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CN-224233894-U - Heat radiation structure for controller, air cooling heat radiation structure, liquid cooling heat radiation structure, controller and movable platform

CN224233894UCN 224233894 UCN224233894 UCN 224233894UCN-224233894-U

Abstract

The utility model discloses a heat radiation structure, an air cooling heat radiation structure, a liquid cooling heat radiation structure, a controller and a movable platform, wherein the heat radiation structure for the controller comprises a first shell of the controller, the first shell is arranged on one side of a chip set of the controller, which is far away from a circuit board of the controller, the first shell comprises a main shell and a heat radiation module which are arranged in a modularized mode, and the heat radiation module is arranged on the main shell, is positioned at a position of the main shell, which corresponds to a chip set arrangement area, and is used for radiating heat of the chip set. Therefore, after the specification or the position of the chip of the controller is changed, the heat dissipation effect can be ensured not to be degraded by only changing the heat dissipation module corresponding to the new chip under the condition that the main shell is not changed, and the development time and the development cost are greatly reduced.

Inventors

  • ZOU RUN
  • HUANG BINBIN
  • CHEN KAI

Assignees

  • 深圳市卓驭科技有限公司

Dates

Publication Date
20260512
Application Date
20250421

Claims (10)

  1. 1. A heat dissipating structure for a controller, characterized by comprising a first housing (20) of the controller, said first housing (20) being arranged on a side of a chipset of the controller facing away from a circuit board (40) of the controller; The first housing (20) comprises a main housing and a heat dissipation module which are arranged in a modularized mode, wherein the heat dissipation module is installed on the main housing, is located at a position of the main housing corresponding to a chipset arrangement area and is used for dissipating heat of the chipset.
  2. 2. The heat dissipating structure for a controller according to claim 1, wherein the heat dissipating module is mounted on the main housing by soldering, and/or, The heat dissipation module is provided with a bulge group at a position corresponding to the chip group.
  3. 3. The heat dissipating structure for a controller according to claim 2, wherein the main housing is die-cast, provided with a relieved tooth, or aluminum extrusion.
  4. 4. The heat dissipating structure for a controller according to claim 2, wherein the heat dissipating module is die-cast, provided with a relieved tooth, aluminum extrusion, or includes a heat dissipating tooth module (222) and a heat uniforming module (223), the heat uniforming module (223) being connected to a side of the heat dissipating tooth module (222) facing the chipset, the protrusion group being provided on a side of the heat uniforming module (223) facing the chipset.
  5. 5. The heat dissipating structure for a controller according to claim 4, wherein the heat uniforming module (223) is made of a pure metal plate or a heat uniforming plate, and/or, The heat dissipation tooth module (222) is connected with the uniform heating module (223) in a welding mode.
  6. 6. The heat dissipation structure for a controller according to any one of claims 1 to 5, wherein the main housing is provided with a first through hole (211) at a position corresponding to a chipset-provided region; the heat dissipation module is mounted in the first through hole (211).
  7. 7. An air-cooled heat dissipating structure for a controller, comprising a fan (70) and the heat dissipating structure for a controller of any one of claims 1 to 6, wherein, The fan (70) is arranged on the side of the heat dissipation module facing away from the chip set.
  8. 8. The liquid cooling heat dissipation structure for a controller, which is characterized by comprising the heat dissipation structure for a controller as set forth in any one of claims 1 to 5, wherein, The main shell is a water-cooled shell, and the heat dissipation module is arranged on one side of the water-cooled shell, which faces the chip set.
  9. 9. The controller is characterized by comprising a first shell (20), a chip set, a circuit board (40) and a bottom cover (50), The first housing (20) is a first housing (20) according to any one of claims 1 to 8; The chipset is electrically connected on a first side of a circuit board (40); the first shell (20) is arranged on one side of the chip set, which is far away from the circuit board (40); the bottom cover (50) is arranged on one side of the circuit board (40) which is far away from the chip set; The first housing (20) is connected with the bottom cover (50) to form a receiving space for receiving the circuit board (40) and the chip set.
  10. 10. A mobile platform comprising the controller of claim 9.

