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CN-224231145-U - High-reliability pressure sensing intelligent sensor

CN224231145UCN 224231145 UCN224231145 UCN 224231145UCN-224231145-U

Abstract

The utility model provides a high-reliability pressure sensing intelligent sensor, and belongs to the technical field of sensors. The intelligent sensor comprises an intelligent sensor body, wherein the intelligent sensor body comprises a pressurizing port, a full-bridge pressure sensing unit, a conditioning chip circuit part PCBA, a full-bridge pressure sensing unit, a routing PCB (printed circuit board) for connecting the full-bridge pressure sensing unit to other circuits, a PCB (printed circuit board) support, a flexible circuit board FPC (flexible printed circuit board), a conditioning chip circuit part PCBA support and a metal shell, the sensing port (namely the pressurizing port and a metal film on the top of the pressurizing port) with a double-neck structure is integrally machined by a stainless steel body according to a special machining process, the pressure resistance and the bursting pressure of the seamless sensing body are far greater than those of a structure with a welded joint, a conductive rod or a spring can be selected according to different requirements of users, the conductive rod is used as a connecting part, the intelligent sensor is suitable for making contact surfaces into low-form concave point contact, mounting dislocation is avoided, and the spring is suitable for customers with contact points on most circuit boards and can be directly matched with the product requirements.

Inventors

  • BAO XIANHUI
  • YE ZHIJIAN
  • SHA MANTE

Assignees

  • 杭州智感微电子有限公司
  • 海拉（厦门）电气有限公司

Dates

Publication Date
20260512
Application Date
20250123

Claims (8)

  1. 1. The utility model provides a high reliability forced induction intelligent sensor, includes intelligent sensor body (10), a serial communication port, intelligent sensor body (10) include pressurization port (11), full-bridge pressure sensing unit (13), take care of chip circuit part PCBA (112), full-bridge pressure sensing unit (13) link to wire PCB (110) that uses on other circuit, PCB support (14), flexible circuit board FPC (111), take care of chip circuit part PCBA support (15) and metal casing (17), the top of pressurization port (11) is equipped with metal film (12), the top of pressurization port (11) is equipped with dual neck structure (19), take care of chip circuit part PCBA (112) and fix on take care of chip circuit part PCBA support (15), take care of the top inboard of chip circuit part PCBA support (15) is provided with conducting bar support (18), the internally mounted of conducting bar support (18) has conducting bar (16), conducting bar (16) are installed and are produced concave point in conducting bar support (18) upper segment difference, the bottom is kept to take care of chip circuit part PCBA support (16), take care of chip circuit part PCBA (16) and pressurization part PCBA support (113) are connected with pressurization part PCBA (112), the bottom of conditioning chip circuit part PCBA (112) is fixed at the pressurizing port (11) through conditioning chip circuit part PCBA support (15), wire bonding PCB (110) is welded on PCB support (14), the bottom of PCB support (14) is fixed at pressurizing port (11), pressurizing port (11) and metal film (12) at its top wholly use a stainless steel body to make seamless inductor through machining.
  2. 2. The high-reliability pressure sensing intelligent sensor according to claim 1, wherein the full-bridge pressure sensing unit (13) is arranged at the top end of the metal film (12), and the wire bonding PCB (110) is positioned at the top of the PCB support (14) and is fixed through the PCB support (14).
  3. 3. The high reliability pressure sensing intelligent sensor of claim 1, wherein the wire bonding PCB (110) is connected to the signal input of the conditioning chip circuit portion PCBA (112) through a flexible circuit board FPC (111).
  4. 4. A high reliability pressure sensitive smart sensor according to claim 1, wherein said conductive bars (16) are provided with three, said number of full bridge pressure sensitive units (13) being at least one.
  5. 5. The high reliability pressure sensing intelligent sensor of claim 1, wherein the full bridge pressure sensing unit (13) is fabricated based on single crystal silicon, polysilicon or gallium nitride material and SOI technology, wherein SOI is silicon on an insulating substrate, which technology is to introduce a buried oxide layer between the top silicon and the backing bottom.
  6. 6. A high reliability pressure sensitive smart sensor according to claim 1, wherein the full bridge pressure sensitive unit (13) is directly linked to the wire-bonded PCB (110) by a bonding process in a wire-bonding manner.
  7. 7. The high reliability pressure sensing intelligent sensor of claim 1, wherein said conditioning chip circuitry portion PCBA (112) generates and transmits a corresponding send output signal or other digital output signal.
  8. 8. A high reliability pressure sensitive smart sensor as claimed in claim 7 wherein the send output or other digital output signal is connected to the client by three conductive bars (16).

