CN-224231902-U - Multi-Site test mass production plate applied to radio frequency front end chip mass production test

CN224231902UCN 224231902 UCN224231902 UCN 224231902UCN-224231902-U

Abstract

The utility model discloses a multi-Site test mass production board applied to a radio frequency front end chip mass production test. The multi-Site test mass production plate comprises a plurality of single-Site test mass production plates and a substrate, wherein the plurality of single-Site test mass production plates are arranged on the substrate in an array mode, the single-Site test mass production plates comprise a plate body, a clamp is arranged on the plate body and used for clamping a radio frequency front end chip to be tested, and a first on-board single-pole multi-throw radio frequency switch, a second on-board single-pole multi-throw radio frequency switch, a third on-board single-pole multi-throw radio frequency switch and a fourth on-board single-pole multi-throw radio frequency switch. According to the utility model, the radio frequency interfaces of the radio frequency front end chip are combined into 3 radio frequency interfaces to be connected with the ATE through each single-board carrying-pole multi-throw radio frequency switch, so that the utilization rate of test resources of the ATE is greatly reduced, the construction difficulty of a mass production test environment is effectively reduced, the test cost is reduced, the frequent switching of signal source interfaces of the ATE is avoided, the test time is shortened, and the test efficiency is improved.

Inventors

XIA WENZE

Assignees

北京唯捷创芯精测科技有限责任公司

Dates

Publication Date: 20260512
Application Date: 20250121

Claims (10)

1. A multi-Site test mass production board applied to a radio frequency front end chip mass production test, comprising: A plurality of single Site test mass production boards and a substrate, the plurality of single Site test mass production boards being arranged in an array on the substrate; The single Site test mass production board includes: The board body, be equipped with on the board body: The fixture is used for clamping the radio frequency front end chip to be tested, and is provided with a first pin corresponding to a signal input port of the radio frequency front end chip, a second pin corresponding to a first signal output port of the radio frequency front end chip, a third pin corresponding to a second signal output port of the radio frequency front end chip and a fourth pin corresponding to a signal input output port of the radio frequency front end chip; the first on-board single-pole multi-throw radio frequency switch is connected with the first pin through an inter-board bus; The second onboard single-pole multi-throw radio frequency switch is connected with the first onboard single-pole multi-throw radio frequency switch through an inter-board bus; The third onboard single-pole multi-throw radio frequency switch is respectively connected with the second onboard single-pole multi-throw radio frequency switch and the second pin through an inter-board bus; And the fourth on-board single-pole multi-throw radio frequency switch is connected with the fourth pin and the second on-board single-pole multi-throw radio frequency switch through an inter-board bus respectively.
2. The multi-Site test mass production board for use in rf front end chip mass production testing of claim 1, further comprising: the first SMA interface is connected with the first onboard single-pole multi-throw radio frequency switch through an inter-board bus; The second SMA interface is connected with the third onboard single-pole multi-throw radio frequency switch through an inter-board bus; The third SMA interface is connected with the third pin through an inter-board bus; The single Site test mass production board is connected with an integrated circuit automatic tester through the first SMA interface, the second SMA interface and the third SMA interface.
3. The multi-Site test panel for RF front-end chip mass production test as described in claim 2, wherein, The number of pins of the first onboard single-pole multi-throw radio frequency switch is greater than or equal to the sum of the number of the first pins and the first SMA interface; The number of pins of the second onboard single-pole multi-throw radio frequency switch is larger than or equal to the sum of the number of the first onboard single-pole multi-throw radio frequency switch, the number of the third onboard single-pole multi-throw radio frequency switch and the number of the fourth onboard single-pole multi-throw radio frequency switch; the pin number of the third onboard single-pole multi-throw radio frequency switch is larger than or equal to the sum of the number of the second onboard single-pole multi-throw radio frequency switch, the second pins and the second SMA interface; the number of pins of the fourth on-board single-pole multi-throw radio frequency switch is greater than or equal to the sum of the number of the fourth pins and the number of the second on-board single-pole multi-throw radio frequency switch.
4. The multi-Site test mass production board for rf front end chip mass production testing of claim 1, wherein the fixture further comprises: a first interface corresponding to a DC pin of the radio frequency front end chip; And a second interface corresponding to the digital pin of the radio frequency front end chip.
5. The multi-Site test mass production board applied to the radio frequency front end chip mass production test of claim 1, wherein a plurality of first mounting holes which are uniformly distributed are arranged in the middle of the board body; And mounting the single Site test mass production board on the substrate through the first mounting hole.
6. The multi-Site test panel for RF front-end chip mass production test as described in claim 2, wherein, A plurality of second mounting holes corresponding to the grounding pins of the first SMA interface are formed in the upper left corner area of the plate body; A plurality of third mounting holes corresponding to the grounding pins of the third SMA interface are formed in the upper right corner area of the plate body; a plurality of fourth mounting holes corresponding to the grounding pins of the second SMA interface are formed in the lower right corner area of the plate body; And the first SMA interface, the third SMA interface and the second SMA interface are respectively fixed on the single Site test mass production plate through the second mounting hole, the third mounting hole and the fourth mounting hole.
7. The multi-Site test mass production board for rf front end chip mass production testing of claim 4, wherein the board body further comprises: The first DC interface is arranged in the left lower corner area of the board body and is connected with the first interface through an inter-board bus; The first digital interface is arranged in the left lower corner area of the board body, and the first digital interface is connected with the second interface through an inter-board bus; A fifth pin connected with the first interface through an inter-board bus; and the sixth pin is connected with the second interface through an inter-board bus.
8. The multi-Site test volume production board for rf front-end chip volume production testing of claim 7, wherein the substrate further comprises: a plurality of third interfaces corresponding to the fifth pins; a plurality of fourth interfaces corresponding to the sixth pins; a plurality of second DC interfaces, each of which is respectively connected with a set number of third interfaces through an inter-board bus; and the second digital interfaces are respectively connected with the fourth interfaces of the set number through inter-board buses.
9. The multi-Site test volume production board for use in rf front end chip volume production testing of claim 7, wherein the fixture further comprises: And the grounding interface corresponds to the grounding pin of the radio frequency front end chip.
10. The multi-Site test mass production board for RF front-end chip mass production test of claim 2, wherein, One pin of the second onboard single-pole multi-throw radio frequency switch is connected with one pin of the first onboard single-pole multi-throw radio frequency switch through an inter-board bus; one pin of the third onboard single-pole multi-throw radio frequency switch is connected with one pin of the second onboard single-pole multi-throw radio frequency switch through an inter-board bus; one pin of the fourth onboard single-pole multi-throw radio frequency switch is connected with one pin of the second onboard single-pole multi-throw radio frequency switch through an inter-board bus; the first SMA interface is connected with one pin of the first onboard single-pole multi-throw radio frequency switch through an inter-board bus; and the second SMA interface is connected with one pin of the third onboard single-pole multi-throw radio frequency switch through an inter-board bus.

