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CN-224231913-U - Semiconductor chip processing testing device

CN224231913UCN 224231913 UCN224231913 UCN 224231913UCN-224231913-U

Abstract

The utility model relates to the technical field of semiconductor chip equipment and provides a semiconductor chip processing and testing device which comprises a test bench and a fixed plate and is characterized in that the top of the fixed plate is movably connected with a movable column, the top of the movable column is fixedly connected with a connecting plate, the top of the connecting plate is fixedly connected with two buffer springs, the tops of the two buffer springs are fixedly connected with connecting blocks, one opposite side of each connecting block is fixedly connected with a supporting block, the top of each supporting block is fixedly provided with a pull ring, the bottom of each supporting block is fixedly connected with two suckers, one side of the test bench is provided with an adjusting component, a motor is started to enable a threaded block to slide on the outer surface of a threaded rod so as to drive a test frame to test a chip forwards and backwards, and a rotating handle drives the threaded column to drive the test frame to test the chip leftwards and rightwards through the linkage column.

Inventors

  • SHI CHUNJING
  • ZHANG XINFENG

Assignees

  • 北京恒芯通科技有限公司

Dates

Publication Date
20260512
Application Date
20250515

Claims (8)

  1. 1. A semiconductor chip processing testing device comprises a testing table (1) and a fixing plate (2) and is characterized in that a movable column (201) is movably connected to the top of the fixing plate (2), a connecting plate (202) is fixedly connected to the top of the movable column (201), two buffer springs (203) are fixedly connected to the top of the connecting plate (202), connecting blocks (204) are fixedly connected to the tops of the two buffer springs (203), supporting blocks (205) are fixedly connected to opposite sides of the two connecting blocks (204), pull rings (206) are fixedly arranged on the tops of the supporting blocks (205), two suckers (207) are fixedly connected to the bottoms of the supporting blocks (205), and an adjusting assembly is arranged on one side of the testing table (1).
  2. 2. The semiconductor chip processing and testing device according to claim 1, wherein the adjusting assembly comprises an L-shaped frame (101), the L-shaped frame (101) is fixedly connected to the outer surface of one side of the test bench (1), a motor (102) is fixedly arranged on one side of the L-shaped frame (101), a rotating shaft (103) is fixedly connected to an output shaft of the motor (102), a belt (104) is movably sleeved on the outer surface of the rotating shaft (103), and a movable shaft (105) is movably embedded on the other side of the belt (104).
  3. 3. The semiconductor chip processing and testing device according to claim 2, wherein one side of the movable shaft (105) is fixedly connected with a threaded rod (106), a threaded block (120) is movably sleeved on the outer surface of the threaded rod (106), one side of the threaded block (120) is fixedly connected with a first guide column (108), and the other side of the first guide column (108) is fixedly connected with a test frame (109).
  4. 4. The semiconductor chip processing test device according to claim 3, wherein two movable grooves (107) are formed in two sides of the test bench (1), a guide post III (121) is fixedly connected to the inside of one movable groove (107), the test frame (109) is movably sleeved on the outer surface of the guide post III (121), and a handle III (122) is fixedly connected to one side of the test frame (109).
  5. 5. The semiconductor chip processing and testing device according to claim 4, wherein the adjusting assembly further comprises a supporting column (110), a screw rod (112) is movably connected to the inside of the supporting column (110), a first handle (111) is fixedly connected to one side of the screw rod (112), a threaded column (113) is movably sleeved on the outer surface of the screw rod (112), and a linkage column (114) is fixedly connected to one side of the threaded column (113).
  6. 6. The semiconductor chip processing test device according to claim 5, wherein a fixed block (115) is fixedly connected to one side of the linkage column (114), a connecting column (116) is fixedly connected to one side outer surface of the fixed block (115), the connecting column (116) is fixedly connected to one side outer surface of the test frame (109), and two guide columns (118) are fixedly arranged on one side of the fixed block (115).
  7. 7. The semiconductor chip processing and testing device according to claim 6, wherein a support frame (119) is fixedly arranged on one side of the test bench (1), two guide posts (118) are movably embedded in the support frame (119), and a handle (117) is fixedly connected to one side of the fixed block (115).
  8. 8. The semiconductor chip processing test device according to claim 7, wherein an electric push rod (123) is fixedly arranged at the bottom of the test frame (109), and a test board (124) is fixedly connected to the output end of the electric push rod (123).

