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CN-224231909-U - Fault monitoring circuit, chip and vehicle

CN224231909UCN 224231909 UCN224231909 UCN 224231909UCN-224231909-U

Abstract

The application is suitable for the technical field of fault monitoring and provides a fault monitoring circuit, a chip and a vehicle. The fault monitoring circuit comprises a first voltage monitoring module, a second voltage monitoring module, a third voltage monitoring module and a storage module, wherein the first voltage monitoring module, the second voltage monitoring module, the third voltage monitoring module and the storage module are all arranged in a chip, and the first voltage monitoring module, the second voltage monitoring module and the third voltage monitoring module are respectively and electrically connected with the storage module. The fault monitoring circuit provided by the embodiment of the application can monitor the change conditions of the reference voltage, the power supply voltage and the power supply voltage in real time. When the voltage in the chip is abnormal, the abnormal monitoring signal can be rapidly positioned by reading the monitoring signal in the storage module, so that the module corresponding to the abnormal monitoring signal is determined, and the fault positioning in the chip is realized.

Inventors

  • CAO CHANGFENG

Assignees

  • 湖南紫荆半导体有限公司

Dates

Publication Date
20260512
Application Date
20250430

Claims (10)

  1. 1. The fault monitoring circuit is characterized by being arranged in a chip and comprises a first voltage monitoring module, a second voltage monitoring module, a third voltage monitoring module and a storage module, wherein the first voltage monitoring module, the second voltage monitoring module and the third voltage monitoring module are respectively and electrically connected with the storage module; The first voltage monitoring module is used for receiving the reference voltage in the chip and outputting a first monitoring signal according to the reference voltage, the second voltage monitoring module is used for receiving the power supply voltage of the chip and outputting a second monitoring signal according to the power supply voltage, the third voltage monitoring module is used for receiving the power supply voltage in the chip and outputting a third monitoring signal according to the power supply voltage, and the storage module is used for storing the first monitoring signal, the second monitoring signal and the third monitoring signal.
  2. 2. The fault monitoring circuit of claim 1, wherein the first voltage monitoring module comprises at least one first voltage monitoring unit, all of the first voltage monitoring units being electrically connected to the memory module, the first monitoring signal comprising at least one first monitoring sub-signal; Each first voltage monitoring unit is used for receiving a reference voltage in the chip and outputting the first monitoring sub-signals according to the reference voltage and the reference voltage corresponding to the first voltage monitoring unit.
  3. 3. The fault monitoring circuit of claim 2, wherein the first voltage monitoring unit comprises a first resistor, a first switching tube and an inverter, a first end of the first resistor is used for being electrically connected with a first power supply, a second end of the first resistor is respectively electrically connected with a drain electrode of the first switching tube and an input end of the inverter, a grid electrode of the first switching tube is used for receiving a reference voltage, a source electrode of the first switching tube is grounded, and an output end of the inverter is electrically connected with the memory module.
  4. 4. The fault monitoring circuit of claim 1, wherein the second voltage monitoring module comprises at least one second voltage monitoring unit, all of the second voltage monitoring units being electrically connected to the memory module, the second monitoring signal comprising at least one second monitoring sub-signal; Each second voltage monitoring unit is used for receiving one power supply voltage of the chip and outputting the second monitoring sub-signals according to the power supply voltage and the reference voltage corresponding to the second voltage monitoring unit.
  5. 5. The fault monitoring circuit of claim 4, wherein the second voltage monitoring unit comprises a second resistor, a third resistor, and a first comparator, a first end of the second resistor is configured to receive a supply voltage, a second end of the second resistor is electrically connected to the first end of the third resistor and the first input end of the first comparator, a second end of the third resistor is grounded, a second input end of the first comparator is configured to receive a reference voltage corresponding to the second voltage monitoring unit, and an output end of the first comparator is electrically connected to the memory module.
  6. 6. The fault monitoring circuit of claim 1, wherein the third voltage monitoring module comprises at least one third voltage monitoring unit, all of the third voltage monitoring units being electrically connected to the memory module, the third monitoring signal comprising at least one third monitoring sub-signal; Each third voltage monitoring unit is used for receiving one power supply voltage in the chip and outputting the third monitoring sub-signals according to the power supply voltage and the reference voltage corresponding to the third voltage monitoring unit.
  7. 7. The fault monitoring circuit of claim 6, wherein the third voltage monitoring unit comprises a fourth resistor, a fifth resistor, and a second comparator, the first end of the fourth resistor is configured to receive a power supply voltage, the second end of the fourth resistor is electrically connected to the first end of the fifth resistor and the first input end of the second comparator, the second end of the fifth resistor is grounded, the second input end of the second comparator is configured to receive a reference voltage corresponding to the third voltage monitoring unit, and the output end of the second comparator is electrically connected to the memory module.
  8. 8. The fault monitoring circuit of any one of claims 1-7, further comprising an encoding module having a plurality of inputs respectively electrically connected to the first voltage monitoring module, the second voltage monitoring module, and the third voltage monitoring module, and an output electrically connected to the storage module; The encoding module is used for receiving the first monitoring signal, the second monitoring signal and the third monitoring signal, performing compression encoding on the first monitoring signal, the second monitoring signal and the third monitoring signal, and transmitting the compressed and encoded signals to the storage module.
  9. 9. A chip comprising the fault monitoring circuit of any one of claims 1-8.
  10. 10. A vehicle comprising the chip of claim 9.

