CN-224231111-U - Product surface temperature monitoring module

CN224231111UCN 224231111 UCN224231111 UCN 224231111UCN-224231111-U

Abstract

The utility model aims to provide a product surface temperature monitoring module which is low in cost, small in occupied space and convenient to integrate on a test production line. The temperature measuring device comprises a processor, a switch unit and a plurality of temperature measuring probes, wherein the temperature measuring probes are communicated with the processor through the switch unit, the processor is communicated with an external computer, the temperature measuring probes comprise a mounting block, a flexible circuit board and a digital temperature sensor, the digital temperature sensor is electrically connected to the flexible circuit board, the flexible circuit board is limited and arranged on the mounting block, and a heat conducting block for wrapping the digital temperature sensor is arranged at the end part of the mounting block. The utility model is applied to the technical field of temperature test.

Inventors

PAN ZHAOHONG
WANG HAILAI
KANG MINGYONG
ZHANG YANFANG
TANG XIAOTAO

Assignees

珠海市运泰利自动化设备有限公司

Dates

Publication Date: 20260512
Application Date: 20250603

Claims (5)

1. The product surface temperature monitoring module is characterized by comprising a processor (1), a switch unit (2) and a plurality of temperature measuring probes (3), wherein the temperature measuring probes (3) are communicated with the processor (1) through the switch unit (2), the processor (1) is communicated with an external computer, the temperature measuring probes (3) comprise a mounting block, a flexible circuit board and a digital temperature sensor (31), the digital temperature sensor (31) is electrically connected to the flexible circuit board, the flexible circuit board is limited and arranged on the mounting block, and a heat conducting block for wrapping the digital temperature sensor (31) is arranged at the end part of the mounting block.
2. The product surface temperature monitoring module as set forth in claim 1, wherein a thermal insulation layer is disposed between the flexible circuit board and the mounting block.
3. The product surface temperature monitoring module as set forth in claim 2, wherein the thermal insulation layer is a foam insulation layer.
4. The product surface temperature monitoring module set of claim 1, wherein the switch unit (2) comprises a plurality of switch chips (21), the switch chips (21) are all communicated with the processor (1), and switching ports of the switch chips (21) are correspondingly connected with the temperature measuring probes (3).
5. The product surface temperature monitoring module as set forth in claim 1, further comprising a power module (4) and a communication module (5), wherein the power module (4) is connected with an external power input, and the processor (1) communicates with an external computer through the communication module (5).

Description

Product surface temperature monitoring module Technical Field The utility model is applied to the technical field of temperature test, and particularly relates to a product surface temperature monitoring module. Background In order to ensure the test effect in the field of temperature test, a standard instrument is generally adopted for testing, such as KEYSIGHT DAQ, 970, AKEYSIGHT DAQ and 970A data acquisition instrument is matched with a thermocouple for measuring the temperature, the cost is high, the volume is relatively large, the performance of products such as mobile phones, tablet computers and watches is further tested according to the surface temperature monitoring of the products in the charging process, and the standard instrument is difficult to integrate on a test production line. Meanwhile, errors are easy to generate in thermocouple measurement, and the stability of the test precision cannot be ensured in batch test by the traditional contact structure. If the product surface temperature monitoring module which occupies small space and is convenient to integrate on the test production line can be provided. Disclosure of utility model The utility model aims to solve the technical problem of overcoming the defects of the prior art and providing the product surface temperature monitoring module which is low in cost, small in occupied space and convenient to integrate on a test production line. The temperature measuring probe comprises a processor, a switch unit and a plurality of temperature measuring probes, wherein the temperature measuring probes are communicated with the processor through the switch unit, the processor is communicated with an external computer, the temperature measuring probes comprise a mounting block, a flexible circuit board and a digital temperature sensor, the digital temperature sensor is electrically connected to the flexible circuit board, the flexible circuit board is limited and arranged on the mounting block, and a heat conducting block for wrapping the digital temperature sensor is arranged at the end part of the mounting block. According to the scheme, the processor is used for feeding signals collected by the temperature measuring probe back to the upper computer, the switch unit is used for selectively conducting signals of the temperature measuring probe with multiple channels to the processor, and then batch data collection is achieved through the processor, and temperature test when batch products are charged on a test production line can be better achieved while the cost is low and the occupied space is small. The temperature detection precision is improved by adopting a digital temperature sensor, and the mounting block is used for fixing the flexible circuit board. Through setting up the heat conduction piece is when protecting digital temperature sensor guarantees the effectual temperature transfer with the product that awaits measuring when contact with the product that awaits measuring, and then guarantees temperature acquisition's precision and stability. In one preferred embodiment, a heat insulating layer is provided between the flexible circuit board and the mounting block. Further preferably, the heat insulation layer is a foam interlayer. In one preferred scheme, the switch unit comprises a plurality of switch chips, the switch chips are communicated with the processor, and the switching ports of the switch chips are correspondingly connected with the temperature measuring probes. In a preferred embodiment, the utility model further comprises a power module and a communication module, wherein the power module is connected with an external power input, and the processor is communicated with an external computer through the communication module. Drawings FIG. 1 is a system block diagram of the present utility model; FIG. 2 is a schematic circuit diagram of the processor, the power module, and the communication module; FIG. 3 is a schematic circuit diagram of the switching unit; fig. 4 is a schematic circuit diagram of the temperature probe. Detailed Description As shown in fig. 1 to 4, in this embodiment, the present utility model includes a processor 1, a switch unit 2, and a plurality of temperature probes 3, wherein the plurality of temperature probes 3 communicate with the processor 1 through the switch unit 2, the processor 1 communicates with an external computer, the temperature probes 3 include a mounting block, a flexible circuit board, and a digital temperature sensor 31, the digital temperature sensor 31 is electrically connected to the flexible circuit board, the flexible circuit board is disposed on the mounting block in a limited manner, and a heat conducting block covering the digital temperature sensor 31 is disposed at an end of the mounting block. The processor 1 is a processing chip with the model of STM32F103 series, and the processing chip reads the signals of the digital temperature sensor 31 and transmits the data to an upp