CN-224231908-U - Wafer aging test equipment and test system

CN224231908UCN 224231908 UCN224231908 UCN 224231908UCN-224231908-U

Abstract

The application relates to wafer aging test equipment and a test system, wherein each test unit comprises at least one aging test device, the at least one aging test device is stacked in the vertical direction, any aging test device comprises a test assembly, an electric control assembly and a test signal acquisition mechanism, the test assembly comprises a probe plate assembly, a heat sink assembly and an alignment mechanism, the alignment mechanism is electrically connected with the electric control assembly to realize alignment and cavity combination of the probe plate assembly and the heat sink assembly, and the probe plate assembly and the heat sink assembly are respectively electrically connected with the test signal acquisition mechanism to realize electrical property test of corresponding wafers. The wafer aging test equipment has remarkable advantages in the aspects of space utilization, test flow optimization, operation convenience, adaptation to special environmental conditions and the like, and can meet the requirements of high precision, high reliability and high efficiency of wafer aging test under high-temperature and high-pressure environments.

Inventors

MA ZHAO
WANG YONG
XU PENGSONG
YANG MINFENG

Assignees

苏州联讯仪器股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250427

Claims (10)

1. The wafer burn-in equipment is characterized by comprising at least one test unit, wherein each test unit comprises at least one burn-in device, and at least one burn-in device is stacked along the vertical direction; The burn-in testing device comprises a testing assembly, an electric control assembly and a testing signal acquisition mechanism, wherein the testing assembly comprises a probe plate assembly, a heat sink assembly and an alignment mechanism, the alignment mechanism is electrically connected with the electric control assembly to realize alignment and cavity combination of the probe plate assembly and the heat sink assembly, and the probe plate assembly and the heat sink assembly are respectively electrically connected with the testing signal acquisition mechanism to realize electrical property testing of corresponding wafers.
2. The wafer burn-in apparatus of claim 1 comprising at least 2 test groups, at least 2 of said test groups being disposed in parallel along a same direction of extension.
3. The wafer burn-in apparatus of claim 1 wherein said test assembly, electronic control assembly and said test signal acquisition mechanism are arranged in a linear array in said burn-in device.
4. The wafer burn-in apparatus of claim 1 wherein said heat sink assembly comprises a heat sink housing having a removable heat sink disposed therein; The bottom of the heat sink outer frame is provided with at least one air inlet, the bottom surface of the heat sink is provided with an air vent corresponding to the at least one air inlet, and the inside of the heat sink outer frame is provided with an air passage communicated with the air inlet and the air vent.
5. The wafer burn-in apparatus of claim 1, wherein the burn-in device comprises a gantry within which the heat sink assembly and alignment mechanism are movably disposed.
6. The wafer burn-in apparatus of claim 5, wherein the burn-in apparatus comprises a visual positioning mechanism coupled to the gantry and positioned between the probe card assembly and the heat sink assembly.
7. The wafer burn-in apparatus of claim 6, wherein said vision positioning mechanism comprises a bi-directional vision camera and a bi-directional movement assembly; The bidirectional visual field camera is arranged on the bidirectional moving assembly, and the bidirectional moving assembly is connected with the portal frame and used for driving the bidirectional visual field camera to move along a first direction and a second direction.
8. The wafer burn-in apparatus of claim 4, wherein said alignment mechanism comprises a first alignment assembly, a second alignment assembly, and a third alignment assembly; The first alignment assembly is arranged on the bottom supporting plate along a first direction, the second alignment assembly is arranged above the first alignment assembly along a second direction and is in sliding connection with the first alignment assembly, and the third alignment assembly is arranged above the second alignment assembly and is used for supporting the heat sink assembly and driving the heat sink assembly to move in a third direction.
9. The wafer burn-in apparatus of claim 8, wherein said alignment mechanism further comprises an angle adjustment assembly coupled to said heat sink housing for rotating said heat sink housing about an axis thereof.
10. A wafer burn-in system comprising a wafer blanking apparatus, a wafer transporting apparatus, and the wafer burn-in apparatus of any one of claims 1-9; Along the extending direction of the wafer conveying equipment, the wafer blanking equipment and the wafer aging testing equipment are arranged on the same side of the wafer conveying equipment.

