CN-224233890-U - Superhigh heat conduction material heat dissipation circuit board for mining machine
Abstract
The utility model relates to the field of circuit boards, in particular to an ultrahigh heat conduction material heat dissipation circuit board for an ore machine, which comprises a heat dissipation plate, wherein a high heat conduction insulating layer is fixedly connected to the upper end of the heat dissipation plate, and a circuit copper foil board is fixedly connected to the upper end of the high heat conduction insulating layer. According to the utility model, the aluminum plate layer and the heat conduction silicone grease layer of the traditional aluminum substrate are eliminated, the heat radiation plate and the circuit copper foil plate are directly bonded by the high heat conduction insulating layer, the heat conduction path from the chip to the heat radiation block is greatly shortened, the heat radiation attenuation problem caused by silicone grease aging and uneven coating is thoroughly solved, the heat conduction efficiency is greatly improved, the independent aluminum plate layer and silicone grease layer are structurally omitted, the circuit board is reduced, the high-density deployment requirement of a mining machine is met, a plurality of circuit boards can be installed on a standard mining machine cabinet, the cross block can be pushed in along the installation groove, and the cross block is installed in the first screw hole and the second screw hole through the screw threads of the screw column, so that three-point locking is realized, and the operation and maintenance cost of the mining field is greatly reduced.
Inventors
- HUANG PENG
- YANG SHUANG
Assignees
- 东莞市康纳电子科技有限公司
Dates
- Publication Date
- 20260512
- Application Date
- 20250327
Claims (5)
- 1. A heat-dissipating circuit board made of ultrahigh heat-conducting materials for a mining machine comprises a heat-dissipating plate (1) and is characterized in that a high heat-conducting insulating layer (2) is fixedly connected to the upper end of the heat-dissipating plate (1), a circuit copper foil board (3) is fixedly connected to the upper end of the high heat-conducting insulating layer (2), a solder paste board (4) is fixedly connected to the upper end of the circuit copper foil board (3), a plurality of chips (5) are fixedly connected to the upper end of the solder paste board (4), heat-dissipating blocks (6) which are uniformly distributed are fixedly connected to the lower end of the heat-dissipating plate (1), first heat-dissipating holes (7) which are uniformly distributed are formed in one side of the heat-dissipating plate (1) in a penetrating manner, first heat-dissipating columns (8) are fixedly connected to the inner wall of the first heat-dissipating holes (7), second heat-dissipating holes (9) are formed in one side of the heat-dissipating blocks (6) in a penetrating manner, second heat-dissipating columns (10) are fixedly connected to the inner wall of the second heat-dissipating columns (9), mounting grooves (11) are formed in the left end of the heat-dissipating blocks (6) in a penetrating manner, a plurality of mounting grooves (11) are formed in the inner walls of the mounting grooves are jointly and are slidably provided with a cross block (12), a cross block (12) is arranged on the upper end of the heat-dissipating plate (1) and a heat-dissipating plate (1) in a locking mechanism, a cross screw hole (14) is formed in the upper end of the heat-dissipating block (1) and a locking mechanism is provided with a screw hole (15), and a second screw hole (15) is formed in the second screw hole (15), the inner walls of the second screw hole (15) and the first screw hole (14) are provided with screw columns (16) in a threaded mode, and the novel heat radiator is characterized in that third heat dissipation holes (13) which are uniformly distributed are formed in the lower portion of one side of the cross block (12) in a penetrating mode, and the inner diameter of each third heat dissipation hole (13) is one millimeter.
- 2. The superhigh heat conduction material heat dissipation circuit board for the mining machine as claimed in claim 1, wherein the lower part of one side of the heat dissipation block (6) is provided with a second heat dissipation hole (9) in a penetrating way, the inner wall of the second heat dissipation hole (9) is fixedly connected with a second heat conduction column (10), and the second heat dissipation hole (9) and the third heat dissipation hole (13) are distributed in a staggered way.
- 3. The ultra-high heat conducting material heat dissipation circuit board for a mining machine as set forth in claim 1, wherein the lower ends of the cross pieces (12) are flush with the lower ends of the heat dissipation pieces (6).
- 4. The ultrahigh heat-conducting material heat dissipation circuit board for the mining machine as claimed in claim 1, wherein the left end and the right end of the cross block (12) are positioned outside the heat dissipation block (6), and the left end and the right end of the cross block (12) are respectively level with the left end and the right end of the heat dissipation plate (1).
