CN-224231895-U - Testing device

Abstract

The application discloses a testing device, relates to the technical field of semiconductors, and solves the technical problem that a testing probe is easy to wear. The testing device comprises a substrate testing assembly, wherein the substrate is provided with a bearing surface for bearing a semiconductor to be tested, the testing assembly comprises a testing probe and a driving piece, the testing probe can move to a first position and a second position relative to the substrate, the testing probe is far away from the bearing surface in the first position, the testing probe is close to the bearing surface and can be electrically connected with the semiconductor to be tested in the second position, the driving piece is connected to the substrate, and the driving piece is used for driving the testing probe to move relative to the substrate.

Inventors

• YAN XUBO
• CHEN MOHAN
• SUN HAO

Assignees

• 深圳市鹏芯微集成电路制造有限公司

Dates

Publication Date

20260512

Application Date

20250403

Claims (10)

1. 1. A test device, comprising: the substrate is provided with a bearing surface which is used for bearing the semiconductor to be tested; the test assembly comprises a test probe and a driving piece, wherein the test probe can move to a first position and a second position relative to the base body, the test probe is far away from the bearing surface in the first position, the test probe is close to the bearing surface and can be electrically connected with the semiconductor to be tested in the second position, the driving piece is connected to the base body, and the driving piece is used for driving the test probe to move relative to the base body.
2. 2. The test apparatus of claim 1, wherein the test assembly further comprises a first detection circuit for determining movement of the test probe to the second position; The driving piece is electrically connected with the first detection circuit, and the driving piece brakes the test probe based on the detection result of the first detection circuit.
3. 3. The test apparatus of claim 2, wherein the first detection circuit comprises a voltage sensing element for detecting a voltage applied by the semiconductor under test to the test probe and a processor for determining the movement of the test probe to the second position based on the voltage.
4. 4. The test apparatus of claim 1, wherein the test assembly further comprises a second detection circuit for detecting a relative position of the semiconductor under test and the substrate; The driving piece drives the test probe to move relative to the base body based on the detection result of the second detection circuit.
5. 5. The test apparatus of any one of claims 1 to 4, wherein the test probe comprises a contact portion that abuts the semiconductor under test in the second position; the surface of the contact part is an arc surface, or the axial section outline of the contact part is arranged at an obtuse angle.
6. 6. The test device of claim 5, wherein the test probe further comprises an extension connected between the contact portion and the driving member, the extension having a first dimension and a second dimension along a first direction and a second direction, respectively, the ratio of the first dimension to the second dimension ranging from 0.8 to 1.5; The first direction is parallel to the movement direction of the test probe relative to the substrate, and the second direction is perpendicular to the first direction.
7. 7. The test device of claim 5, wherein the contact portion comprises a body structure, and a wear layer surrounding the body structure, the wear layer having a material hardness greater than a material hardness of the body structure.
8. 8. The test device of any one of claims 1 to 4, further comprising a housing connected to the base, the housing provided with a receiving cavity and a via; In the first position, the test probe is accommodated in the accommodating cavity, and in the second position, at least part of the test probe penetrates through the through hole.
9. 9. The test device of claim 8, wherein the housing includes a structural surface with the via, the structural surface is flush with the bearing surface, and the housing is fixedly connected to the base.
10. 10. The test device of any one of claims 1-4, further comprising a buffer disposed between the test probe and the base, the buffer being elastically deformable at least in a direction of movement of the test probe relative to the base.

Description

Testing device Technical Field The present application relates to the field of, but is not limited to, semiconductors, and more particularly to a test apparatus. Background The testing device is used for testing the semiconductor to be tested, which can be a silicon wafer and the like, and can be used for testing the electrical parameters, physical parameters, dimensional parameters and the like of the silicon wafer. In the related art, more serious abrasion exists between the test probe and the semiconductor to be tested, the service life of the test probe is influenced, and the accuracy of the test result is low. Disclosure of utility model The testing device provided by the embodiment of the application has the technical advantages of long service life and high testing result precision, and is realized by the following scheme: The embodiment of the application provides a testing device which comprises a base body and a testing component, wherein the base body is provided with a bearing surface for bearing a semiconductor to be tested, the testing component comprises a testing probe and a driving piece, the testing probe can move to a first position and a second position relative to the base body, the testing probe is far away from the bearing surface in the first position, the testing probe is close to the bearing surface and can be electrically connected with the semiconductor to be tested in the second position, and the driving piece is connected to the base body and is used for driving the testing probe to move relative to the base body. According to the testing device provided by the embodiment of the application, the base body provides a mounting foundation for the testing component and the driving piece, the base body is further provided with the bearing surface for placing the semiconductor to be tested, the testing component comprises the testing probe, and the testing probe is used for electrically connecting the semiconductor to be tested so as to detect the characteristics of the semiconductor to be tested. On the basis, the test assembly comprises a test probe and a driving piece, the test probe can move to a first position and a second position relative to the base body, the test probe in the first position is far away from the bearing surface, and the test probe in the second position is close to the bearing surface and can be electrically connected with the semiconductor to be tested, in other words, the test probe can measure the semiconductor to be tested in the second position. The driving piece is used for driving the test probe to move relative to the base body so as to realize the switching of the test probe between the first position and the second position. Because the driving piece drives the test probe to be close to the semiconductor to be tested, and maintains the relative positions of the test probe and the semiconductor to be tested, the interaction force between the semiconductor to be tested and the test probe is small, the abrasion of the semiconductor to be tested and the test probe is not easy to cause, the semiconductor to be tested is protected, the service life of the test probe is prolonged, and the adverse effect of abrasion on a test result is reduced. Compared with the scheme that the semiconductor to be tested and the test probe in the related technology are abutted by virtue of elastic force, the test device disclosed by the application is not easy to damage the semiconductor to be tested, has a long service life and has higher measurement precision. In one possible implementation of the present application, the test assembly further includes a first detection circuit for determining movement of the test probe to the second position, and a driving member electrically connected to the first detection circuit, the driving member braking the test probe based on a detection result of the first detection circuit. Here, set up first detection circuitry, judge whether the test probe moves to the second position through first detection circuitry, the driving piece in time brakes the test probe based on the testing result of first detection circuitry to reduce the possibility that test probe and semiconductor under test produced the collision, the test probe of being convenient for accurately stays in the second position. In one possible implementation of the present application, the first detection circuit includes a voltage sensing element for detecting a voltage applied to the test probe by the semiconductor under test and a processor for determining movement of the test probe to the second position based on the voltage. The voltage sensing piece can detect the voltage of the semiconductor to be tested acting on the test probe, and the processor determines the position of the test probe based on the voltage, so that the voltage sensing piece is simple in structure and has higher precision. In one possible implementation of the present application, the test assembly fu