CN-224231907-U - Test signal acquisition mechanism and wafer aging test device comprising same

CN224231907UCN 224231907 UCN224231907 UCN 224231907UCN-224231907-U

Abstract

The application relates to the technical field of wafer performance detection and discloses a test signal acquisition mechanism and a wafer aging test device comprising the same, wherein the test signal acquisition mechanism comprises a mounting frame, a test signal acquisition mechanism and a test signal acquisition mechanism, wherein the mounting frame is provided with a mounting channel, the mounting frame comprises a mounting plate, and the mounting plate is arranged at the end of the mounting channel; the collecting board assembly comprises a collecting board and a collecting board connector, wherein the collecting board connector is arranged at the end of the collecting board, the collecting board connector can move in the mounting channel, and the collecting board connector and the collecting line connector are inserted into each other. Based on the combined action of the technical characteristics, on the premise of realizing the efficient, accurate and stable acquisition performance of the test signal acquisition mechanism, the disassembly and assembly efficiency of the component maintenance after the test is improved, and the smooth performance of the wafer aging performance test is ensured.

Inventors

MA ZHAO
WANG YONG
XU PENGSONG
YANG MINFENG

Assignees

苏州联讯仪器股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250427

Claims (10)

1. A test signal acquisition mechanism, comprising: A mounting frame having a mounting channel, the mounting frame comprising a mounting plate disposed at an end of the mounting channel; The collecting line assembly comprises a collecting line and a collecting line connector, the collecting line connector is arranged on the mounting plate, one end of the collecting line connector faces the mounting channel, and the other end of the collecting line connector is connected with the collecting line; The collecting board assembly comprises a collecting board and a collecting board connector, wherein the collecting board connector is arranged at the end of the collecting board, and the collecting board assembly can move in the mounting channel, so that the collecting board connector and the collecting line connector are inserted.
2. The test signal acquisition mechanism of claim 1, wherein, The collecting plate is provided with a guide nail which is close to the collecting plate connector and extends towards one side away from the collecting plate; The mounting plate is provided with a guide hole corresponding to the guide pin, and the guide pin can be embedded into the guide hole so as to provide positioning for the insertion of the acquisition board connector and the acquisition line connector.
3. The test signal acquisition mechanism of claim 2, wherein the acquisition board is provided with a connection block, the guide pin is arranged on the connection block, and the guide pin and the acquisition board are arranged in a staggered manner along the extending direction of the mounting channel.
4. The test signal acquisition mechanism of claim 1 or 2, wherein, The collecting plate is provided with a guide seat, the guide seat is arranged close to the collecting plate connector, the guide seat is provided with a positioning groove, and an opening of the positioning groove is arranged on one side away from the collecting plate; Be equipped with on the mounting panel with the guide post that the constant head tank corresponds, the guide post orientation one side of installation passageway extends, the guide post can inlay establish to in the constant head tank, in order to be used for gather the board connector with gather the line connector's butt joint provides the location.
5. The test signal acquisition mechanism of claim 1, wherein the mounting frame comprises two coamings and two guide plates, the coamings and the guide plates are arranged adjacently, the two coamings and the two guide plates are arranged adjacently to form the mounting channel, and two ends of the mounting plate are connected with the two guide plates.
6. The test signal acquisition mechanism of claim 5, wherein at least one of the guide plates is provided with a guide slot disposed on a side of the guide plate facing the mounting channel, the guide slot being disposed along an extension of the mounting channel, the acquisition plate being insertable into the guide slot for guiding movement of the acquisition plate.
7. The test signal acquisition mechanism of claim 6, wherein a cross-sectional dimension of the guide slot along the extension of the mounting channel is not less than a radial dimension of the acquisition plate.
8. The test signal acquisition mechanism of claim 6, wherein the number of guide slots is a plurality, the plurality of guide slots being sequentially spaced apart along a direction of extension perpendicular to the mounting channel.
9. The test signal acquisition mechanism of claim 1, wherein the mounting plate is provided with a clamping groove and a fixing member, the acquisition line connector is used for allowing an insertion end of the acquisition board connector to be inserted into the clamping groove, and the fixing member is at least arranged on one side of the acquisition line connector and used for fixing the acquisition line connector on the mounting plate.
10. A wafer burn-in apparatus, comprising: a probe card assembly; The heat sink assembly is used for supporting the wafer and closing the mold with the probe board assembly to form a test cavity for testing the wafer; The alignment mechanism is used for driving the heat sink assembly to align relative to the probe board assembly so as to form the test cavity; the electric control assembly is electrically connected with the alignment mechanism and used for controlling the alignment mechanism to move; At least one test signal acquisition mechanism according to any one of claims 1-9, wherein any one of the test signal acquisition mechanisms is electrically connected to the probe board assembly and the heat sink assembly through the acquisition line assembly, respectively, for acquiring wafer electrical performance data within the test cavity.

