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CN-224231636-U - Dual-motor-driven automatic wafer slice cross section detection device

CN224231636UCN 224231636 UCN224231636 UCN 224231636UCN-224231636-U

Abstract

The utility model is applicable to the technical field of semiconductor manufacturing, and provides a double-motor-driven automatic wafer slice cross section detection device which comprises a device shell, wherein a rectangular groove is formed in the top surface of the device shell, a longitudinal guide rail is arranged above the rectangular groove on one side of the device shell, a transverse guide rail is arranged below the longitudinal guide rail, a longitudinal direct current motor is arranged at one end of the longitudinal guide rail, a transverse direct current motor is arranged at one end of the transverse guide rail, an industrial camera and an adjustable LED lamp are arranged on the bottom surface of the transverse guide rail, and a wafer slice tray is arranged on the bottom surface of the rectangular groove. The utility model provides a double-motor-driven automatic detection device for a wafer slice cross section, which realizes rapid and comprehensive quality detection through low-cost and high-precision automatic scanning and visual analysis, solves the problems of low efficiency and high cost of high-precision equipment of the traditional manual detection, and overcomes the defect of insufficient motion control precision of the traditional machine vision system.

Inventors

  • MA SIHAI
  • MA HONGTAI
  • MA XIANSONG
  • MA QING
  • DING LEI

Assignees

  • 安徽易芯半导体有限公司

Dates

Publication Date
20260512
Application Date
20250414

Claims (6)

  1. 1. The utility model provides a double motor driven wafer section automatic checkout device, its characterized in that, including device shell (1), rectangular channel (20) have been seted up to the top surface of device shell (1), one side of device shell (1) is located the top of rectangular channel (20) and is equipped with longitudinal rail (6), the below of longitudinal rail (6) is equipped with transverse rail (7), the one end of longitudinal rail (6) is equipped with vertical direct current motor (2), the one end of transverse rail (7) is equipped with horizontal direct current motor (3), the bottom surface of transverse rail (7) is equipped with industrial camera (8) and adjustable LED lamp (9), the bottom surface of rectangular channel (20) is equipped with wafer section tray (5).
  2. 2. The automatic wafer slice cross section detection device driven by the double motors according to claim 1 is characterized in that a first fixing plate (13) is arranged below the longitudinal guide rail (6), a first U-shaped clamping plate (12) is arranged above the first fixing plate (13), the first U-shaped clamping plate (12) is clamped on the longitudinal guide rail (6), a first fixing block (11) is arranged on the top surface of the first U-shaped clamping plate (12), a first threaded rod (10) is arranged at the output end of the longitudinal direct current motor (2), the first threaded rod (10) penetrates through the first fixing block (11), and the first fixing plate (13) is fixedly connected with one end of the transverse guide rail (7).
  3. 3. The dual-motor-driven automatic wafer slice cross section detection device according to claim 2, wherein a carrier plate (17) is arranged below the transverse guide rail (7), a second U-shaped clamping plate (18) is arranged on the top surface of the carrier plate (17), the second U-shaped clamping plate (18) is clamped on the transverse guide rail (7), a second fixing block (19) is arranged on the top surface of the second U-shaped clamping plate (18), a second threaded rod (15) is arranged at the output end of the transverse direct current motor (3), and the second threaded rod (15) penetrates through the second fixing block (19).
  4. 4. The dual motor-driven automatic wafer slice cross section detection device of claim 3, wherein the top surfaces of the first U-shaped clamping plate (12) and the second U-shaped clamping plate (18) are provided with limiting components.
  5. 5. The dual-motor-driven automatic wafer slice cross section detection device according to claim 4, wherein the limiting assembly comprises two limiting rods (14), the two limiting rods (14) are symmetrically arranged on the top surfaces of the corresponding transverse guide rails (7) or longitudinal guide rails (6), clamping blocks (16) are symmetrically arranged on the bottom surfaces of the two limiting rods (14), and the clamping blocks (16) are arranged on the top surfaces of the corresponding first U-shaped clamping plates (12) and the second U-shaped clamping plates (18).
  6. 6. The dual-motor-driven automatic wafer slice cross section detection device according to claim 5, wherein the tops of the transverse guide rail (7), the longitudinal guide rail (6) and the rectangular groove (20) are respectively provided with a protective cover, and a bracket (4) is arranged between the top surface protective cover of the longitudinal guide rail (6) and the device shell (1).