Description

Multi-Site test mass production plate applied to radio frequency front end chip mass production test Technical Field The utility model relates to the technical field of chip testing, in particular to a multi-Site test mass production board applied to radio frequency front end chip mass production test. Background At present, the radio frequency front end chip is widely applied to various electronic devices, such as mobile phones, tablet computers, routers and the like, and each radio frequency front end chip is required to be subjected to strict mass production test before formal shipment, so that the quality and performance of the chip are ensured to meet the requirements of customers. Along with the increasing number of communication frequency bands supported by the rf front-end system, the design is also more and more complex, and under the requirement, the modularity of the rf front-end chip becomes a necessary trend, so that the result is that the interfaces of the rf front-end chip are more and more. The mass production test of the radio frequency front end chip adopts ATE (Automatic Test Equipment ) to test, the radio frequency resource of each ATE is limited, and along with the increase of the complexity of the radio frequency front end chip, when the radio frequency interface of one chip is too many, more ATE test resources are occupied at the moment, and the condition of insufficient test resources can be caused. Meanwhile, in order to improve the test efficiency, a multi-Site test method is generally adopted, so that more radio frequency resources are required. Fig. 4 shows a certain rf PA product, which has 18 external rf interfaces, and takes a common rf tester PAx RD in the market as an example, and has only 32 rf resources, and the conventional test method can only perform a single Site test, so that multiple Site tests cannot be implemented. If multiplexing switch matrices are used externally to connect together the same type of interfaces to reduce the use of ATE resources, very complex RF wiring and very complex switch matrix power wiring are required when the production line is set up for a mass production environment, and multiplexing switch matrices are typically expensive. The information disclosed in the background section of the utility model is only for enhancement of understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art. Disclosure of utility model The utility model aims to provide a multi-Site test mass production board applied to the mass production test of a radio frequency front end chip, which solves the problems of insufficient test resources and complex construction of a mass production environment in the mass production test of the radio frequency chip, effectively reduces the ATE radio frequency test resources occupied by the same station, improves the resource reuse rate of ATE, effectively reduces the construction difficulty of the mass production test environment, reduces the test cost, saves the ATE radio frequency test resources, enables one ATE to realize more sites, avoids frequent switching of signal source interfaces of the ATE, reduces the test time and improves the test efficiency. In order to achieve the above objective, the present utility model provides a multi-Site test mass production board applied to a radio frequency front end chip mass production test, comprising: A plurality of single Site test mass production boards and a substrate, the plurality of single Site test mass production boards being arranged in an array on the substrate; The single Site test mass production board includes: The board body, be equipped with on the board body: The fixture is used for clamping the radio frequency front end chip to be tested, and is provided with a first pin corresponding to a signal input port of the radio frequency front end chip, a second pin corresponding to a first signal output port of the radio frequency front end chip, a third pin corresponding to a second signal output port of the radio frequency front end chip and a fourth pin corresponding to a signal input output port of the radio frequency front end chip; the first on-board single-pole multi-throw radio frequency switch is connected with the first pin through an inter-board bus; The second onboard single-pole multi-throw radio frequency switch is connected with the first onboard single-pole multi-throw radio frequency switch through an inter-board bus; The third onboard single-pole multi-throw radio frequency switch is respectively connected with the second onboard single-pole multi-throw radio frequency switch and the second pin through an inter-board bus; And the fourth on-board single-pole multi-throw radio frequency switch is connected with the fourth pin and the second on-board single-pole multi-throw radio frequency switch through