Description

High-reliability pressure sensing intelligent sensor Technical Field The utility model relates to the field of sensors, in particular to a high-reliability pressure sensing intelligent sensor. Background The pressure sensor may be used in a body stability system (ESC) or OneBox system in an autonomous vehicle. For monitoring brake control unit brake fluid pressure signals and hydraulic brake-by-wire system pressure signals. The pressure sensor is electrically connected to the ECU so as to provide a measurement signal of the brake oil pressure to the system controller. The pressure sensor is also used in automotive air suspension systems and carbon dioxide air conditioner compressor systems or other pressure measurement applications. In the existing ESC or OneBox pressure sensor technology, the sensing ports of most hydraulic sensors are made by adopting a laser or argon arc welding mode for two or more stainless steel parts and adopting a seam welding mode, but the pressure resistance and the bursting pressure of the sensing ports of the connection mode are relatively poor, in addition, some products need to put contact springs on a circuit board, the contact points need to be arranged on a plastic bracket of the sensor under the application, and the springs are easy to misplace during installation, so that poor contact is caused, and the measurement accuracy is affected. How to invent a high-reliability pressure sensing intelligent sensor to solve the problems becomes a problem to be solved by the person skilled in the art. Disclosure of utility model In order to overcome the defects, the utility model provides a high-reliability pressure sensing intelligent sensor, and aims to solve the problems in the background. The utility model is realized in the following way: The utility model provides a high-reliability pressure sensing intelligent sensor, which comprises an intelligent sensor body, wherein the intelligent sensor body comprises a pressurizing port, a full-bridge pressure sensing unit, a conditioning chip circuit part PCBA, a full-bridge pressure sensing unit, a wire-bonding PCB for connecting to other circuits, a PCB bracket, a flexible circuit board FPC, a conditioning chip circuit part PCBA bracket and a metal shell, a metal film is arranged at the top end of the pressurizing port, a double-neck structure is arranged at the top end of the pressurizing port, the conditioning chip circuit part PCBA is fixed on the conditioning chip circuit part PCBA bracket, a conductive rod bracket is arranged at the inner side of the top end of the conditioning chip circuit part PCBA bracket, a conductive rod is arranged in the conductive rod bracket, a notch is reserved on the conductive rod bracket to prevent a contact spring of a client from being misplaced, the bottom end of the conductive rod is provided with a bent pin, the conductive rod is connected with the conditioning chip circuit part PCBA through welding, the bottom end of the conditioning chip circuit part PCBA bracket is fixedly connected with the pressurizing port, and the conditioning chip circuit part PCBA is fixedly welded at the bottom end of the PCB through the PCB bracket. Preferably, the full-bridge pressure sensing unit is arranged at the top end of the metal film, and the wire-bonding PCB is positioned at the top of the PCB bracket and is fixed through the PCB bracket. Preferably, the routing PCB is connected to the signal input end of the conditioning chip circuit part PCBA through a Flexible Printed Circuit (FPC). Preferably, the number of the full-bridge pressure sensing units is at least one, and the conductive rods can be replaced by springs. Preferably, the full bridge pressure sensing cell is fabricated based on monocrystalline silicon, polycrystalline silicon or gallium nitride material and SOI technology wherein SOI is silicon on an insulating substrate, the technology being such that a buried oxide layer is introduced between the top silicon layer and the backing bottom. Preferably, the full-bridge pressure sensing unit is directly linked to the wired PCB in a wired manner through a binding process. Preferably, the conditioning chip circuitry portion PCBA generates and transmits a corresponding SENT output signal or other digital output signal. Preferably, the send output or other digital output signal is connected to the client with three conductive bars or three springs. The beneficial effects of the utility model are as follows: The single (or a plurality of) full-bridge pressure sensing units are adopted to provide high-sensitivity signals for the signal conditioning chip, so that the output signals output by SENT are more stable and reliable and have higher precision, and signal detection, fault analysis and signal redundancy are provided; the application adopts a seamless inductor which is formed by integrally machining a sensing port (namely a pressurizing port and a metal film at the top of the sensing port) with a doubl