Search

CN-224232422-U - Plastic package patch type ceramic piezoresistor

CN224232422UCN 224232422 UCN224232422 UCN 224232422UCN-224232422-U

Abstract

The utility model relates to the technical field related to piezoresistors, in particular to a plastic package patch type ceramic piezoresistor which comprises a substrate, wherein the surface of the substrate is connected with an electrode plate, the surface of the electrode plate is provided with a heat conducting glue layer, the outside of the substrate is provided with a ceramic shell, a protective layer is arranged above the ceramic shell, the side edge of the ceramic shell is connected with a heat conducting pipe, a heat conducting sheet is attached above the heat conducting pipe, fixing bolts penetrate through the surfaces of the protective layer and the heat conducting sheet, the bottom of the ceramic shell is provided with a buffer assembly, and the bottom of the buffer assembly is provided with a welding block. This plastic envelope paster formula ceramic varistor through the setting of guide way and damping piece, has realized the accurate control of damping force, and the damping piece adopts high coefficient of friction material, produces stable damping force with the interference fit of guide way, makes the speed of resetting of buffer rod slow down, effectively suppresses vibration rebound, converts impact energy into heat energy dissipation, promotes shock attenuation efficiency.

Inventors

  • LI ZHIXUN
  • LI XIAOHUI

Assignees

  • 南安市康泰电子科技有限公司

Dates

Publication Date
20260512
Application Date
20250528

Claims (7)

  1. 1. The plastic package patch type ceramic piezoresistor comprises a substrate (1) and is characterized in that the surface of the substrate (1) is connected with an electrode plate (2), the surface of the electrode plate (2) is provided with a heat conducting adhesive layer (3), the surface of the heat conducting adhesive layer (3) is connected with a heat radiating plate (4), the surface of the heat radiating plate (4) is provided with a heat radiating groove (5), the outside of the substrate (1) is provided with a ceramic shell (6), the upper part of the ceramic shell (6) is provided with a protective layer (7), the side edge of the ceramic shell (6) is connected with a heat conducting pipe (8), a heat conducting sheet (9) is attached to the upper part of the heat conducting pipe (8), the surfaces of the protective layer (7) and the heat conducting sheet (9) are all penetrated by a fixing bolt (10), the bottom of the ceramic shell (6) is provided with a buffer assembly (11), and the bottom of the buffer assembly (11) is provided with a welding block (12). The buffer component (11) comprises a buffer seat (1101), sliding connection is arranged between the buffer seat (1101) and a ceramic shell (6), a buffer groove (1102) is formed in the buffer seat (1101), a buffer plate (1103) is connected in a sliding manner in the buffer groove (1102), a chute (1104) is formed in the inner bottom side of the buffer groove (1102), a connecting piece (1106) is fixedly connected to the bottom of the buffer plate (1103) and the top of the slider (1105), a supporting inclined rod (1107) is connected to the surface of the connecting piece (1106), a sleeve (1108) is connected to the bottom of the buffer plate (1103), a limit groove (1109) is formed in the sleeve (1108), a guide groove (1110) is formed in the inner side of the limit groove (1109), a limit plate (1111) is connected in a sliding manner in the inner side of the limit groove (1109), a limit spring (1111) is connected to the side edge of the limit plate (1111), a damping rod (1111) is connected to the damping rod (1111) of the damping rod (1111), the bottom of buffer rod (1114) is connected with blotter (1115).
  2. 2. The plastic package patch type ceramic piezoresistor of claim 1, wherein the electrode plates (2) are arranged on the surface of the substrate (1) in the same two groups and are respectively connected to the upper side and the lower side of the substrate (1).
  3. 3. The plastic package patch type ceramic piezoresistor of claim 1, wherein a plurality of groups of heat dissipation grooves (5) are formed in the surface of the heat dissipation plate (4), and the heat dissipation grooves (5) of each group are distributed at equal intervals.
  4. 4. The plastic package patch type ceramic piezoresistor of claim 1, wherein the heat conducting pipes (8) are distributed on the surface of the ceramic shell (6) at equal intervals, and the heat conducting sheets (9) are symmetrically distributed with two groups by the central axis of the protective layer (7).
  5. 5. The plastic package patch type ceramic varistor of claim 1, wherein the heat conducting strip (9) is fixedly connected with the protective layer (7) through a fixing bolt (10), and a plurality of groups of fixing bolts (10) are arranged on the surface of the heat conducting strip (9).
  6. 6. The plastic package patch type ceramic varistor of claim 1, wherein the ceramic housing (6) slides up and down in the buffer seat (1101) through the buffer groove (1102) by the buffer plate (1103), and the outer wall of the slider (1105) is matched with the inner wall of the chute (1104).
  7. 7. The plastic package patch type ceramic varistor of claim 1, wherein the limiting plate (1111) slides inside the limiting groove (1109) through the guide groove (1110) by the damping block (1112), and the size of the damping block (1112) is matched with the size of the guide groove (1110).