Description

Dual-motor-driven automatic wafer slice cross section detection device Technical Field The utility model belongs to the technical field of semiconductor manufacturing, and particularly relates to a double-motor-driven automatic wafer slice cross section detection device. Background Wafer slice cross-section inspection is a very important quality control operation in semiconductor manufacturing processes, and is typically used to evaluate the structure, thickness, material distribution, and the presence of defects in circuits on a wafer. In the field of semiconductor manufacturing, the cross-sectional quality of a wafer after dicing directly affects the yield and reliability of the chip. The traditional detection method mainly relies on manual visual inspection or high-precision optical equipment (such as a laser confocal microscope, a scanning electron microscope and the like), and has the following problems: 1. The manual detection efficiency is low, the manual visual detection depends on experience, is easily influenced by subjective factors, and cannot quantify the defect size; 2. the high-cost equipment is limited and popularized, the precision optical equipment is expensive (usually millions of RMB), the maintenance is complex, and the production line requirement is difficult to adapt; 3. The automation degree is insufficient, and the existing semi-automatic equipment mostly adopts a single-direction scanning or complex multi-axis motion system, so that the detection speed is low and the cost is high. The invention provides a double-motor-driven automatic wafer slice cross section detection device aiming at the problems. Disclosure of utility model The utility model aims to provide a double-motor-driven automatic wafer slice cross section detection device, which is used for solving the problems in the background technology. The technical scheme is that the automatic wafer slice cross section detection device driven by the double motors comprises a device shell, wherein a rectangular groove is formed in the top surface of the device shell, a longitudinal guide rail is arranged above the rectangular groove on one side of the device shell, a transverse guide rail is arranged below the longitudinal guide rail, a longitudinal direct current motor is arranged at one end of the longitudinal guide rail, a transverse direct current motor is arranged at one end of the transverse guide rail, an industrial camera and an adjustable LED lamp are arranged on the bottom surface of the transverse guide rail, and a wafer slice tray is arranged on the bottom surface of the rectangular groove. Preferably, a first fixing plate is arranged below the longitudinal guide rail, a first U-shaped clamping plate is arranged above the first fixing plate and clamped on the longitudinal guide rail, a first fixing block is arranged on the top surface of the first U-shaped clamping plate, a first threaded rod is arranged at the output end of the longitudinal direct-current motor, the first threaded rod penetrates through the first fixing block, and the first fixing plate is fixedly connected with one end of the transverse guide rail. Preferably, the below of transverse guide is equipped with the carrier plate, the top surface of carrier plate is equipped with the second U-shaped cardboard, the second U-shaped cardboard card is on transverse guide, the top surface of second U-shaped cardboard is equipped with the second fixed block, transverse direct current motor's output is equipped with the second threaded rod, the second threaded rod runs through the second fixed block. Preferably, the top surfaces of the first U-shaped clamping plate and the second U-shaped clamping plate are provided with limiting assemblies. Preferably, the limiting assembly comprises two limiting rods, the two limiting rods are symmetrically arranged on the top surfaces of the corresponding transverse guide rails or the corresponding longitudinal guide rails, clamping blocks are symmetrically arranged on the bottom surfaces of the two limiting rods, and the clamping blocks are arranged on the top surfaces of the corresponding first U-shaped clamping plates and the second U-shaped clamping plates. Preferably, the tops of the transverse guide rail, the longitudinal guide rail and the rectangular groove are respectively provided with a protective cover, and a bracket is arranged between the top surface protective cover of the longitudinal guide rail and the device shell. The utility model has at least the following beneficial effects: The utility model provides a double-motor-driven automatic detection device for a wafer slice cross section, which realizes rapid and comprehensive quality detection through low-cost and high-precision automatic scanning and visual analysis, solves the problems of low efficiency and high cost of high-precision equipment of the traditional manual detection, and overcomes the defect of insufficient motion control precision of the tradit