Search

CN-224231896-U - Module aging test unit

CN224231896UCN 224231896 UCN224231896 UCN 224231896UCN-224231896-U

Abstract

The utility model provides a module aging test unit, relate to power semiconductor module high temperature test technical field, including outer frame subassembly, lift platform subassembly, lift drive subassembly and heating module subassembly, outer frame subassembly includes outer frame roof, outer frame bottom plate and the outer frame curb plate that is located both sides, two outer frame curb plate inboards are provided with linear guide respectively, lift platform subassembly includes the probe mounting panel, both sides are provided with linear guide matched with slider, lift drive subassembly includes the mount pad, lower mount pad, the speed reducer, lead screw and screw nut, go up the intermediate position that mount pad and lower mount pad are fixed in outer frame roof and outer frame bottom plate respectively, heating module subassembly is used for fixing and heating power semiconductor module. According to the utility model, through intermediate driving and four guide rails in the circumferential direction, instability caused by a C-shaped cantilever structure of the original equipment is avoided, the rigidity and stability of the whole equipment are improved, and the repeated positioning accuracy of the equipment is also improved.

Inventors

  • WANG TIANEN
  • BU JIANMING
  • HE TINGYU
  • LIAO JIAN
  • CHAI JUNBIAO
  • YU LIANG
  • BU YUCHENG

Assignees

  • 杭州中安电子股份有限公司

Dates

Publication Date
20260512
Application Date
20250516

Claims (10)

  1. 1. The module aging test unit is characterized by comprising an outer frame assembly (10), a lifting platform assembly (20), a lifting driving assembly (30) and a heating module assembly (40); The outer frame assembly (10) comprises an outer frame top plate (11), an outer frame bottom plate (12) and outer frame side plates (13) positioned at two sides, and linear guide rails (14) are respectively arranged at the inner sides of the two outer frame side plates (13); The lifting platform assembly (20) comprises a probe mounting plate (21), two probe plate mounting positions (22) are symmetrically arranged at the bottom of the probe mounting plate (21), probe plates are respectively arranged in the probe plate mounting positions (22), and sliding blocks (23) matched with the linear guide rail (14) are arranged at two sides of the probe mounting plate (21); The lifting driving assembly (30) comprises an upper mounting seat (31), a lower mounting seat (32), a speed reducer (33), a screw rod (34) and a screw rod nut (35) on the screw rod (34), wherein the upper mounting seat (31) and the lower mounting seat (32) are respectively fixed at the middle positions of the outer frame top plate (11) and the outer frame bottom plate (12), the speed reducer (33) is fixed on the upper mounting seat (31) and the output end is provided with a driving synchronous wheel (36), the screw rod (34) penetrates through the middle of the probe mounting plate (21) and the upper end and the lower end of the screw rod (34) are respectively connected with the upper mounting seat (31) and the lower mounting seat (32) in a rotating manner through bearings, the driven synchronous wheel (37) is arranged at the upper end of the screw rod (34), the driving synchronous wheel (36) is in transmission connection with the driven synchronous wheel (37) through a synchronous belt (38), and the screw rod nut (35) is fixedly connected with the probe mounting plate (21); The heating module assemblies (40) are fixed on the outer frame base plate (12) and are two in number, correspond to the two probe boards in the lifting platform assembly (20) and are used for fixing and heating the power semiconductor modules.
  2. 2. The module aging testing unit according to claim 1, wherein the number of the linear guide rails (14) on each outer frame side plate (13) is two, and two sliding blocks (23) are respectively arranged on two sides of the corresponding probe mounting plate (21).
  3. 3. A module burn-in unit according to claim 1, wherein limit sensors (15) are provided at upper and lower positions of one of the outer frame side plates (13), respectively.
  4. 4. A module burn-in unit according to claim 3, wherein the top frame top plate (11) has a top limit post (16) at its bottom and the lower mounting base (32) has a bottom limit post (39) thereon.
  5. 5. A module burn-in unit according to claim 4, wherein the bottom limit post (39) is provided with a removable hard stop (310).
  6. 6. A module burn-in unit according to claim 5, wherein a hand-pull pin (24) is provided on the probe mounting board (21) on the front side of the probe board mounting site (22).
  7. 7. A module burn-in unit according to any one of claims 1 to 6, wherein the heating module assembly (40) comprises a heating module base plate (41), a heating plate (42) and a power semiconductor module carrier plate (43), the heating module base plate (41) is fixed on the outer frame base plate (12), and the heating module base plate (41) and the heating plate (42) are connected by a certain number of heat dissipation support columns at intervals.
  8. 8. A module burn-in unit according to claim 7, wherein the heating module base plate (41) is provided with an air inlet, and a fan (45) is installed below the air inlet.
  9. 9. A module burn-in unit according to claim 8, wherein the heating module base plate (41) and the heating plate (42) are provided with an air duct housing (46) at the outer periphery thereof.
  10. 10. A module burn-in unit according to claim 8, wherein the number of heating plates (42) and the number of power semiconductor module carriers (43) are plural and distributed in a matrix, and the number of fans (45) corresponds to the number of heating plates (42).