Description

Test signal acquisition mechanism and wafer aging test device comprising same Technical Field The application relates to the technical field of wafer performance detection, in particular to a test signal acquisition mechanism and a wafer aging test device comprising the same. Background In the process of performing the wafer burn-in performance test, in order to monitor and record various performance indexes of the wafer in real time, a large number of acquisition lines must be deployed to collect test data, so that each acquisition line is responsible for transmitting specific data of the wafer in the test process, thereby causing a problem of huge number of acquisition lines. In the existing acquisition device for testing the aging performance of the wafer, the acquisition board needs to be pulled out from the aging testing equipment for inspection or replacement whenever the maintenance operation of the acquisition board is needed, at this time, an operator needs to manually dismantle all the acquisition lines on the acquisition board one by one, and after the maintenance is finished, the acquisition lines need to be manually connected again when the acquisition board needs to be reinstalled in situ again. Such dismouting process all can go on repeatedly in carrying out the maintenance of collection board at every turn, and including three-layer collection module in the ageing test equipment, include more than 200 collection lines and 10 a plurality of collection boards in each layer collection module again, this means that at least need install 20 collection lines on a collection board, even if only draw a collection board when collection board is maintained, also need to repeat dismouting operation 40 times to the collection line on this collection board, this undoubtedly has increased operating personnel's work load for dismouting work becomes unusual loaded down with trivial details. Meanwhile, due to the fact that the internal space of the aging test equipment is limited, the layout of the acquisition lines is very dense, and the staggering among the acquisition lines is very disordered, the disassembly and assembly process is time-consuming, the operation is very inconvenient, and the complexity and difficulty of work are increased. Disclosure of Invention Aiming at the problems in the prior art, the application aims to solve the defects that in the wafer ageing performance test, the number of the acquisition lines is huge, the disassembly and assembly are complicated, and the acquisition lines are limited by the internal space of ageing test equipment, so that the acquisition board maintenance operation process is complex and the efficiency is low. In order to solve the above problems, the present application provides a test signal acquisition mechanism and a wafer burn-in test device including the same, which includes: A mounting frame having a mounting channel, the mounting frame comprising a mounting plate disposed at an end of the mounting channel; The collecting line assembly comprises a collecting line and a collecting line connector, the collecting line connector is arranged on the mounting plate, one end of the collecting line connector faces the mounting channel, and the other end of the collecting line connector is connected with the collecting line; The collecting board assembly comprises a collecting board and a collecting board connector, wherein the collecting board connector is arranged at the end of the collecting board, and the collecting board assembly can move in the mounting channel, so that the collecting board connector and the collecting line connector are inserted. Preferably, the collecting plate is provided with a guide nail, and the guide nail is arranged close to the collecting plate connector and extends towards one side away from the collecting plate; The mounting plate is provided with a guide hole corresponding to the guide pin, and the guide pin can be embedded into the guide hole so as to provide positioning for the insertion of the acquisition board connector and the acquisition line connector. Preferably, the collecting plate is provided with a connecting block, the guide nails are arranged on the connecting block and along the extending direction of the mounting channel, and the guide nails and the collecting plate are arranged in a staggered mode. Preferably, a guide seat is arranged on the collecting plate, the guide seat is arranged close to the collecting plate connector, a positioning groove is arranged on the guide seat, and an opening of the positioning groove is arranged on one side away from the collecting plate; Be equipped with on the mounting panel with the guide post that the constant head tank corresponds, the guide post orientation one side of installation passageway extends, the guide post can inlay establish to in the constant head tank, in order to be used for gather the board connector with gather the line connector's butt joint provides the