CN-224231656-U - Multi-defect detection device for semiconductor wafer slice

Abstract

The utility model is suitable for the technical field of semiconductor manufacturing, and provides a semiconductor wafer slice multi-defect detection device which comprises an electrical cabinet, wherein an external industrial personal computer is arranged above the electrical cabinet, a display screen is arranged on the side wall of the external industrial personal computer, an operation button is arranged on the front surface of the electrical cabinet, the front surface of the electrical cabinet is arranged in an opening shape, an industrial camera is arranged on the inner top surface of the electrical cabinet, a wafer fixing tray is arranged below the industrial camera in the electrical cabinet, a drip holding bracket is arranged above the wafer fixing tray, an x-axis sliding rail is arranged above the industrial camera, a telescopic driving assembly is arranged at one end of the x-axis sliding rail, and the telescopic driving assembly drives the industrial camera along the x-axis sliding rail. The scheme adopts the liquid drop development and color CMOS vision collaborative detection to realize the integrated automatic identification of the cutting path pollutants, surface cracks, metal pollution and organic residues, thereby realizing the high-efficiency and low-cost automatic quality assessment.

Inventors

• MA SIHAI
• MA HONGTAI
• MA XIANSONG
• MA QING
• DING LEI

Assignees

• 安徽易芯半导体有限公司

Dates

Publication Date

20260512

Application Date

20250414

Claims (5)

1. 1. The utility model provides a semiconductor wafer section multi-defect detection device, its characterized in that, including electrician's cabinet (3), the top of electrician's cabinet (3) is equipped with external industrial computer (2), the lateral wall of external industrial computer (2) is equipped with display screen (1), the front of electrician's cabinet (3) is equipped with operating button (4), the front of electrician's cabinet (3) is the opening form setting, the interior top surface of electrician's cabinet (3) is equipped with industry camera (7), the inside of electrician's cabinet (3) is located the below of industry camera (7) and is equipped with wafer fixed tray (9), the top of wafer fixed tray (9) is equipped with drips liquid and holds support (8).
2. 2. The semiconductor wafer slice multi-defect detection device according to claim 1, wherein an x-axis sliding rail (6) is arranged above the industrial camera (7), one end of the x-axis sliding rail (6) is provided with a telescopic driving assembly, and the telescopic driving assembly drives the industrial camera (7) along the x-axis sliding rail (6).
3. 3. The semiconductor wafer multi-defect detecting device according to claim 1, wherein an air cylinder (12) is arranged at the bottom of the wafer fixing tray (9), and wafer containing area guide rails (10) are symmetrically and slidingly connected to the bottom of the wafer fixing tray (9).
4. 4. The device for detecting multiple defects of semiconductor wafer slices as claimed in claim 1, wherein a light source (11) is arranged on the inner top surface of the electrical cabinet (3).
5. 5. The device for detecting multiple defects of semiconductor wafer slices as claimed in claim 1, wherein the bottom of the electrical cabinet (3) is provided with a shockproof bracket (5).

Description

Multi-defect detection device for semiconductor wafer slice Technical Field The utility model belongs to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor wafer slice multi-defect detection device. Background In the field of semiconductor manufacturing, defects such as dicing street quality, surface damage, metal pollution, organic residues and the like after wafer dicing directly affect the yield and packaging reliability of chips. Currently, the industry mainly relies on the following detection methods: ① Manual visual inspection, wherein an operator observes slice defects through an optical microscope, the efficiency is low, the slice defects are easily influenced by subjective factors, and accurate quantification of the defects (such as crack length and pollutant particle size statistics) cannot be realized; ② High-precision optical equipment such as a laser confocal microscope (CLSM) or a Scanning Electron Microscope (SEM) can provide high-resolution images, but the equipment cost is high (single supermillion Yuan people and currency), the detection speed is low, and a professional operating environment (such as vacuum) is needed, so that the rapid detection requirement of a production line is difficult to adapt; ③ Single function automation device: some manufacturers use Automatic Optical Inspection (AOI) equipment, but only can identify surface scratches or particle contamination, and chemical development inspection (such as metal ion residue and organic contaminants) cannot be compatible, and in addition, a complex multi-axis motion system causes huge equipment volume and high maintenance cost. In view of the above, the present application provides a semiconductor wafer slice multi-defect detecting device. Disclosure of utility model The present utility model is directed to a semiconductor wafer slice multi-defect detecting device, which solves the above-mentioned problems in the prior art. The technical scheme is that the semiconductor wafer slice multi-defect detection device comprises an electrician cabinet, an external industrial personal computer is arranged above the electrician cabinet, a display screen is arranged on the side wall of the external industrial personal computer, an operation button is arranged on the front face of the electrician cabinet, the front face of the electrician cabinet is arranged in an opening shape, an industrial camera is arranged on the inner top face of the electrician cabinet, a wafer fixing tray is arranged below the industrial camera in the electrician cabinet, and a drip containing bracket is arranged above the wafer fixing tray. Preferably, an x-axis sliding rail is arranged above the industrial camera, one end of the x-axis sliding rail is provided with a telescopic driving assembly, and the telescopic driving assembly drives the industrial camera along the x-axis sliding rail. Preferably, an air cylinder is arranged at the bottom of the wafer fixing tray, and the bottom surface of the wafer fixing tray is symmetrically and slidingly connected with a wafer containing area guide rail. Preferably, a light source is arranged on the inner top surface of the electrical cabinet. Preferably, the bottom of the electrical cabinet is provided with a shockproof bracket. The utility model has at least the following beneficial effects: The utility model provides a semiconductor wafer slice multi-defect detection device, which adopts the liquid drop development and color CMOS vision collaborative detection to realize the integrated automatic identification of the cutting path pollutants, surface cracks, metal pollution and organic residues, thereby realizing the high-efficiency and low-cost automatic quality assessment. Drawings FIG. 1 is a schematic diagram of the overall structure of the present utility model; FIG. 2 is a schematic view of the electrical cabinet structure of the present utility model; FIG. 3 is a schematic view of the bottom surface of the wafer holding tray of the present utility model; FIG. 4 is a schematic view of the position of a light source according to the present utility model; fig. 5 is a schematic block diagram of the present utility model. The device comprises a display screen 1, an external industrial personal computer 2, an electrical cabinet 3, an operation button 4, a vibration-proof support 5, an x-axis sliding rail 6, an industrial camera 7, a drip holding support 8, a wafer fixing tray 9, a wafer holding area guide rail 10, a light source 12 and a cylinder. Detailed Description The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and all other embodiments obtained by those skilled in the art without mak