CN-224232426-U - Electromagnetic coil assembly and semiconductor processing equipment

CN224232426UCN 224232426 UCN224232426 UCN 224232426UCN-224232426-U

Abstract

The utility model provides an electromagnetic coil assembly and semiconductor processing equipment. The electromagnetic coil assembly comprises a direct current power supply, an electromagnetic coil, a current steering device connected between the electromagnetic coil and the direct current power supply, wherein the current steering device comprises a first magnetic switch and a second magnetic switch, the first magnetic switch and the second magnetic switch comprise a movable contact, a normally open contact and a normally closed contact, the movable contact of the first magnetic switch is connected with a first end of the electromagnetic coil, the normally open contact and the normally closed contact are respectively connected with an anode and a cathode of the direct current power supply, the movable contact of the second magnetic switch is connected with a second end of the electromagnetic coil, the normally open contact and the normally closed contact are respectively connected with a cathode and an anode of the direct current power supply, and the first magnetic switch and the second magnetic switch are synchronously switched. The utility model can conveniently control the current direction of the electromagnetic coil and improve the stability and the product quality of the deposition process.

Inventors

WANG YAJUN
ZHOU GUOXIANG

Assignees

中微半导体设备(上海)股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250421

Claims (11)

1. An electromagnetic coil assembly, comprising: a direct current power supply; an electromagnetic coil; the current diverter is connected between the electromagnetic coil and the direct-current power supply; The current steering device comprises a first magnetic switch and a second magnetic switch, wherein the first magnetic switch and the second magnetic switch comprise a movable contact, a normally open contact and a normally closed contact, the movable contact of the first magnetic switch is connected with a first end of the electromagnetic coil, the normally open contact and the normally closed contact are respectively connected with a negative pole and a positive pole of the direct current power supply, the movable contact of the second magnetic switch is connected with a second end of the electromagnetic coil, the normally open contact and the normally closed contact are respectively connected with the positive pole and the negative pole of the direct current power supply, and the first magnetic switch and the second magnetic switch are synchronously switched.
2. The electromagnetic coil assembly of claim 1, wherein the number of electromagnetic coils and the current diverters are the same and are disposed in a one-to-one correspondence.
3. The electromagnetic coil assembly of claim 2, wherein the number of dc power sources is the same as and one-to-one correspondence to the number of current diverters.
4. The electromagnetic coil assembly of claim 2, wherein the number of dc power sources is less than the number of current diverters, at least two of the current diverters being connected to the same dc power source.
5. The electromagnetic coil assembly of claim 1, wherein the current diverter is coupled to a power supply unit for simultaneously supplying power to the first magnetic switch and the second magnetic switch to cause the first magnetic switch and the second magnetic switch to switch synchronously.
6. The electromagnetic coil assembly of claim 1, wherein the dc power source and the current diverter are integrally provided.
7. The semiconductor processing equipment is characterized by comprising a reaction cavity, wherein a base for supporting a substrate is arranged in the reaction cavity, and the electromagnetic coil assembly according to any one of claims 1-6, wherein an electromagnetic coil in the electromagnetic coil assembly is positioned outside the reaction cavity and surrounds the base.
8. The semiconductor processing apparatus according to claim 7, wherein a plurality of the electromagnetic coils are sequentially arranged in an axial direction of the reaction chamber.
9. The semiconductor processing apparatus of claim 8, further comprising a controller for controlling the first magnetic switch and the second magnetic switch in each of the current diverters to switch synchronously to change the direction of current in each of the electromagnetic coils to generate a changing magnetic field in the reaction chamber.
10. The semiconductor processing apparatus of claim 7, wherein the dc power source and the current diverter are integrally disposed within a remote cabinet.
11. The semiconductor processing apparatus of claim 7, wherein the semiconductor processing apparatus is a PVD apparatus.

Description

Electromagnetic coil assembly and semiconductor processing equipment Technical Field The utility model relates to the technical field of semiconductor equipment, in particular to an electromagnetic coil assembly and semiconductor processing equipment. Background Physical vapor deposition (Physical Vapor Deposition, PVD) equipment bombards the target with ionized inert gas ions under the combined action of an electric field and a magnetic field in a vacuum environment, the target is ejected in the form of ions, atoms or molecules, and a thin film is deposited on a substrate. Is generally used for depositing metal films such as aluminum, copper and the like, and forming processes such as metal contact and metal interconnection lines. In PVD equipment, generally set up solenoid in the reaction chamber outside around, the solenoid circular telegram back produces the magnetic field, and this magnetic field can retrain the motion track of ion, makes the ion make helical motion around the magnetic line of force under the effect of magnetic field, has increased the motion route and the dwell time of ion in the reaction chamber to the collision probability of ion and target has been improved, and can make the target that sputters more evenly distributed on the substrate, thereby improve the homogeneity of film. In the process, the current direction of the electromagnetic coil needs to be switched according to the process requirement, and the magnetic field distribution in the reaction cavity is regulated. Therefore, it is desirable to provide an electromagnetic coil assembly that can conveniently control the direction of current flow, improving the stability and product quality of the deposition process. Disclosure of utility model The utility model aims to provide an electromagnetic coil assembly and semiconductor processing equipment, which can conveniently control the current direction of an electromagnetic coil and improve the stability and the product quality of a deposition process. In order to achieve the above object, the present utility model is realized by the following technical scheme: The electromagnetic coil assembly comprises a direct current power supply, an electromagnetic coil, a current steering device connected between the electromagnetic coil and the direct current power supply, wherein the current steering device comprises a first magnetic switch and a second magnetic switch, the first magnetic switch and the second magnetic switch comprise a movable contact, a normally open contact and a normally closed contact, the movable contact of the first magnetic switch is connected with a first end of the electromagnetic coil, the normally open contact and the normally closed contact are respectively connected with a negative pole and a positive pole of the direct current power supply, the movable contact of the second magnetic switch is connected with a second end of the electromagnetic coil, the normally open contact and the normally closed contact are respectively connected with a positive pole and a negative pole of the direct current power supply, and the first magnetic switch and the second magnetic switch are synchronously switched. Optionally, the electromagnetic coils and the current diverters are the same in number and are arranged in a one-to-one correspondence. Optionally, the number of the direct current power supplies is the same as the number of the current diverters and is arranged in a one-to-one correspondence. Optionally, the number of the direct current power sources is smaller than the number of the current diverters, and at least two of the current diverters are connected to the same direct current power source. Optionally, the current diverter is connected with a power supply unit and is used for simultaneously supplying power to the first magnetic switch and the second magnetic switch, so that the first magnetic switch and the second magnetic switch are synchronously switched. Optionally, the direct current power supply and the current diverter are integrally arranged. The semiconductor processing equipment comprises a reaction cavity, a base used for supporting a substrate and an electromagnetic coil assembly, wherein the electromagnetic coil in the electromagnetic coil assembly is positioned outside the reaction cavity and surrounds the base. Optionally, a plurality of electromagnetic coils are sequentially arranged along the axial direction of the reaction cavity. Optionally, the semiconductor processing apparatus further includes a controller configured to control the first magnetic switch and the second magnetic switch in each of the current diverters to switch synchronously, so that a current direction in each of the electromagnetic coils is changed, and a changing magnetic field is generated in the reaction chamber. Optionally, the direct current power supply and the current diverter are integrally arranged in a remote cabinet. Optionally, the semiconductor processing app