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CN-224232640-U - Heating ring capable of being cooled rapidly

CN224232640UCN 224232640 UCN224232640 UCN 224232640UCN-224232640-U

Abstract

The utility model relates to the technical field of semiconductor equipment, and particularly discloses a heating ring capable of being rapidly cooled, which comprises a heating ring body, wherein the heating ring body is of a circular hollow structure, a spiral cooling channel is arranged in the heating ring body, two ends of the spiral cooling channel are respectively connected with a medium inlet arranged at the bottom of the heating ring body and a medium outlet arranged at the top of the heating ring body, the heating layer comprises resistance heating wires which are distributed in a serpentine manner, a plurality of radiating fins are uniformly distributed on the outer side wall of the heating ring body along the circumferential direction, rapid temperature rise and fall uniform control is realized through the synergistic effect of the spiral cooling channel and the radiating fins, the heat loss of an aluminum nitride ceramic heat insulation layer is reduced, the heating efficiency is improved, the heat dissipation performance of the integrated structure is enhanced, the service life is prolonged, the integrated structure is suitable for various cooling mediums, the modularized design is convenient to maintain, the energy consumption and the operation cost are reduced, and the stability and the production efficiency of an etching process are remarkably improved.

Inventors

  • WANG DIXING
  • PENG DONGDONG

Assignees

  • 无锡迪渊特科技有限公司

Dates

Publication Date
20260512
Application Date
20250430

Claims (7)

  1. 1. A heating ring capable of being rapidly cooled, characterized in that: comprising the following steps: the heating ring comprises a heating ring body (1), wherein the heating ring body (1) is of a circular hollow structure; The spiral cooling channel (2), the spiral cooling channel (2) is arranged in the heating ring body (1), and two ends of the spiral cooling channel (2) are respectively connected with a medium inlet (3) arranged at the bottom of the heating ring body (1) and a medium outlet (4) arranged at the top of the heating ring body; The heating layer comprises resistance heating wires (5) which are distributed in a serpentine shape, and the resistance heating wires (5) are arranged on the upper surface of the heating ring body (1); The heat dissipation fins (6) are arranged on the outer side wall of the heating ring body (1) and uniformly distributed in the circumferential direction.
  2. 2. A rapidly coolable heating ring as claimed in claim 1, characterized in that the heating ring body (1) has an outer diameter of 280-320mm, an inner diameter of 260-300mm, a height of 40-60mm and a wall thickness of 8-12mm.
  3. 3. The rapid cooling heating ring according to claim 1, wherein the heat radiation fins (6) are trapezoid-shaped and are coated with an anodic aluminum oxide film layer (8) on the surface.
  4. 4. A rapidly coolable heating ring according to claim 1, characterized in that the heating ring body (1) is provided on its inner side with a plurality of temperature sensors (7).
  5. 5. A quick cooling heating ring according to claim 1, wherein a plurality of uniformly distributed bolt mounting holes (9) are formed in the back of the heating ring body (1).
  6. 6. A rapidly coolable heating ring as claimed in claim 1, characterized in that the upper surface of the heating ring body (1) is provided with an aluminum nitride ceramic insulating layer.
  7. 7. A rapidly coolable heating ring according to claim 1, characterized in that the medium inlet (3) is connected to an external cooling medium supply, the cooling medium being argon, nitrogen or deionized water, and the medium outlet (4) is connected to an external heat exchanger.

Description

Heating ring capable of being cooled rapidly Technical Field The utility model relates to the technical field of semiconductor equipment, and particularly discloses a heating ring capable of being rapidly cooled. Background In a semiconductor etching process, a heating ring is a core component that maintains chamber temperature uniformity, which provides precise temperature control of the chamber through a resistive heating element. Conventional etcher heating rings typically employ an annular metal substrate (e.g., stainless steel or nickel-based alloy) as a carrier, a resistive wire heating layer disposed on the surface, and an integrated temperature sensor to achieve closed loop control. The structure transmits energy to the wall surface of the cavity through heat conduction, rapid temperature rise and drop operation is needed before and after etching, and the performance of the structure directly influences the process and the efficiency of the wafer etching precision. However, the existing heating ring has the obvious technical defects that firstly, the heating ring is limited by a passive heat dissipation design (such as natural convection or low-speed air cooling), the cooling efficiency is low, and secondly, the temperature gradient exceeds the standard due to single heat conduction path, and particularly, local overheating is easy to generate in the joint area of the annular structure. Disclosure of utility model The utility model provides a heating ring capable of being rapidly cooled, which realizes rapid temperature rise and temperature uniformity control through the synergistic effect of a spiral cooling channel and a radiating fin and remarkably improves the stability and the production efficiency of an etching process. The utility model is realized in that a rapidly coolable heating ring comprises: The heating ring body is in a circular hollow structure; The spiral cooling channel is arranged in the heating ring body, and two ends of the spiral cooling channel are respectively connected with a medium inlet arranged at the bottom of the heating ring body and a medium outlet arranged at the top of the heating ring body; The heating layer comprises resistance heating wires which are arranged in a serpentine manner, and the resistance heating wires are arranged on the upper surface of the heating ring body; the heat dissipation fins are arranged on the outer side wall of the heating ring body and uniformly distributed in the circumferential direction. Preferably, as a rapidly coolable heating ring of the present utility model, the stirring mechanism further comprises: The driving motor is arranged on the upper end face of the bracket, and the output end of the driving motor extends to the inside of the bracket and is fixedly connected with a first bevel gear; the second bevel gear is fixedly connected to the upper end of the outer wall of the first rotating shaft; and the first bevel gear and the second bevel gear are both in meshed connection with the third bevel gear. As a heating ring capable of being rapidly cooled, the heating ring body has an outer diameter of 280-320mm, an inner diameter of 260-300mm, a height of 40-60mm and a wall thickness of 8-12mm. As a heating ring capable of being rapidly cooled, the radiating fins are preferably of a trapezoid structure, and the surfaces of the radiating fins are coated with an anodic aluminum oxide film layer. As a rapidly coolable heating ring of the utility model, it is preferable that the heating ring body is provided on the inner side with a plurality of temperature sensors. As a heating ring capable of being rapidly cooled, the back of the heating ring body is preferably provided with a plurality of uniformly distributed bolt mounting holes. As a heating ring capable of being rapidly cooled, the upper surface of the heating ring body is preferably provided with an aluminum nitride ceramic heat insulation layer. As a heating ring capable of rapid cooling in the present utility model, preferably, the medium inlet is connected to an external cooling medium supply device, the cooling medium is argon, nitrogen or deionized water, and the medium outlet is connected to an external heat exchanger. The beneficial effects of the utility model are as follows: Through the synergistic effect of spiral cooling channel and heat radiation fins, realize quick temperature rise and temperature uniformity control, aluminium nitride ceramic insulating layer reduces the heat loss, promotes heating efficiency, and integrated structure reinforcing heat dispersion, increase of service life adapts to multiple cooling medium, and the modularized design is convenient for maintain, reduces energy consumption and running cost, is showing improvement etching process stability and production efficiency. Drawings In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of