CN-224231966-U - Receiving structure of laser radar and laser radar

Abstract

The disclosure provides a receiving structure of a laser radar and the laser radar, wherein the receiving structure comprises a circuit board, a receiving chip, a packaging part, a protective cover plate and a protective cover plate, wherein the receiving chip is arranged on the circuit board and comprises a light inlet, echoes of the laser radar are incident into the receiving chip through the light inlet, the receiving chip responds to the echoes to output electric signals, the packaging part is arranged on the surface of the receiving chip and extends to the surface of the circuit board, the protective cover plate is configured to protect the light inlet, the protective cover plate comprises a light-transmitting cover, the light-transmitting cover covers the light inlet of the receiving chip, the light-transmitting cover allows light in a wave band where the echoes are located to transmit, and the protective cover plate is in contact with the packaging part. According to the technical scheme, the receiving structure can be effectively protected, the probability of damage and cracking of the light-transmitting cover is reduced, and the reliability of the receiving structure is improved.

Inventors

• SUN WENSEN
• LI ZHENXIANG
• YAO ZHENGZHENG
• FEI FAN
• SHEN SHILIN
• ZHU KANG
• LI NA
• CHEN JINJING
• Song runda
• YANG ZHONGHUI

Assignees

• 上海禾赛科技有限公司

Dates

Publication Date

20260512

Application Date

20250318

Claims (15)

1. 1. A receiving structure of a laser radar, characterized by comprising: A circuit board; the receiving chip is positioned on the circuit board and comprises an optical inlet, and an echo of the laser radar is incident into the receiving chip through the optical inlet; the packaging part is positioned on the surface of the receiving chip and extends to the surface of the circuit board; A protective cover plate configured to protect the light inlet; The protective cover plate comprises a light-transmitting cover, wherein the light-transmitting cover covers a light inlet of the receiving chip and allows light in a wave band where the echo is located to transmit; The protective cover plate is in contact with the packaging part.
2. 2. The receiving structure of claim 1, wherein the protective cover further comprises a buffer portion between the light transmissive cover and the encapsulation portion.
3. 3. The receiving structure of claim 2, wherein the cushioning portion has a stiffness less than a stiffness of the encapsulation portion.
4. 4. A receiving structure according to claim 3, wherein the buffer is a soft gel.
5. 5. The receiving structure of claim 4, wherein the cushioning portion comprises a silicone gel, a soft polyvinyl chloride gel, an ethylene-vinyl acetate copolymer gel, a polyolefin elastomer gel, or a thermoplastic elastomer vulcanizate.
6. 6. The receiving structure according to claim 2, wherein the package portion surrounds the light-transmitting cover, and the buffer portion is located in a gap between the package portion and the light-transmitting cover.
7. 7. The receiving structure of claim 6, wherein the buffer is further located between the light-transmissive cover and the receiving chip.
8. 8. The receiving structure according to claim 2, wherein the buffer portion is circumferentially disposed outside the light inlet of the receiving chip.
9. 9. The receiving structure of claim 2, wherein the protective cover further comprises: the bracket is positioned above the receiving chip, a through hole is formed in the bracket, and the through hole corresponds to the light inlet; the light-transmitting cover covers the through hole; the buffer part is positioned between the receiving chip and the bracket.
10. 10. The receiving structure of claim 9, wherein the light-transmitting cover is attached to a surface of the bracket facing away from the receiving chip.
11. 11. The receiving structure according to claim 9, wherein a transmittance of light in a wavelength band in which the echo is located in the light-transmitting cover is larger than a transmittance of light outside the wavelength band in which the echo is located in the light-transmitting cover.
12. 12. The receiving structure of claim 9, further comprising a fixture positioned between the bracket and the circuit board.
13. 13. The receiving structure of claim 1, wherein the light-transmitting cover is glass.
14. 14. The receiving structure according to claim 1, wherein the receiving structure includes at least 2 light-transmitting covers, and the at least 2 light-transmitting covers are in one-to-one correspondence with the light inlets.
15. 15. A laser radar which comprises a laser beam source, characterized by comprising the following steps: a receiving structure configured to receive echoes, The receiving structure comprises a circuit board, a receiving chip, a packaging part and a protective cover plate, The receiving chip is arranged on the circuit board and comprises a light inlet, echoes of the laser radar are incident into the receiving chip through the light inlet, the receiving chip responds to the echoes to output electric signals, the packaging part is arranged on the surface of the receiving chip and extends to the surface of the circuit board, the protection cover plate comprises a light-transmitting cover, the light inlet of the receiving chip is covered by the light-transmitting cover, the light-transmitting cover allows light in a wave band where the echoes are located to transmit, and the protection cover plate is in contact with the packaging part.

