CN-224232007-U - Assembly of multiple optical modules

Abstract

The present disclosure relates to an assembly of a plurality of optical modules. An assembly of a plurality of optical modules is provided, the assembly comprising a base layer comprising a circuit board laminated substrate having a plurality of optical components mounted thereon, each of the plurality of optical components corresponding to a respective one of the plurality of optical modules, a cover layer substantially parallel to the base layer and comprising a circuit board laminated substrate having a plurality of apertures defined therein, each of the plurality of apertures corresponding to and aligned with a respective one of the plurality of optical modules, and a wall layer coupled to the base layer and to the cover layer and forming a plurality of outer walls for each of the plurality of optical modules, wherein the base layer, the cover layer, and the wall layer collectively define a plurality of chambers, each of the plurality of chambers corresponding to a respective one of the plurality of optical modules.

Inventors

• RUAN WEILIANG

Assignees

• 意法半导体国际公司

Dates

Publication Date

20260512

Application Date

20250311

Priority Date

20240325

Claims (10)

1. 1. An assembly of a plurality of optical modules, the assembly comprising: A base layer comprising one circuit board laminated substrate having a plurality of optical components mounted thereon, each of the plurality of optical components corresponding to a respective one of the plurality of optical modules; A cover layer substantially parallel to the base layer and comprising a circuit board laminated substrate having a plurality of apertures defined therein, each aperture of the plurality of apertures corresponding to and aligned with a respective one of the plurality of optical modules, and A wall layer coupled to the base layer and to the cover layer and forming a plurality of outer walls for each of the plurality of optical modules; Wherein the base layer, the cover layer, and the wall layer collectively define a plurality of chambers, each chamber of the plurality of chambers corresponding to a respective one of the plurality of optical modules.
2. 2. An assembly of a plurality of optical modules as recited in claim 1, wherein the wall layer comprises at least one circuit board laminate substrate.
3. 3. An assembly of a plurality of optical modules as recited in claim 2, wherein the wall layer comprises a plurality of sub-layers, each of the plurality of sub-layers comprising a circuit board laminate substrate.
4. 4. An assembly of a plurality of optical modules as recited in claim 3, wherein one or more of the plurality of sub-layers form one or more inner walls for each of the plurality of optical modules to divide each chamber of the plurality of optical modules into two or more sub-chambers.
5. 5. The assembly of multiple optical modules of claim 4, wherein at least one of the one or more inner walls of each of the multiple optical modules does not span from the base layer to the cover layer.
6. 6. An assembly of a plurality of optical modules as recited in claim 4, wherein at least one of the one or more inner walls and/or wall layers of each of the plurality of optical modules forms one or more mounting surfaces for lenses and/or filters in each of the plurality of optical modules.
7. 7. An assembly of a plurality of optical modules as recited in claim 2, wherein a plurality of conductive vias are formed in the wall layer to conductively connect the base layer and the cover layer.
8. 8. An assembly of a plurality of optical modules as claimed in claim 7, wherein at least one of the plurality of conductive vias forms part of a circuit for detecting a displacement of a lens in each of the plurality of optical modules and/or a displacement of the cover layer.
9. 9. An assembly of a plurality of optical modules as claimed in claim 1 wherein the wall layer comprises a single wall layer formed on or secured to the base layer and/or the cover layer.
10. 10. An assembly of a plurality of optical modules as recited in claim 1, further comprising a plurality of lenses secured to an underside of the cover layer; Wherein each lens of the plurality of lenses is aligned with a corresponding one of the plurality of holes, and Wherein at least a portion of an innermost sub-layer of the cover layer is removed to define a gas port from each chamber of each of the plurality of optical modules to a respective one of the plurality of holes.

Description

Assembly of multiple optical modules Technical Field Example embodiments of the present disclosure relate generally to optical modules, and more particularly, to methods of constructing optical modules. Background An optical sensor is a module that contains and uses one or more light sources and/or light receivers to detect light reflected from a target object. The received light is used to extract useful information such as distance, motion, surface characteristics, etc. The optical module may include a housing formed by attaching a plastic housing to a circuit board or other substrate using an adhesive for encapsulating one or more light sources and/or one or more light receivers. The lens or other structure may be coupled to and/or integrated with the plastic housing. Applicants have found many technical challenges and difficulties associated with optical modules and their manufacture. For example, such optical modules are typically manufactured as individual modules. Such piece-by-piece assembly of each individual module is inefficient and costly. In addition, maintaining uniformity in size and quality throughout the assembly of a large number of modules is difficult. The applicant has solved the problems associated with such optical modules by developing solutions implemented in the present disclosure with the effort, innovation and originality, and these solutions will be described in detail below. Disclosure of Invention Various embodiments described herein relate to an optical module assembly and a method for constructing a plurality of optical modules as an assembly. According to various embodiments of the present disclosure, an assembly of a plurality of optical modules is provided. In some embodiments, the assembly includes a base layer, and cover layer, and a wall layer. The base layer includes a circuit board laminated substrate having a plurality of optical components mounted thereon, each of the plurality of optical components corresponding to a respective one of the plurality of optical modules. The cover layer is substantially parallel to the base layer and includes a circuit board laminated substrate having a plurality of apertures defined therein. Each of the plurality of holes corresponds to a respective one of the plurality of optical modules and is aligned with a respective one of the plurality of optical components. The wall layer is coupled to the base layer and to the cover layer, and forms a plurality of outer walls for each of the plurality of optical modules. The base layer, the cover layer, and the wall layer collectively define a plurality of chambers, each chamber of the plurality of chambers corresponding to a respective one of the plurality of optical modules. In some embodiments, the wall layer includes at least one circuit board laminate substrate. In some embodiments, the wall layer includes a plurality of sub-layers, each of the plurality of sub-layers including a circuit board laminate substrate. In some embodiments, one or more of the plurality of sub-layers form one or more inner walls for each of the plurality of optical modules to divide each chamber of the plurality of optical modules into two or more sub-chambers. In some embodiments, at least one of the one or more inner walls of each of the plurality of optical modules does not span from the base layer to the cover layer. In some embodiments, at least one of the one or more inner walls and/or wall layers of each of the plurality of optical modules forms one or more mounting surfaces for lenses and/or filters in each of the plurality of optical modules. In some embodiments, a plurality of conductive vias are formed in the wall layer to conductively connect the base layer and the cover layer. In some embodiments, at least one of the plurality of conductive vias forms part of a circuit for detecting displacement of the lens and/or displacement of the cover layer in each of the plurality of optical modules. In some embodiments, the wall layer comprises a single (unitary) wall layer formed on or secured to the base layer and/or cover layer. In some embodiments, the assembly further comprises a plurality of lenses secured to the underside of the cover layer. Each lens of the plurality of lenses is aligned with a respective one of the plurality of apertures. At least a portion of the innermost sub-layer of the cover layer is removed to define an air vent from each chamber of each of the plurality of optical modules to a respective one of the plurality of apertures. According to various embodiments of the present disclosure, a method of constructing a plurality of optical modules is provided. In some embodiments, the method includes constructing an assembly of a plurality of optical modules by coupling a base layer and a cover layer to a wall layer, and cutting Shan Cheng the assembly into individual optical modules. The base layer includes a circuit board laminated substrate having a plurality of optical components mou