensor lead vacuum sealing structure according to claim 3, wherein the first lead holes (103), the second lead holes (106) and the third lead holes (112) are each provided with a parity mark (114) in one-to-one correspondence.
- 5. The multi-sensor lead vacuum sealing structure according to claim 2, wherein the first lead hole (103) is located at the center of the bottom surface of the first sealing groove (101), the bottom surface of the first sealing groove (101) is connected with the first lead hole (103) in a funnel shape, the second lead hole (106) is located at the center of the bottom surface of the second sealing groove (109), and the bottom surface of the second sealing groove (109) is connected with the second lead hole (106) in a funnel shape.
- 6. The multi-sensor lead vacuum sealing structure according to claim 5, wherein the inner ring diameter of the first sealing glue ring (104)/the second sealing glue ring (110) is smaller than or equal to the diameter of the first lead hole (103)/the second lead hole (106), and the inner ring diameter of the first sealing glue ring (104)/the second sealing glue ring (110) is 0.6mm-1.8mm.
Description
Multi-sensor lead vacuum sealing structure Technical Field The utility model relates to the field of vacuum sealing, in particular to a multi-sensor lead vacuum sealing structure. Background In the vacuum equipment, various sensors are arranged to measure various parameters when the vacuum equipment works, for example, in a plasma vacuum etching machine, temperature sensors are arranged in a plurality of areas inside the vacuum equipment to monitor the temperature conditions of the areas when the plasma vacuum etching machine works, the lead wires of the sensors are required to be punched on the vacuum equipment and led out from the holes to be connected to external display equipment or analysis equipment, and the vacuum sealing of the positions of punching lead wires of the vacuum equipment is critical, so that the integral vacuum sealing condition of the vacuum equipment is influenced. At present, a lead hole is usually formed near each sensor setting position, and a vacuum sealing structure is arranged on the lead hole to vacuum seal the lead-out position. However, the design of the vacuum sealing structure with holes at multiple positions has two problems, firstly, the vacuum sealing structure occupies a region of the vacuum device, when the vacuum device is used on a small-size vacuum device, a plurality of lead holes cannot be drilled and the vacuum sealing structure cannot be arranged, and secondly, holes are drilled and the vacuum sealing structure is arranged at multiple positions on the vacuum sealing device, so that the overall structural strength of the vacuum device is affected, and the service life of the vacuum device is greatly reduced. Disclosure of utility model In order to overcome the problems, the utility model provides a multi-sensor lead vacuum sealing structure, which adopts the following technical scheme: A multi-sensor lead vacuum sealing structure comprises a vacuum cap communicated with the inside of a vacuum device, wherein a plurality of first sealing grooves and a plurality of locking screw holes are formed in the top plane of the vacuum cap, first lead holes penetrating into the vacuum cap are formed in the first sealing grooves, first sealing glue rings are arranged in the first sealing grooves, inner rings of the first sealing glue rings are overlapped with the first lead holes, the first sealing glue rings protrude out of the top plane of the vacuum cap, a first pressing plate is connected to the top plane of the vacuum cap in a covering mode, a plurality of second lead holes and a plurality of first alignment holes are formed in the first pressing plate, leads of a sensor penetrate through the first lead holes, the inner rings of the first sealing glue rings and the second lead holes from the inside of the vacuum device and then are led to the outside, locking screws are screwed into the locking screw holes after penetrating through the first alignment holes so as to lock the first pressing plate, and the bottom plane of the first pressing plate is in a pressing mode so as to seal the leads in a vacuum mode. Further, a plurality of second sealing grooves are formed in the top plane of the first pressing plate, the second sealing grooves correspond to the second lead holes one by one, second sealing glue rings are arranged in the second sealing grooves, inner rings of the second sealing glue rings are overlapped with the second lead holes, the sealing glue rings protrude out of the top plane of the first pressing plate, the second pressing plate is covered on the top plane of the first pressing plate, a plurality of third lead holes and a plurality of second alignment holes are formed in the second pressing plate, a lead of the sensor penetrates through the first lead holes, the inner rings of the first sealing glue rings, the second lead holes, the inner rings of the second sealing glue rings and the third lead holes from the inside of the vacuum equipment and then led to the outside, locking screws penetrate through the second alignment holes and the first alignment holes and then are screwed into locking screw holes to lock the second pressing plate and the first pressing plate, and the bottom plane of the second pressing plate is in pressure joint with the second sealing glue rings to seal the lead in vacuum. Further, the first lead holes, the second lead holes and the third lead holes are in one-to-one correspondence and are all positioned on the same vertical line. Further, the first lead holes, the second lead holes and the third lead holes which are in one-to-one correspondence are all provided with parity marks. Further, the first lead hole is located at the center of the bottom surface of the first sealing groove, the bottom surface of the first sealing groove is connected with the first lead hole in a funnel shape, the second lead hole is located at the center of the bottom surface of the second sealing groove, and the bottom surface of the second sealing groove