Description

Semiconductor chip processing testing device Technical Field The utility model relates to the technical field of semiconductor chip equipment, in particular to a semiconductor chip processing and testing device. Background Semiconductor chip manufacturing test devices are devices used for various inspection and verification during chip manufacturing to ensure that the quality and performance of the final product meets design specifications. These devices cover multiple stages from wafer fabrication to package testing including, but not limited to, electrical property testing, physical defect inspection, reliability testing, and the like. In the prior art, as shown in the Chinese patent number CN217034046U, the semiconductor chip processing testing device comprises a mounting plate and a detector fixedly connected with the mounting plate, wherein the upper end of the detector is fixedly connected with a placing plate, the upper surface of the placing plate is provided with a plurality of grooves, the detector is used for detecting a semiconductor chip, the clamping part comprises a pressing plate, an extrusion block and a telescopic cavity, the upper end of the telescopic cavity is fixedly connected with the mounting plate, and the pressing plate is fixedly connected with the lower end of the telescopic cavity. In the above-mentioned technique, though adopt the extrusion piece to have the extrusion effect with the chip in the recess, can closely attach the core and detect in the probe upper end, prevent that the chip from receiving the extrusion and causing the damage, but when the chip carries out the processing test, testing arrangement can not adjust suitable position according to the test point of chip, need the staff constantly take the test pen and click according to the test point of chip is manual, after the test finishes, need the staff to take the chip from fixing device inside, constantly take fixed a large amount of process time of wastage, has influenced production efficiency. Disclosure of utility model The utility model aims to solve the problems that in the prior art, when a chip is processed and tested, a testing device cannot be adjusted to a proper position according to a testing point of the chip, a worker is required to continuously take a testing pen to manually click according to the testing point of the chip, and after the chip is tested, the worker is required to take the chip from the inside of a fixing device, a great amount of processing time is wasted due to the fact that the chip is continuously taken and fixed, and the production efficiency is affected. In order to achieve the purpose, the semiconductor chip processing and testing device comprises a test board and a fixed board and is characterized in that the top of the fixed board is movably connected with a movable column, the top of the movable column is fixedly connected with a connecting plate, the top of the connecting plate is fixedly connected with two buffer springs, the tops of the two buffer springs are fixedly connected with a connecting block, one side opposite to the two connecting blocks is fixedly connected with a supporting block, the top of the supporting block is fixedly provided with a pull ring, the bottom of the supporting block is fixedly connected with two suckers, and one side of the test board is provided with an adjusting component. The technical effect of adopting the further scheme is that the supporting block is pulled up by a worker by pulling the pull ring, at the moment, the supporting block promotes the buffer spring to be in a force accumulation state through the connecting block, the chip is placed at the bottom of the sucker, then the pull ring is rotated to promote the chip to enter the inside of the test bench, and the pull ring is put down to promote the rebound of the buffer spring to ensure that the sucker is attached and fixed with the inside of the test bench. As a preferred implementation mode, the adjusting part comprises an L-shaped frame, the L-shaped frame is fixedly connected to the outer surface of one side of the test bench, one side of the L-shaped frame is fixedly provided with a motor, an output shaft of the motor is fixedly connected with a rotating shaft, a belt is movably sleeved on the outer surface of the rotating shaft, a movable shaft is movably embedded on the other side of the belt, a threaded rod is fixedly connected to one side of the movable shaft, a thread block is movably sleeved on the outer surface of the threaded rod, a guide post I is fixedly connected to one side of the thread block, a test bench is fixedly connected to the other side of the guide post I, two movable grooves are formed in two sides of the test bench, one guide post III is fixedly connected to the inner side of the movable groove, the test bench is movably sleeved on the outer surface of the guide post III, and a handle III is fixedly connected to one side of the test bench. The technical