Description

Receiving structure of laser radar and laser radar Technical Field The disclosure relates to the field of lidar, and in particular relates to a receiving structure of a lidar and the lidar. Background The laser radar is a commonly used ranging sensor, has the characteristics of long detection distance, high resolution, small environmental interference and the like, and is widely applied to the fields of unmanned, intelligent robots, unmanned aerial vehicles and the like. In recent years, the development of automatic driving technology is rapid, and a laser radar is indispensable as a core sensor for distance perception. The lidar includes a receiving structure, and the receiving structure is a key component of the lidar, and how to ensure the reliability of the receiving structure is a key factor in ensuring the performance of the lidar. Disclosure of utility model The problem addressed by the present disclosure is how to improve the reliability of the receiving structure of a lidar. To solve the above problems, the present disclosure provides a receiving structure of a lidar, including: the circuit board, the receiving chip is located on the circuit board, the receiving chip comprises a light inlet, echoes of the laser radar are incident into the receiving chip through the light inlet, the receiving chip responds to the echoes to output electric signals, the packaging part is located on the surface of the receiving chip and extends to the surface of the circuit board, the protection cover plate is configured to protect the light inlet, the protection cover plate comprises a light-transmitting cover which covers the light inlet of the receiving chip, the light-transmitting cover allows light in a wave band where the echoes are located to transmit, and the protection cover plate is in contact with the packaging part. Optionally, the protective cover plate further comprises a buffer part, wherein the buffer part is positioned between the light-transmitting cover and the packaging part. Optionally, the stiffness of the cushioning portion is less than the stiffness of the encapsulation portion. Optionally, the buffer part is soft rubber. Optionally, the buffer glue is at least one of silica gel, soft polyvinyl chloride glue, ethylene-vinyl acetate copolymer glue, polyolefin elastomer glue and thermoplastic elastomer vulcanized rubber glue. Optionally, the packaging part surrounds the light-transmitting cover, and the buffer part is positioned at a gap between the packaging part and the light-transmitting cover. Optionally, the buffer part is further located between the light-transmitting cover and the receiving chip. Optionally, the buffer portion is circumferentially disposed outside the light inlet of the receiving chip. Optionally, the protective cover plate further comprises a support, wherein the support is positioned above the receiving chip, a through hole is formed in the support and corresponds to the light inlet, the through hole is covered by the light-transmitting cover, and the buffer part is positioned between the receiving chip and the support. Optionally, the light-transmitting cover is attached to a surface of the support, which faces away from the receiving chip. Optionally, the transmittance of the light in the wave band of the echo is greater than the transmittance of the light outside the wave band of the echo in the light-transmitting cover. Optionally, the device further comprises a fixing piece, wherein the fixing piece is positioned between the bracket and the circuit board. Optionally, the light-transmitting cover is glass. Optionally, the receiving structure includes at least 2 light-transmitting covers, and at least 2 light-transmitting covers are in one-to-one correspondence with the light inlets. In addition, the present disclosure also provides a laser radar including: The receiving structure is configured to receive echoes and comprises a circuit board, a receiving chip, a packaging part and a protective cover plate, wherein the receiving chip is arranged on the circuit board and comprises a light inlet, echoes of a laser radar are incident into the receiving chip through the light inlet, the receiving chip responds to the echoes to output electric signals, the packaging part is arranged on the surface of the receiving chip and extends to the surface of the circuit board, the protective cover plate comprises a light-transmitting cover which covers the light inlet of the receiving chip, the light-transmitting cover allows light in a wave band where the echoes are located to transmit, and the protective cover plate is in contact with the packaging part. Correspondingly, the disclosure also provides a laser radar, comprising: The receiving structure is configured to receive echoes and comprises a circuit board, a receiving chip, a packaging part and a protective cover plate, wherein the receiving chip is arranged on the circuit board and comprises a light inlet, echoes of a laser ra