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CN-224232144-U - XMP mode memory with optimized structure

CN224232144UCN 224232144 UCN224232144 UCN 224232144UCN-224232144-U

Abstract

The utility model relates to the technical field of over-frequency of a memory of a desktop computer, in particular to an XMP mode memory with an optimized structure, which comprises a memory substrate, wherein pins are arranged at the bottom end of the memory substrate, chip particles are arranged on the side surface of the memory substrate, the bottom surface of the chip particles is fixedly connected with the memory substrate, an ultrathin heat pipe is arranged on the top surface of the chip particles, one end of the ultrathin heat pipe is attached to the top surface of the chip particles, and the other end of the ultrathin heat pipe extends out of the top end of the memory substrate and penetrates through a fin array arranged at the top end of the memory substrate. In conclusion, the heat dissipation efficiency of the internal memory in the XMP mode is remarkably improved, the structural design is optimized, the production cost is reduced, and the market competitiveness of the product is enhanced.

Inventors

  • Zhan huan
  • ZHANG JIANYONG
  • XU YANHUA
  • WANG ZHIQIANG
  • HU DONG

Assignees

  • 汇钜存储科技(东莞)有限公司

Dates

Publication Date
20260512
Application Date
20250510

Claims (9)

  1. 1. The XMP mode memory with the optimized structure is characterized by comprising a memory substrate (10), pins are arranged at the bottom end (11) of the memory substrate (10), chip particles (20) are arranged on the side face of the memory substrate (10), the bottom faces of the chip particles (20) are fixedly connected to the memory substrate (10), an ultrathin heat pipe (30) is arranged on the top face of the chip particles (20), one end of the ultrathin heat pipe (30) is attached to the top face of the chip particles (20), the other end of the ultrathin heat pipe extends out of the top end (12) of the memory substrate (10), and the ultrathin heat pipe penetrates into a fin array (40) arranged at the top end (12) of the memory substrate (10).
  2. 2. The XMP-mode memory of claim 1, characterized in that an auxiliary clip (50) is mounted on a side of the memory substrate (10), and the auxiliary clip (50) is clamped on a side of the ultra-thin heat pipe (30) away from the chip particles (20) to fix the ultra-thin heat pipe (30) in an auxiliary manner.
  3. 3. The XMP-mode memory of claim 2, wherein the fin array (40) is fixedly coupled to the auxiliary clip (50) such that the auxiliary clip (50) forms an auxiliary fixation for the fin array (40).
  4. 4. An XMP-mode memory of optimized structure as claimed in claim 3, characterized in that the two sides of the memory substrate (10) are provided with a first side (13) and a second side (14), the first side (13) is provided with chip particles (20), ultra-thin heat pipes (30) and auxiliary clips (50), said auxiliary clips (50) being fixedly connected to the memory substrate (10).
  5. 5. The XMP-mode memory of claim 4, wherein the second side (14) is provided with auxiliary clips (50), and wherein the auxiliary clips (50) are fixedly attached to each other and clamped to the memory substrate (10).
  6. 6. The XMP-mode memory of claim 5, wherein the second side (14) is provided with die particles (20) and ultra-thin heat pipes (30), the die particles (20) are fixedly connected to the second side (14) of the memory substrate (10), the ultra-thin heat pipes (30) are attached to top surfaces of the die particles (20) on the second side (14), and the auxiliary clips (50) are clamped to the ultra-thin heat pipes (30) to assist in fixing the same.
  7. 7. An XMP-mode memory of optimized structure as claimed in claim 2, characterized in that the fin array (40) has a width in the thickness direction of the memory substrate (10) which is smaller than or equal to the sum of the thicknesses of the auxiliary clips (50) on both sides.
  8. 8. An XMP-mode memory of optimized construction as claimed in claim 1, characterized in that the ultra-thin heat pipe (30) is arranged in a U-bend shape, one branch of which is attached to the chip particles (20) and the other branch of which is provided through the fin array (40).
  9. 9. The XMP-mode memory of claim 1, characterized in that a first row of particles (21) and a second row of particles (22) are mounted on one side of the memory substrate (10), the ultra-thin heat pipe (30) is provided with a first heat pipe (31) and a second heat pipe (32), the first heat pipe (31) is attached to the first row of particles (21), and the second heat pipe (32) is attached to the second row of particles (22).