Description

Plastic package patch type ceramic piezoresistor Technical Field The utility model relates to the technical field of piezoresistors, in particular to a plastic package patch type ceramic piezoresistor. Background The varistor is a nonlinear resistor element sensitive to voltage, the resistance value of the varistor can be changed obviously along with the change of the voltage at two ends, under the background that modern electronic equipment is miniaturized and integrated and developed at high speed and the requirement on overvoltage protection performance of a circuit is continuously improved, a plastic package patch type ceramic varistor is particularly required, the miniature volume and the standardized size are realized by means of patch package, the requirements of high-density circuit board layout and automatic production are met, space can be saved greatly, zinc oxide ceramic is taken as a core material, the varistor has nanosecond ultrafast response speed and excellent overvoltage suppression capability, a sensitive chip can be protected effectively, and an external plastic package layer provides electrical insulation, mechanical protection and environmental adaptation performance, so that the varistor can work stably under severe conditions such as humidity and vibration, and therefore the varistor becomes a key element for guaranteeing the safe and reliable operation of circuits in the fields such as consumer electronics, communication equipment and automobile electronics. However, the traditional plastic package patch type ceramic piezoresistor still has obvious defects in the aspect of earthquake resistance, the ceramic main body material has high hardness but poor toughness, and under the high-frequency vibration or impact environment, the internal ceramic body is easily cracked or the electrode falls off due to stress concentration, the thermal expansion coefficient difference exists between the plastic package layer and the ceramic body, and the interface layering can be aggravated due to long-term vibration, so that the electrical connection is invalid. Disclosure of utility model The utility model aims to provide a plastic package patch type ceramic piezoresistor, wherein a buffer assembly is arranged at the bottom of a ceramic shell, and the problem that the electrical connection effect is affected due to the fact that the conventional plastic package patch type ceramic piezoresistor is insufficient in anti-seismic aspect is solved. The plastic package patch type ceramic piezoresistor comprises a substrate, wherein the surface of the substrate is connected with an electrode plate, the surface of the electrode plate is provided with a heat conducting adhesive layer, the surface of the heat conducting adhesive layer is connected with a heat radiating plate, the surface of the heat radiating plate is provided with a heat radiating groove, the outside of the substrate is provided with a ceramic shell, a protective layer is arranged above the ceramic shell, the side edge of the ceramic shell is connected with a heat conducting pipe, a heat conducting sheet is attached above the heat conducting pipe, fixing bolts penetrate through the surfaces of the protective layer and the heat conducting sheet, the bottom of the ceramic shell is provided with a buffer assembly, and the bottom of the buffer assembly is provided with a welding block; The buffering subassembly includes the buffer seat, sliding connection between buffer seat and the ceramic shell, the buffer tank has been seted up to the inside of buffer seat, the inside sliding connection of buffer tank has the buffer board, the top of buffer board and the bottom fixed connection of ceramic shell, the spout has been seted up to the inside bottom side of buffer tank, the inside sliding connection of spout has the slider, the equal fixedly connected with connecting piece in bottom of buffer board and the top of slider, the surface connection of connecting piece has the support diagonal bar, the bottom of buffer board is connected with the sleeve, the spacing groove has been seted up to telescopic inside, the guide way has been seted up to the inboard of spacing groove, the inside sliding connection of spacing groove has the limiting plate, the side of limiting plate is connected with the damping piece, the top of limiting plate is connected with buffer spring, the bottom of limiting plate is connected with the buffer rod, the bottom of buffer rod is connected with the blotter. Preferably, the electrode plates are arranged on the surface of the substrate in the same two groups and are respectively connected to the upper side and the lower side of the substrate. Preferably, a plurality of groups of heat dissipation grooves are formed in the surface of the heat dissipation plate, and the heat dissipation grooves of each group are distributed at equal intervals. Preferably, the heat conducting pipes are distributed on the surface of the ceramic shell