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CN-224231831-U - Probe for spot measurement of semiconductor chip, probe holder and spot measurement device

CN224231831UCN 224231831 UCN224231831 UCN 224231831UCN-224231831-U

Abstract

The utility model relates to the technical field of chip testing and discloses a probe, a probe clamp and a spot testing device for spot testing of a semiconductor chip, wherein the probe comprises a main needle and a secondary needle, and the head of the secondary needle is connected with the main needle; the head of the main needle is provided with a needle head, the included angle between the needle head and the needle body of the main needle is an obtuse angle, the tail of the main needle and the tail of the secondary needle are both provided with needle tails, and the included angle between the needle body of the main needle and the needle body of the secondary needle is an acute angle. The utility model solves the problem of larger resistance of the existing probe, and ensures that the voltage result of a large-current product is more stable.

Inventors

  • FENG KEYAO
  • WANG TAO
  • GAO JINLU
  • ZHU TIANHAO
  • ZHANG XIANGFEI
  • LIANG FUBO

Assignees

  • 淮安澳洋顺昌光电技术有限公司

Dates

Publication Date
20260512
Application Date
20250429

Claims (10)

  1. 1. The probe for the point measurement of the semiconductor chip is characterized by comprising a main needle and a sub needle, wherein the head of the sub needle is connected with the main needle, the head of the main needle is provided with a needle head, an included angle D between the needle head and a needle body of the main needle is an obtuse angle, tail parts of the main needle and the sub needle are respectively provided with a needle tail, and an included angle alpha between the needle body of the main needle and the needle body of the sub needle is an acute angle.
  2. 2. The probe for measuring a semiconductor chip point according to claim 1, wherein an angle α between a needle body of the main needle and a needle body of the sub-needle is 10 DEG+ -1 deg.
  3. 3. The probe for measuring a semiconductor chip point according to claim 1, wherein a distance I between a point of connection between the main needle and the sub-needle and a head of the main needle is 1.9 mm or less.
  4. 4. The probe for measuring a semiconductor chip point according to claim 1, wherein an angle D between the needle head and the needle body of the main needle is 120 DEG+ -2 deg.
  5. 5. The probe for measuring a semiconductor chip point according to claim 1, wherein an angle E between the needle tail and the needle body of the main needle is 90 DEG+ -1 DEG; The included angle G between the needle tail and the needle body of the sub-needle is 90 degrees+/-1 degrees.
  6. 6. The probe for measuring a semiconductor chip point according to claim 1, wherein the height B=3.+ -. 0.2mm of the tip has a taper of 7.+ -. 1.
  7. 7. A probe holder for receiving a probe according to any one of claims 1 to 5, provided with a chuck for receiving the probe, said chuck having a locating hole provided in cooperation with said shank, said probe being secured to said chuck by a fastener.
  8. 8. The probe holder of claim 7 wherein the jaws include first and second jaws for receiving a primary needle and a secondary needle, respectively, the primary needle being secured to the first jaw by a first fastener and the secondary needle being secured to the second jaw by a second fastener.
  9. 9. The probe clamp of claim 8, wherein the first fastener and the second fastener are symmetrically disposed about a central axis of the clamp; Or the first fastening piece and the second fastening piece are arranged in a dislocation mode relative to the central axis of the clamp.
  10. 10. A spot measurement device comprising a probe holder according to any one of claims 7-9.

Description

Probe for spot measurement of semiconductor chip, probe holder and spot measurement device Technical Field The utility model relates to the technical field of chip testing, in particular to a probe for point measurement of a semiconductor chip, a probe clamp and a point measurement device. Background The main flow pressure measuring methods of the existing test machine are a constant-current two-wire pressure measuring method and a four-wire pressure measuring method (Kelvin method). The two-wire type pressure measurement method is shown in fig. 1, a method for testing one core particle by adopting two wiring probes is adopted, 4 core particles can be tested simultaneously each time aiming at the existing 8-probe machine, the production efficiency is high, but when the two-wire type pressure measurement method is used for measuring a high-current chip product, the measurement result is unstable due to the influence of wire resistance and probe contact resistance, the four-wire type pressure measurement method is shown in fig. 2, and the four-wire type pressure measurement method is adopted for testing one core particle, so that the influence of wire resistance and contact resistance can be greatly reduced, the measurement result is accurate, but the four-wire type pressure measurement method 8-probe machine can only test 2 core particles simultaneously, the machine is idle and can be used for 2 current sources, and the production efficiency is halved compared with the two-wire type pressure measurement method, so that the productivity and the waste are caused. In addition, as shown in fig. 3, the existing probe clamp has large space occupation ratio, narrow test space, and difficult practical application. Disclosure of utility model The utility model aims to solve the problems in the prior art and provides a probe for point measurement of a semiconductor chip, a probe clamp and a point measurement device. The utility model can solve the problem of larger resistance of the existing probe, so that the voltage result of the high-current product is more stable. According to the technical scheme, the probe for spot measurement of the semiconductor chip comprises a main needle and a sub needle, wherein the head of the sub needle is connected with the main needle, the head of the main needle is provided with a needle head, an included angle D between the needle head and a needle body of the main needle is an obtuse angle, tail parts of the main needle and the sub needle are respectively provided with a needle tail, and an included angle alpha between the needle body of the main needle and the needle body of the sub needle is an acute angle. The invention relates to a four-wire type voltage measuring probe, which is characterized in that a point measuring probe with a main needle and a secondary needle which are connected at the head of the probe is arranged, the voltage and the current are two parallel circuits before the connection point of the main needle and the secondary needle, and the line resistance is only the part from the needle point to the connection point, so that the problem of larger normal resistance of the two-wire type voltage measuring probe is reduced. The circuit diagram of the four-wire measurement, two-wire measurement and probe measurement machine designed by the invention is shown in fig. 11. In addition, at present, 4 chips are tested by 8 pins, the wiring mode is four serial lines and is mainly used for testing small current products, 2 chips are tested by 8 pins, the wiring mode is two parallel lines and is mainly used for testing large current products, so that when products are switched each time, a line lead from an ESD discharge box to a probe section is required to be plugged and replaced (a line from a current source to the ESD discharge box section is unchanged), and in the process, a person easily and inadvertently connects the lead between the four chips (such as a line for testing a third core particle and a line for testing a fourth core particle are mutually connected and reversely). The invention realizes that all products can be tested by using 8 needles to test four chips by arranging the point test probe with the main needle and the secondary needle which are connected with each other by the needle head, and does not need to perform line changing action when switching the products, thereby avoiding the abnormal problem of line connection error. Further, an included angle α between the needle body of the main needle and the needle body of the sub-needle is 10°±1°. Further, the distance I between the connection point of the main needle and the secondary needle and the head of the main needle is less than or equal to 1.9 mm. A certain distance is reserved between the connection point of the main needle and the secondary needle and the head of the main needle so as to be more convenient for replacing the probe. Further, an included angle D between the needle head and the nee