Description

XMP mode memory with optimized structure Technical Field The utility model relates to the technical field of desktop computer memory over-frequency, in particular to an XMP mode memory with an optimized structure. Background In recent years, with the rapid development of computer technology, the computing power of a Central Processing Unit (CPU) is continuously enhanced, and the operating frequency is rapidly increased. In order to fully exploit the performance of the CPU, the performance demands on the memory are also growing, including higher operating frequencies and greater data throughput. Under this background, intel (Intel) corporation introduced Extreme Memory Profile (XMP) technology that allowed memory modules to store preset performance profiles, enabling the motherboard to automatically recognize and load these configurations, thereby achieving automatic over-clocking of the memory and improving overall system performance. However, XMP technology brings new challenges while improving memory performance. When the memory works in the XMP mode, the working frequency and the voltage of the memory are both obviously improved, so that the power consumption and the heating value of the memory chip are sharply increased. Excessive operating temperatures can affect memory stability and life, and may even lead to data errors or system crashes. Therefore, how to effectively dissipate heat and ensure the stable operation of the memory in the XMP mode is a problem to be solved. Currently, the common memory heat dissipation solutions on the market mainly comprise a heat dissipation waistcoat and a heat dissipation fan. The heat dissipation waistcoat passively dissipates heat by increasing the heat dissipation area, has a simple structure and low cost, but has a limited heat dissipation effect, and is difficult to meet the requirement of high heat productivity in an XMP mode. The cooling fan improves the cooling effect through forced convection, but has larger volume, occupies additional space and increases noise. In addition, the distance between the memory slots is usually small, and the large-sized heat dissipation fan may interfere with other hardware devices (such as a CPU heat sink), which limits the application of the large-sized heat dissipation fan. Therefore, there is a need for a memory heat dissipation solution that can dissipate heat efficiently without taking up too much space. Disclosure of utility model The utility model aims to overcome the defects of the prior art and provides a technical scheme capable of solving the problems. The utility model provides an XMP mode memory with an optimized structure, which comprises a memory substrate, wherein pins are arranged at the bottom end of the memory substrate, chip particles are arranged on the side surface of the memory substrate, the bottom surface of the chip particles is fixedly connected with the memory substrate, an ultrathin heat pipe is arranged on the top surface of the chip particles, one end of the ultrathin heat pipe is attached to the top surface of the chip particles, and the other end of the ultrathin heat pipe extends out of the top end of the memory substrate and penetrates into a fin array arranged at the top end of the memory substrate. The side face of the memory substrate is provided with an auxiliary clamping piece, and the auxiliary clamping piece is clamped on one side of the ultrathin heat pipe far away from chip particles to assist in fixing the ultrathin heat pipe. Further, the fin array is fixedly connected to the auxiliary clamping piece, so that the auxiliary clamping piece forms auxiliary fixing on the fin array. Further, two side surfaces of the memory substrate are set to be a first side and a second side, chip particles, an ultrathin heat pipe and an auxiliary clamping piece are mounted on the first side, and the auxiliary clamping piece is fixedly connected to the memory substrate. Further, the second side is provided with auxiliary clamping pieces, and the auxiliary clamping pieces on two sides are fixedly connected with each other and clamped on the memory substrate. Further, the second side is provided with chip particles and an ultrathin heat pipe, the chip particles are fixedly connected to the second side of the memory substrate, the ultrathin heat pipe is attached to the top surface of the chip particles on the second side, and the auxiliary clamping piece is clamped on the ultrathin heat pipe to assist in fixing the ultrathin heat pipe. Further, the width of the fin array along the thickness direction of the memory substrate is smaller than or equal to the sum of the thicknesses of the auxiliary clamping pieces at two sides. Further, the ultrathin heat pipe is arranged in a U-shaped bent shape, one branch pipe of the ultrathin heat pipe is attached to the chip particles, and the other branch pipe of the ultrathin heat pipe penetrates through the fin array. Further, a first row of particles and a second row