Description

Heat radiation structure for controller, air cooling heat radiation structure, liquid cooling heat radiation structure, controller and movable platform Technical Field The utility model relates to a heat dissipation device, in particular to a heat dissipation structure, an air cooling heat dissipation structure, a liquid cooling heat dissipation structure, a controller and a movable platform for a controller. Background The chipset in the controller heats up during operation. In order to avoid performance degradation caused by overheating and to avoid permanent hardware damage, and to ensure reliability and safety of the controller, it is generally necessary to dissipate heat from the chipset of the controller, especially from a chipset with high computation power. However, the current controllers on the market often configure different chip sets according to different requirements, and when the configuration of the chip sets is changed, the heat dissipation structure needs to be replaced integrally to ensure the heat dissipation effect. But this solution of integrally replacing the heat-dissipating structure results in excessive production costs. Disclosure of utility model In order to solve at least one of the above problems, according to an aspect of the present utility model, there is provided a heat dissipation structure for a controller. The heat dissipation structure for the controller comprises a first shell of the controller, wherein the first shell is arranged on one side, away from a circuit board of the controller, of a chip set of the controller, the first shell comprises a main shell and a heat dissipation module which are arranged in a modularized mode, and the heat dissipation module is arranged on the main shell, is located at a position, corresponding to a chip set arrangement area, of the main shell and is used for dissipating heat of the chip set. Therefore, after the specification or the position of the chip of the controller is changed, the heat dissipation module corresponding to the new chip (the chip after the position is changed or the chip after the specification is changed) can be only changed under the condition that the main shell is not changed, so that the heat dissipation effect is not deteriorated, and the development time and the development cost are greatly reduced. In some embodiments, the heat dissipating module is mounted to the main housing by means of welding. Therefore, the thermal resistance between the heat radiation module and the main shell can be reduced, and the heat radiation effect of the heat radiation module and the main shell is ensured. In some embodiments, the heat dissipation module is provided with a bump set at a position corresponding to the chipset. Therefore, the radiating effect of the radiating module on the chip set can be guaranteed through the protrusions. In some embodiments, the heat dissipating module is mounted to the main housing by friction welding, brazing, glue welding, or laser welding. Therefore, the welding effect of the heat radiation module and the main shell can be ensured, and meanwhile, the heat resistance between the heat radiation module and the main shell is ensured to be lower. In some embodiments, the main housing is die cast, provided with teeth or extruded aluminum. The die casting molding has higher processing efficiency, and the density of the heat dissipation teeth of the main shell can be increased by arranging the shovel teeth on the main shell or by aluminum extrusion molding, and the heat dissipation efficiency of the main shell is greatly improved by greatly improving the heat dissipation area. In some embodiments, the heat dissipating module is die-cast, provided with a relieved tooth, aluminum extrusion, or comprises a heat dissipating tooth module and a heat homogenizing module connected to a side of the heat dissipating tooth module facing the chipset, and the protrusion set is disposed on a side of the heat homogenizing module facing the chipset. The die-casting molding has higher processing efficiency, the density of the radiating teeth of the radiating module can be increased by arranging the relieving teeth on the radiating module or by aluminum extrusion molding, the radiating efficiency of the radiating module is greatly improved by greatly improving the radiating area, the radiating module comprises the radiating teeth module and the heat homogenizing module, the heat of the chip group can be homogenized by the heat homogenizing module, the heat flow density is reduced, and then the heat is led into the radiating teeth module and finally dissipated into the outside, so that the radiating efficiency of the radiating module is greatly improved. In some embodiments, the soaking module is made of pure metal plate or soaking plate, for example, pure copper. Therefore, the heat homogenizing effect of the heat homogenizing module is ensured. In some embodiments, the heat dissipating tooth module and the heat