CN-224232010-U - Joining apparatus

CN224232010UCN 224232010 UCN224232010 UCN 224232010UCN-224232010-U

Abstract

The application relates to a jointing equipment, mainly providing a jointing equipment comprising a sensing device and a picking and placing device, so as to sense and acquire the position information of an optical fiber connector and an optical wafer by using the sensing device, and jointing the optical fiber connector to the optical wafer in an alignment mode by using the picking and placing device according to the position information, thereby improving jointing efficiency.

Inventors

HUANG PEIQI

Assignees

矽品精密工业股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250530
Priority Date: 20250516

Claims (6)

1. A splicing apparatus for splicing an optical fiber connector to an optical wafer, comprising: A sensing device for sensing and acquiring the position information of the optical fiber connector and the optical chip, and And the pick-and-place device is used for contraposition and jointing the optical fiber connector to the optical chip according to the position information.
2. The bonding apparatus according to claim 1, wherein the sensing device comprises a plurality of sensing units and at least one processing unit.
3. The bonding apparatus according to claim 2, wherein the plurality of sensing units are configured to sense and acquire positional information of at least three surfaces of the optical fiber connector and the optical wafer, respectively.
4. The bonding apparatus according to claim 3, wherein the processing unit is configured to process the positional information of the optical fiber connector and the optical chip obtained by the sensing unit to calculate and obtain an offset angle of a surface of the optical fiber connector to be bonded to the optical chip with respect to a horizontal plane, and an offset angle of a surface of the optical chip to be bonded to the optical fiber connector with respect to a horizontal plane, so as to provide the pick-and-place device with alignment information for bonding the optical fiber connector to the optical chip.
5. The bonding apparatus of claim 1, wherein the pick-and-place device is a six-axis robotic arm.
6. The bonding apparatus according to claim 1, wherein the pick-and-place device comprises a light emitting unit for emitting a light beam to the optical chip to confirm a maximum optical power position of the optical chip.

Description

Joining apparatus Technical Field The present application relates to a bonding apparatus, and more particularly, to a bonding apparatus for semiconductor devices. Background With the rapid development of portable electronic products in recent years, the development of various related products is also towards the trend of high density, high performance, light weight, thinness, shortness and smallness. Meanwhile, semiconductor devices are also gradually developed toward heterogeneous integration, and for this reason, three-dimensional (3D) multi-chip packaging technology is gradually rising. In order to increase the signal transmission speed between more and more chips and various devices in a semiconductor device and between the semiconductor device and an external circuit or component, optical communication technology is introduced, and optical fibers are used as signal propagation media on a critical signal path. Among the related technologies, co-packaged optical (Co-Packaged Optics, CPO) technology is a key technology for the great development in recent years. In the prior art, when the optical fiber connector is to be bonded to the optical chip, the optical fiber connector is first positioned schematically, then the first light-receiving position is searched in the light-entering area of the optical chip in a spiral or carpet mode, then the position with the maximum optical power is searched precisely, and then the optical fiber connector is adhered and fixed to the predetermined mounting position irradiated by the light beam. However, the spiral or carpet search for the first light-receiving position often takes too much time, which makes the alignment operation very inefficient and severely impairs the throughput of the whole production line. Therefore, how to overcome the above problems in the prior art has become a major challenge in the industry. Disclosure of utility model In view of the above-mentioned drawbacks of the prior art, the present application provides a bonding apparatus, which includes a sensing device for sensing and acquiring positional information of the optical fiber connector and the optical chip, and a pick-and-place device for aligning and bonding the optical fiber connector to the optical chip according to the positional information. The application further provides a jointing method, which comprises the steps of providing jointing equipment comprising a sensing device and a picking and placing device, sensing and acquiring the position information of the optical fiber connector and the optical wafer by using the sensing device, and jointing the optical fiber connector to the optical wafer in an alignment mode by using the picking and placing device according to the position information. In the above bonding apparatus and method, the sensing device includes a plurality of sensing units and at least one processing unit. In the above jointing apparatus and method, the plurality of sensing units are used for sensing and acquiring the position information of at least three surfaces of the optical fiber connector and the optical wafer. In the above bonding apparatus and method, the processing unit is configured to process the positional information of the optical fiber connector and the optical chip obtained by the sensing unit, so as to calculate and obtain an offset angle of a surface of the optical fiber connector to be bonded to the optical chip relative to a horizontal plane, and an offset angle of a surface of the optical chip to be bonded to the optical fiber connector relative to the horizontal plane, and provide the offset angle to the pick-and-place device as alignment information for bonding the optical fiber connector and the optical chip. In the above-mentioned jointing apparatus and method, the pick-and-place device is used to shift the optical fiber connector to the direction of the optical chip, so that the offset angle of the optical fiber connector is aligned with the offset angle of the optical chip. In the above-mentioned jointing apparatus and method, the pick-and-place device is a six-axis mechanical arm. In the above-mentioned bonding apparatus and method, the pick-and-place device includes a light emitting unit for emitting a light beam to the optical chip to confirm the maximum optical power position of the optical chip. In the above-mentioned jointing apparatus and method, the light-emitting unit of the pick-and-place device emits a light beam to the optical chip through the optical fiber connector to confirm the maximum optical power position of the optical chip, and the pick-and-place device is made to jointing the optical fiber connector to the optical chip correspondingly. The optical fiber connector and the optical wafer are respectively sensed by the sensing device, so that the pick-and-place device can quickly and initially position the optical fiber connector to the optical wafer according to the position information provided by the sensing device,