CN-224231465-U - Simple testing device for mechanical properties of electronic device in room temperature/low temperature environment
Abstract
The utility model discloses a simple testing device for mechanical properties of electronic devices in room temperature/low temperature environments, which comprises a tensile testing machine, a heat-preserving barrel, a sample clamp and a probe fixing clamp, wherein the tensile testing machine is fixed on the ground, a fixing disc is connected to a tensile head of the tensile testing machine, the tensile testing machine applies tension through the fixing disc, the heat-preserving barrel is placed on a base of the tensile testing machine, the bottom of the heat-preserving barrel is fixedly connected with the base of the tensile testing machine, the sample clamp comprises an upper clamp and a lower clamp, the upper end of the upper clamp is connected with the fixing disc through a pull rod, the lower end of the upper clamp is clamped and connected with a tested sample, the lower end of the lower clamp stretches into the heat-preserving barrel and is fixedly connected with the bottom of the heat-preserving barrel, the upper end of the lower clamp is clamped and connected with the tested sample, the probe fixing clamp is fixed on the bottom of the heat-preserving barrel, a locking knob is connected to the low-temperature probe, and the locking knob is rotated to fix the position of the low-temperature probe.
Inventors
- WANG JIAWEI
- WANG ZEYU
- JIANG YIXUAN
- WANG SHENGZHE
Assignees
- 兰州大学
Dates
- Publication Date
- 20260512
- Application Date
- 20250522
Claims (4)
- 1. The simple testing device for the mechanical properties of the electronic device in the room temperature/low temperature environment is characterized by comprising a tensile testing machine (1), a heat preservation barrel (6), a sample clamp and a probe fixing clamp (10); The tensile testing machine (1) is fixed on the ground, a fixed disc (2) is connected to a tensile head of the tensile testing machine (1), and the tensile testing machine (1) applies tensile force through the fixed disc (2); the heat-preserving barrel (6) is placed on the base of the tensile testing machine (1), and the bottom of the heat-preserving barrel (6) is fixedly connected with the base of the tensile testing machine (1); The sample clamp comprises an upper clamp (8) and a lower clamp (11), wherein the upper end of the upper clamp (8) is connected with a fixed disc (2) through a pull rod (4), the lower end of the upper clamp (8) is connected with a tested sample (9) in a clamping manner, and the lower end of the lower clamp extends into the heat-preserving barrel (6) and is fixedly connected with the bottom of the heat-preserving barrel (6), and the upper end of the lower clamp is connected with the tested sample (9) in a clamping manner; The probe fixing clamp (10) is fixed at the bottom of the heat-preserving barrel (6), the probe fixing clamp (10) is in a T shape and comprises a vertical section and a horizontal section, the horizontal section is fixed on the heat-preserving barrel (6), the vertical section is connected with the horizontal section through a chute structure, the distance between the vertical section and a tested sample (9) is adjusted through the chute structure, the vertical section is slidably connected with a low-temperature probe, the low-temperature probe is used for shooting the tested sample (9), a locking knob (18) is connected onto the low-temperature probe, and the locking knob (18) is rotated to fix the position of the low-temperature probe.
- 2. The simple test device for mechanical properties of electronic devices in room temperature/low temperature environment according to claim 1, wherein the upper clamp (8) comprises an upper clamp interface (5), an upper clamp base (7) and an upper clamp fixing block (17), wherein the top of the upper clamp interface (5) is connected with a pull rod (4), the bottom of the upper clamp interface is connected with the vertical upper clamp base (7), the upper clamp fixing block (17) is connected to one side of the upper clamp base (7) through bolts, and a tested sample (9) is clamped between the upper clamp base (7) and the upper clamp fixing block (17).
- 3. The device for simply testing mechanical properties of electronic devices in room temperature/low temperature environment according to claim 1, wherein the lower fixture comprises a fixture lower interface (13), a fixture lower base (12) and a lower fixture fixing block (22), the fixture lower interface (13) is horizontally fixed at the bottom of the heat insulation barrel (6), the fixture lower base (12) is vertically connected to the fixture lower base (12), the lower fixture fixing block (22) is connected to one side of the fixture lower base (12) through a bolt, and the tested sample (9) is clamped between the fixture lower base (12) and the lower fixture fixing block (22).
