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CN-224231675-U - Chip thermal resistance measurement is with accuse temperature platform

CN224231675UCN 224231675 UCN224231675 UCN 224231675UCN-224231675-U

Abstract

The utility model discloses a temperature control table for measuring chip thermal resistance. The temperature control table comprises a base, a placing table and a semiconductor refrigerating piece. The placing table is fixedly connected with the base, a placing surface for placing chips is formed on the upper surface of the placing table, the placing table is a metal piece, and the semiconductor refrigerating piece is clamped between the base and the placing table and is abutted to the lower surface of the placing table. The control Wen Tai realizes the accurate control and stable maintenance of the temperature of the bottom surface of the chip through the combination of the base, the placing table and the semiconductor refrigerating piece. The placing table is a metal piece and has good heat conductivity, and the temperature of the semiconductor refrigerating piece can be quickly transferred to the chip, so that the uniformity of the temperature of the bottom surface of the chip is ensured. The semiconductor refrigerating piece is clamped between the base and the placing table, so that the dual functions of refrigeration and heating can be realized, and the temperature can be flexibly adjusted according to the heating condition of the chip in the measuring process.

Inventors

  • SHEN JINHUI
  • LIN HAOBIN
  • LIU XIANGAN

Assignees

  • 安徽凌光红外科技有限公司

Dates

Publication Date
20260512
Application Date
20250403

Claims (10)

  1. 1. The utility model provides a chip thermal resistance measurement is with accuse temperature platform which characterized in that, accuse temperature platform includes: A base (1), The placing table (2) is fixedly connected with the base (1), the upper surface of the placing table (2) forms a placing surface for placing the chip, and the placing table (2) is a metal piece; And the semiconductor refrigerating piece (3) is clamped between the base (1) and the placing table (2) and is abutted against the lower surface of the placing table (2).
  2. 2. The temperature control table for chip thermal resistance measurement according to claim 1, wherein a first positioning groove (11) is formed in the lower surface of the placement table (2), the shape of the first positioning groove (11) is matched with the shape of the semiconductor refrigerating element (3) and is in positioning fit with the semiconductor refrigerating element (3), and the upper surface of the semiconductor refrigerating element (3) is abutted to the bottom surface of the first positioning groove (11).
  3. 3. The temperature control table for chip thermal resistance measurement according to claim 1, further comprising a fastener, a through hole provided in one of the base (1) and the placement table (2), and a threaded hole provided in the other of the base (1) and the placement table (2), the fastener being threaded with the threaded hole after passing through the through hole to fix the placement table (2) to the base (1).
  4. 4. The temperature control table for chip thermal resistance measurement according to claim 1, further comprising a cooler (4), wherein the cooler (4) is interposed between the semiconductor refrigeration member (3) and the base (1) and abuts against the semiconductor.
  5. 5. The temperature control table for chip thermal resistance measurement according to claim 4, wherein a second positioning groove (21) is formed on the upper surface of the base (1), and the shape of the second positioning groove (21) is matched with the shape of the cooler (4) and is matched with the cooler (4) in a positioning way.
  6. 6. The temperature control table for chip thermal resistance measurement according to claim 4, wherein the cooler (4) comprises a red copper water-cooling block.
  7. 7. The temperature control table for chip thermal resistance measurement according to claim 6, wherein the red copper water cooling block comprises a block main body, a water inlet pipeline (41), a water outlet pipeline (42) and a cooling pipeline communicated with the water inlet pipeline (41) and the water outlet pipeline (42), wherein the water inlet pipeline (41) and the water outlet pipeline (42) are positioned on the side face of the block main body, and the cooling pipeline is positioned in the block main body.
  8. 8. The temperature control table for chip thermal resistance measurement according to claim 7 is characterized in that the water inlet pipeline (41) and the water outlet pipeline (42) are positioned on the same side of the block main body, a first notch is formed in the base (1) and used for avoiding the water inlet pipeline (41), a second notch is formed in the base (1) and used for avoiding the water outlet pipeline (42).
  9. 9. The temperature control table for chip thermal resistance measurement according to claim 4, wherein the cooler (4) is coated with heat conductive silicone grease for contact with the semiconductor refrigeration member (3).
  10. 10. The temperature control table for chip thermal resistance measurement according to claim 1, wherein the semiconductor refrigerating member (3) is coated with heat-conductive silicone grease for contact with the placement table (2).