- 5. The ultra-high heat conduction material heat dissipation circuit board for the mining machine according to claim 1, wherein the heat dissipation plate (1), the high heat conduction insulating layer (2) and the side wall of the circuit copper foil board (3) are flush.
Description
Superhigh heat conduction material heat dissipation circuit board for mining machine Technical Field The utility model belongs to the field of circuit boards, and particularly relates to a heat dissipation circuit board made of an ultrahigh heat conduction material and used for a mining machine. Background With the rapid development of blockchain technology, the mining machine is used as a core device for cryptocurrency mining, and the performance and the stability of the mining machine have key influences on the efficiency of calculation and the operation cost. The core components (such as ASIC chips) of the mining machine can generate a large amount of heat during high-load operation, and efficient heat dissipation becomes a key for guaranteeing stable operation and prolonging service life of the mining machine. The heat dissipation structure of traditional mining machine heat dissipation circuit board is complicated, the chip heat only needs to be conducted to the heat dissipation aluminum part through multilayer media such as solder paste, copper foil, insulating layer, aluminum plate, heat conduction silicone grease, and thermal resistance is big, heat conduction efficiency is low, wherein the coefficient of heat conduction silicone grease is only 2.0W/m-K, and its thickness, homogeneity and area of contact all can influence the radiating effect, and the heat that produces can lead to heat conduction silicone grease ageing, volatilize, harden when equipment is running, reduce heat conduction efficiency, influence equipment continuous operation stability, traditional structure still has equipment size big simultaneously, weight is big, the inconvenient problem of assembly. Therefore, the ultrahigh heat conduction material heat dissipation circuit board for the mining machine is provided, an aluminum plate layer and a heat conduction silicone grease layer of an aluminum substrate are reduced, a heat conduction channel is shortened, heat of a chip is more efficiently conducted to a radiator, the service life of equipment is prolonged, and the assembly is quicker and more convenient. Disclosure of utility model In order to solve the problems that the heat conduction channel is difficult to shorten, the heat dissipation efficiency cannot be improved, the size is large and the assembly is inconvenient when the traditional circuit board is used, the ultrahigh heat conduction material heat dissipation circuit board for the mining machine is provided. The technical scheme is that the ultrahigh heat conduction material heat dissipation circuit board for the mining machine comprises a heat dissipation plate, wherein a high heat conduction insulating layer is fixedly connected to the upper end of the heat dissipation plate, a circuit copper foil plate is fixedly connected to the upper end of the high heat conduction insulating layer, a solder paste plate is fixedly connected to the upper end of the circuit copper foil plate, a plurality of chips are fixedly connected to the upper end of the solder paste plate, uniformly distributed heat dissipation blocks are fixedly connected to the lower end of the heat dissipation plate, uniformly distributed first heat dissipation holes are formed in one side of the heat dissipation plate in a penetrating mode, first heat conduction columns are fixedly connected to the inner walls of the first heat dissipation holes, second heat dissipation holes are formed in one side of the heat dissipation blocks in a penetrating mode, second heat conduction columns are fixedly connected to the inner walls of the second heat dissipation holes, mounting grooves are formed in the left ends of the heat dissipation blocks in a penetrating mode, cross-shaped heat dissipation plates are arranged on the inner walls of the mounting grooves in a sliding mode, and locking mechanisms are arranged on the cross-shaped blocks and the heat dissipation plates. The locking mechanism comprises a first screw hole, a second screw hole and a threaded column, wherein the lower end of the cross block is provided with two first screw holes in a penetrating mode, the lower end of the heat dissipation plate is provided with two second screw holes in a penetrating mode, and the threaded column is mounted on the inner wall of the second screw hole and the inner wall of the first screw hole in a threaded mode. Preferably, the lower part of one side of the cross block is penetrated and provided with third heat dissipation holes which are uniformly distributed, and the inner diameter of each third heat dissipation hole is one millimeter. Preferably, the lower part of one side of the radiating block is penetrated and provided with a second radiating hole, the inner wall of the second radiating hole is fixedly connected with a second heat conduction column, and the second radiating holes and the third radiating holes are distributed in a staggered manner. Preferably, the lower ends of the cross blocks are flush with the lo