- 4. The simple testing device for mechanical properties of electronic devices in room temperature/low temperature environment according to claim 1, wherein the heat-insulating barrel (6) is a double-layer stainless steel barrel, and heat-insulating cotton is filled between the double layers.
Description
Simple testing device for mechanical properties of electronic device in room temperature/low temperature environment Technical Field The utility model relates to the field of testing of electromagnetic intelligent materials in room temperature/low temperature environments, in particular to a simple testing device for mechanical properties of electronic devices in room temperature/low temperature environments. Background With the continuous advancement of deep space exploration tasks, the reliability of electromagnetic intelligent materials in extremely low-temperature environments has become a key problem. When the deep space exploration spacecraft operates on the surfaces of celestial bodies such as moon and Mars, the deep space exploration spacecraft can face an extremely low-temperature environment. For example, the diurnal temperature difference on the lunar surface may be up to 330 ℃, the daytime temperature may be up to 150 ℃, and the night as low as-180 ℃. This extreme temperature variation presents a serious challenge to the mechanical properties of the electromagnetically intelligent materials. The mechanical property of the electromagnetic intelligent material under the low-temperature environment is researched, and the method has important significance for improving the reliability and the service life of the deep space detector. In addition, more and more materials are gradually served in low-temperature extreme environments, such as superconducting materials, low-temperature ceramic materials and the like. Under the low-temperature environment, the mechanical, electrical and thermal properties of the materials can change significantly, thereby affecting the stability of operation. Therefore, the method realizes deformation loading of the material in a low-temperature environment and simultaneously accurately measures the change of the material performance, and the method becomes the technical problem to be solved currently. However, existing integrated devices in low temperature environments tend to be expensive, subject to multiple restrictions in site and equipment conditions, and cumbersome overall operation. In view of the above, the design of the superconducting material deformation loading and testing device in the low-temperature environment has higher cost efficiency, simple and convenient operation and convenient disassembly, and has important significance for deeply researching the mechatronic performance of the electric material in the extremely low-temperature environment. Disclosure of utility model The utility model aims to solve the defects in the background technology, and provides a simple testing device for mechanical properties of an electronic device in a room temperature/low temperature environment, which is easier to realize the stretching and compression loading of a tested sample under the low temperature condition and determine the change of the related mechanical properties. Therefore, the utility model adopts the following technical scheme: The simple testing device for the mechanical properties of the electronic device in the room temperature/low temperature environment comprises a tensile testing machine, a heat insulation barrel, a sample clamp and a probe fixing clamp; The tensile testing machine is fixed on the ground, a fixed disc is connected to a tensile head of the tensile testing machine, and the tensile testing machine applies a tensile force through the fixed disc; The heat-insulating barrel is placed on the base of the tensile testing machine, and the bottom of the heat-insulating barrel is fixedly connected with the base of the tensile testing machine; The lower end of the lower clamp extends into the heat-preserving barrel and is fixedly connected with the bottom of the heat-preserving barrel, and the upper end of the lower clamp is in clamping connection with the sample to be measured; The probe fixing clamp is fixed at the bottom of the heat preservation barrel and is in a T shape and comprises a vertical section and a horizontal section, the horizontal section is fixed on the heat preservation barrel, the vertical section is connected with the horizontal section through a chute structure, the distance between the vertical section and a measured sample is adjusted through the chute structure, the vertical section is connected with a low-temperature probe in a sliding mode, the low-temperature probe is used for shooting the measured sample, a locking knob is connected to the low-temperature probe, and the position of the low-temperature probe is fixed by rotating the locking knob. Further, go up the anchor clamps and include anchor clamps top interface, anchor clamps upper base, go up the anchor clamps fixed block, the anchor clamps top connection pull rod, the vertical anchor clamps upper base of bottom connection go up the anchor clamps fixed block and pass through bolted connection in anchor clamps upper base one side, the sample centre gripping of