Description

Fault monitoring circuit, chip and vehicle Technical Field The application belongs to the technical field of fault monitoring, and particularly relates to a fault monitoring circuit, a chip and a vehicle. Background In modern electronic systems, stable operation of the chip is critical. The chip typically contains a plurality of power modules to provide the required voltages for the different parts. In order to ensure the reliability and stability of the system, a fault monitoring circuit is usually integrated in the chip to monitor whether the power supply voltage output by each power supply module is normal in real time. However, although the fault monitoring circuit in the conventional chip can detect the abnormality of the power supply voltage, it is generally impossible to accurately identify the power supply module that has failed. This results in difficulty for engineers to quickly locate a failed power supply module when the power supply voltage is abnormal and the failure monitoring circuit outputs a monitoring signal. Disclosure of utility model The embodiment of the application provides a fault monitoring circuit, a chip and a vehicle, which can solve the problem that an engineer is difficult to quickly locate a power module with a fault because the existing fault monitoring circuit cannot accurately identify the power module with the fault. In a first aspect, an embodiment of the present application provides a fault monitoring circuit, where the fault monitoring circuit is disposed in a chip, and the fault monitoring circuit includes a first voltage monitoring module, a second voltage monitoring module, a third voltage monitoring module, and a storage module, where the first voltage monitoring module, the second voltage monitoring module, and the third voltage monitoring module are electrically connected to the storage module respectively; The first voltage monitoring module is used for receiving the reference voltage in the chip and outputting a first monitoring signal according to the reference voltage, the second voltage monitoring module is used for receiving the power supply voltage of the chip and outputting a second monitoring signal according to the power supply voltage, the third voltage monitoring module is used for receiving the power supply voltage in the chip and outputting a third monitoring signal according to the power supply voltage, and the storage module is used for storing the first monitoring signal, the second monitoring signal and the third monitoring signal. In a possible implementation manner of the first aspect, the first voltage monitoring module includes at least one first voltage monitoring unit, all the first voltage monitoring units are electrically connected with the storage module, and the first monitoring signal includes at least one first monitoring sub-signal; Each first voltage monitoring unit is used for receiving a reference voltage in the chip and outputting the first monitoring sub-signals according to the reference voltage and the reference voltage corresponding to the first voltage monitoring unit. In one possible implementation manner of the first aspect, the first voltage monitoring unit includes a first resistor, a first switching tube and an inverter, a first end of the first resistor is used for being electrically connected with a first power supply, a second end of the first resistor is electrically connected with a drain electrode of the first switching tube and an input end of the inverter respectively, a gate electrode of the first switching tube is used for receiving a reference voltage, a source electrode of the first switching tube is grounded, and an output end of the inverter is electrically connected with the storage module. In a possible implementation manner of the first aspect, the second voltage monitoring module includes at least one second voltage monitoring unit, all the second voltage monitoring units are electrically connected with the storage module, and the second monitoring signal includes at least one second monitoring sub-signal; Each second voltage monitoring unit is used for receiving one power supply voltage of the chip and outputting the second monitoring sub-signals according to the power supply voltage and the reference voltage corresponding to the second voltage monitoring unit. In a possible implementation manner of the first aspect, the second voltage monitoring unit includes a second resistor, a third resistor, and a first comparator, a first end of the second resistor is configured to receive a supply voltage, a second end of the second resistor is electrically connected to the first end of the third resistor and a first input end of the first comparator, a second end of the third resistor is grounded, a second input end of the first comparator is configured to receive a reference voltage corresponding to the second voltage monitoring unit, and an output end of the first comparator is electrically connected to the