Description

Chip thermal resistance measurement is with accuse temperature platform Technical Field The utility model belongs to the technical field of chip thermal resistance measurement, and particularly relates to a temperature control table for chip thermal resistance measurement. Background Chip thermal resistance measurement plays an important role in the electronic component thermal management technology, and the importance of the chip thermal resistance measurement is mainly that firstly, the chip performance is guaranteed, and the chip performance is reduced and even faults are caused due to the fact that the chip performance is too high. Through thermal resistance measurement, the heat radiation performance of the chip under specific conditions can be evaluated, so that the chip is ensured to effectively radiate within the design power range, and the optimal performance is maintained. 2. The service life of the chip is prolonged, the chip aging can be accelerated after long-term high-temperature work, and the service life is shortened. Reasonable thermal resistance design and management are beneficial to reducing the working temperature of the chip, so that the service cycle of the chip is prolonged. 3. Optimizing the design of the product, the thermal resistance measurement result can provide important reference for the design of the chip packaging structure, the heat dissipation scheme and the like. The magnitude of the thermal resistance is determined by the ratio of the temperature difference between the upper and lower surfaces of the chip and the input power. Because the internal structure of the chip is too tiny, the traditional temperature measuring method of the thermal resistor and the thermocouple cannot be used for measuring the temperature of the internal area of the chip, so that the current temperature measuring method of the internal area of the chip mainly adopts an infrared microscopic temperature measuring method, and the correct temperature value of the heating area of the chip is obtained after the emissivity of infrared rays emitted by the chip is corrected. The emissivity correction needs to heat the chip to a certain temperature so that infrared emission is dominant, and the correction can be performed, so that the temperature control table is an essential component. The current temperature control platform mainly adopts a heating plate to heat and control temperature, and in the thermal resistance measurement process, the chip can generate huge heat after being electrified, so that the temperature of the temperature control platform changes, and the temperature of the bottom surface of the chip (the surface temperature of the temperature control platform) can be increased due to the change, so that the calculation of the thermal resistance of the chip is influenced. Disclosure of Invention The utility model aims to provide a temperature control table for measuring chip thermal resistance, which can solve at least part of the technical problems. The first aspect of the embodiment of the utility model provides a temperature control table for measuring chip thermal resistance, which comprises; A base, a base seat and a base seat, The upper surface of the placing table forms a placing surface for placing the chip, and the placing table is a metal piece; the semiconductor refrigerating piece is clamped between the base and the placing table and is abutted to the lower surface of the placing table. The embodiment of the utility model has the main technical effects that the control Wen Tai realizes the accurate control and stable maintenance of the temperature of the bottom surface of the chip through the combination of the base, the placing table and the semiconductor refrigerating piece. The placing table is a metal piece and has good heat conductivity, and the temperature of the semiconductor refrigerating piece can be quickly transferred to the chip, so that the uniformity of the temperature of the bottom surface of the chip is ensured. The semiconductor refrigerating piece is clamped between the base and the placing table, so that the dual functions of refrigeration and heating can be realized, and the temperature can be flexibly adjusted according to the heating condition of the chip in the measuring process. After the chip is powered on, the chip itself generates heat, which may cause the surface temperature of the temperature control table to rise, thereby affecting the accuracy of thermal resistance measurement. The influence of self-heating of the chip on the temperature of the temperature control table can be effectively counteracted through the refrigerating function of the semiconductor refrigerating piece, the surface temperature of the temperature control table is maintained at a set value, and measurement errors caused by temperature fluctuation are avoided. The refrigerating function enables the temperature control table to maintain a stable temperature environment when a hi