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CN-224232192-U - High temperature resistant RFID tire label

CN224232192UCN 224232192 UCN224232192 UCN 224232192UCN-224232192-U

Abstract

The utility model relates to the technical field of tire labels, in particular to a high-temperature-resistant RFID tire label, which comprises a PCB substrate, wherein an RFID chip is welded at the central position of the PCB substrate, a pair of welding spots are arranged at the outer side of the PCB substrate, a pair of antennas are arranged at the outer side of the RFID chip, the antennas are connected with the PCB substrate through the welding spots, a silica gel packaging layer is arranged at the outer side of the PCB substrate, and the silica gel packaging layer is coated at the outer sides of the RFID chip, the welding spots and the antennas. According to the utility model, the elastic modulus of the silica gel can absorb the tire vulcanization pressure and the mechanical impact in running, the stress is further dispersed by the cooperative design of the antenna and the silica gel, the fatigue life is prolonged, the high temperature is isolated by the high temperature resistant polyimide protective film, and the service life of the RFID chip and the PCB substrate is prolonged.

Inventors

  • LI KEJIN

Assignees

  • 东莞市宇讯电子科技有限公司

Dates

Publication Date
20260512
Application Date
20250513

Claims (5)

  1. 1. The high temperature resistant RFID tire tag comprises a PCB substrate (3) and is characterized in that an RFID chip (4) is welded at the central position of the PCB substrate (3), a pair of welding spots (6) are arranged on the outer side of the PCB substrate (3), a pair of antennas (5) are arranged on the outer side of the RFID chip (4), the antennas (5) are connected with the PCB substrate (3) through the welding spots (6), a silica gel packaging layer (1) is arranged on the outer side of the PCB substrate (3), and the silica gel packaging layer (1) is coated on the outer sides of the RFID chip (4), the welding spots (6) and the antennas (5).
  2. 2. The high-temperature-resistant RFID tire label according to claim 1, wherein a protective layer (2) is arranged on the outer side of the silica gel packaging layer (1), and the protective layer (2) is a high-temperature-resistant polyimide protective film.
  3. 3. A high temperature resistant RFID tire tag according to claim 2, wherein the antenna (5) and the RFID chip (2) are both horizontally arranged on the surface of the PCB substrate (1), and the antenna (5) and the RFID chip (2) are in the same plane.
  4. 4. A high temperature resistant RFID tyre tag according to claim 1, characterized in that the antenna (5) is constituted by two wavy extending steel cords and that the two antennas (5) form a coupling area for coupling with the magnetic field of the PCB substrate (3).
  5. 5. The high temperature resistant RFID tire label according to claim 4, wherein the outer edge of the PCB substrate (3) is provided with a positioning protrusion for positioning a tire vulcanization mold.

Description

High temperature resistant RFID tire label Technical Field The utility model relates to the technical field of tire labels, in particular to a high-temperature-resistant RFID tire label. Background Electronic tags (RFID) have unique identification codes that are integrated into an information carrier (e.g., a rubber tire) without affecting the performance of the carrier after being implanted therein. The data can be transmitted/read and written at any time under the drive of external read-write equipment, and the whole process management of production, sales, use, claim settlement or informatization monitoring of the carrier can be monitored in real time. In view of the above related art, the existing tire tag has the defect that the existing tire tag is encapsulated by adopting the traditional RFID tag, and epoxy resin or common rubber is often used, but the materials are easy to age, crack or deform at high temperature of tire vulcanization, so that the tag is invalid, and therefore, the utility model provides the high temperature resistant RFID tire tag. Disclosure of utility model The application aims to provide a high-temperature-resistant RFID (radio frequency identification) tire tag, which aims to solve the problems that the prior tire tag is encapsulated by adopting traditional RFID tags and often using epoxy resin or common rubber, but the materials are easy to age, crack or deform at high temperature of tire vulcanization, so that the tag is invalid. In order to achieve the above purpose, the high-temperature-resistant RFID tire tag comprises a PCB substrate, wherein an RFID chip is welded at the central position of the PCB substrate, a pair of welding spots are arranged on the outer side of the PCB substrate, a pair of antennas are arranged on the outer side of the RFID chip, the antennas are connected with the PCB substrate through the welding spots, a silica gel packaging layer is arranged on the outer side of the PCB substrate, and the silica gel packaging layer is coated on the outer sides of the RFID chip, the welding spots and the antennas. Preferably, a protective layer is arranged on the outer side of the silica gel packaging layer, and the protective layer is a high-temperature-resistant polyimide protective film. Preferably, the antenna and the RFID chip are both horizontally arranged on the surface of the PCB substrate, and the antenna and the RFID chip are in the same plane. Preferably, the antenna is formed by two wavy extending steel cords, and the two antennas form a coupling area for coupling with the magnetic field of the PCB substrate. Preferably, a positioning protrusion is arranged at the outer edge position of the PCB substrate, and the positioning protrusion is used for positioning the tire vulcanization mold. In summary, the utility model has the technical effects and advantages that: according to the utility model, the elastic modulus of the silica gel can absorb the tire vulcanization pressure and the mechanical impact in running, the stress is further dispersed by the cooperative design of the antenna and the silica gel, the fatigue life is prolonged, the high temperature is isolated by the high temperature resistant polyimide protective film, and the service life of the RFID chip and the PCB substrate is prolonged. Drawings In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art. FIG. 1 is a schematic view of a first view angle and axial side structure of the present utility model; FIG. 2 is a schematic view of a second view angle and axial side structure of the present utility model; Fig. 3 is a schematic structural diagram of an RFID chip according to the present utility model. In the figure, 1, a silica gel packaging layer, 2, a protective layer, 3, a PCB substrate, 4, an RFID chip, 5, an antenna, 6 and a welding spot. Detailed Description The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. In the description of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and include, for example, "