Description

Module aging test unit Technical Field The utility model relates to the technical field of high-temperature testing of power semiconductor modules, in particular to a module aging testing unit. Background The power semiconductor module is a core component in a power electronic system, is formed by packaging high-power semiconductor devices (such as IGBT, MOSFET, thyristor and the like) through a specific circuit design, and can realize high-efficiency electric energy conversion and control. The power semiconductor module must perform a high-temperature aging test ‌ in high-reliability scenes such as a vehicle gauge, an industrial control and the like, the yield and the service life of a product are obviously improved through accelerating stress screening, and meanwhile, multi-dimensional reliability verification is realized by combining tests such as power circulation and the like. The existing test equipment has the problems that 1, the three parts form a C-shaped cantilever structure, the equipment is stressed unevenly and is subjected to overturning moment, the structural rigidity is relatively poor, the repeated positioning precision of the probe plate during pressing down can be influenced, 2, the existing lifting driving adopts an air cylinder as a power source, only two actions of opening and closing can be realized, and the stopping of the probe plate at any position in a stroke cannot be realized. Disclosure of utility model The utility model aims to solve the defects in the prior art, and provides a module aging test unit which avoids instability caused by a C-shaped cantilever structure of the original equipment, improves the rigidity and stability of the whole equipment and improves the repeated positioning precision of the equipment through intermediate driving and four guide rails in the circumferential direction. In order to achieve the above purpose, the utility model adopts the following technical scheme: A module aging test unit comprises an outer frame assembly, a lifting platform assembly, a lifting driving assembly and a heating module assembly. The outer frame assembly comprises an outer frame top plate, an outer frame bottom plate and outer frame side plates positioned on two sides, and linear guide rails are respectively arranged on the inner sides of the two outer frame side plates. The outer frame top plate, the outer frame bottom plate and the two outer frame side plates form a frame-shaped structure, and the linear guide rail is vertically arranged. The lifting platform assembly comprises a probe mounting plate, two probe plate mounting positions are symmetrically arranged at the bottom of the probe mounting plate, probe plates are respectively arranged in the probe plate mounting positions, and sliding blocks matched with the linear guide rail are arranged on two sides of the probe mounting plate. The lifting driving assembly comprises an upper mounting seat, a lower mounting seat, a speed reducer, a screw rod and a screw rod nut on the screw rod, wherein the upper mounting seat and the lower mounting seat are respectively fixed at the middle positions of a top plate of the outer frame and a bottom plate of the outer frame, the speed reducer is fixed on the upper mounting seat, an output end of the speed reducer is provided with a driving synchronous wheel, the screw rod penetrates through the middle of the probe mounting plate, the upper end and the lower end of the screw rod are respectively connected with the upper mounting seat and the lower mounting seat through bearings in a rotating mode, the upper end of the screw rod is provided with a driven synchronous wheel, the driving synchronous wheel and the driven synchronous wheel are in transmission connection through a synchronous belt, and the screw rod nut is fixedly connected with the probe mounting plate. The speed reducer works to drive the driving synchronous wheel, the driven synchronous wheel and the screw rod to rotate, so that the screw rod nut and the lifting platform assembly are driven to do vertical linear motion, the probe board descends to a designated position to be in contact with the power semiconductor module, and then aging test work can be started, and the lifting platform assembly ascends after the test is finished. The heating module assemblies are fixed on the outer frame bottom plate, are two in number, correspond to the two probe plates in the lifting platform assembly and are used for fixing and heating the power semiconductor modules. Preferably, the number of the linear guide rails on each outer frame side plate is two, two sliding blocks are respectively arranged on two sides of the corresponding probe mounting plate, and four guide rails can enable the left probe plate and the right probe plate to have good stability and repeated positioning accuracy in the up-down movement. Preferably, limit sensors are respectively arranged at the upper and lower positions of one of the outer frame side plate