Description

Wafer aging test equipment and test system Technical Field The application relates to the technical field of wafer testing, in particular to wafer aging testing equipment and a testing system. Background In the field of modern semiconductor manufacturing, wafer burn-in test is used as a key link for guaranteeing the quality and reliability of chips, and with the continuous progress of semiconductor technology, the requirements on the efficiency, the precision and the stability of the chips are also increasingly stringent. On one hand, the existing wafer aging test equipment has the problems of distributed layout, large occupied space, low test efficiency and difficulty in meeting the requirement of mass production. On the other hand, the stability of the equipment structure is poor, and the problems of performance reduction, frequent faults and the like easily occur under special test environments such as high temperature, high pressure and the like, so that the stability of the test is affected. Disclosure of utility model In order to solve the problems that the wafer burn-in test equipment in the prior art cannot efficiently utilize space, has high productivity, has poor stability and adaptability to special environments and the like. The application provides wafer burn-in test equipment, which comprises at least one test unit, wherein each test unit comprises at least one burn-in test device, and at least one burn-in test device is stacked along the vertical direction; The burn-in testing device comprises a testing assembly, an electric control assembly and a testing signal acquisition mechanism, wherein the testing assembly comprises a probe plate assembly, a heat sink assembly and an alignment mechanism, the alignment mechanism is electrically connected with the electric control assembly to realize alignment and cavity combination of the probe plate assembly and the heat sink assembly, and the probe plate assembly and the heat sink assembly are respectively electrically connected with the testing signal acquisition mechanism to realize electrical property testing of corresponding wafers. Further, the test device comprises at least 2 test units, and at least 2 test units are arranged in parallel along the same extending direction. Further, the test assembly, the electric control assembly and the test signal acquisition mechanism are arranged in a line in the aging test device. Further, the heat sink assembly comprises a heat sink outer frame, and a detachable heat sink is arranged in the heat sink outer frame; The bottom of the heat sink outer frame is provided with at least one air inlet, the bottom surface of the heat sink is provided with an air vent corresponding to the at least one air inlet, and the inside of the heat sink outer frame is provided with an air passage communicated with the air inlet and the air vent. Further, the burn-in apparatus includes a gantry within which the heat sink assembly and the alignment mechanism are movably disposed. Further, the burn-in apparatus includes a visual positioning mechanism coupled to the gantry and positioned between the probe card assembly and the heat sink assembly; The visual positioning mechanism comprises a bidirectional visual field camera and a bidirectional moving assembly, wherein the bidirectional visual field camera is arranged on the bidirectional moving assembly, and the bidirectional moving assembly is connected with the portal frame and used for driving the bidirectional visual field camera to move along a first direction and a second direction. Further, the portal frame comprises a bottom plate, a top plate and a plurality of upright posts; The plurality of stand evenly distributed in the bottom plate both sides, the roof is located the top of stand, and with stand fixed connection, the roof is used for fixed probe board subassembly. Further, the alignment mechanism comprises a first alignment assembly, a second alignment assembly and a third alignment assembly; The first alignment assembly is arranged on the bottom supporting plate along a first direction, the second alignment assembly is arranged above the first alignment assembly along a second direction and is in sliding connection with the first alignment assembly, and the third alignment assembly is arranged above the second alignment assembly and is used for supporting the heat sink assembly and driving the heat sink assembly to move in a third direction. Further, the alignment mechanism further comprises an angle adjusting assembly, and the angle adjusting assembly is connected with the heat sink outer frame and used for driving the heat sink outer frame to rotate around the axis of the heat sink outer frame. The application also provides a wafer aging test system, which comprises a wafer blanking device, a wafer transporting device and the wafer aging test device; Along the extending direction of the wafer conveying equipment, the wafer blanking equipment and the wafer aging tes