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CN-224233895-U - Circuit board module and electronic equipment

CN224233895UCN 224233895 UCN224233895 UCN 224233895UCN-224233895-U

Abstract

The application relates to the technical field of circuit boards and discloses a circuit board module and electronic equipment, wherein a first circuit board of the circuit board module comprises at least two first welding parts which are arranged at intervals along a first direction and are separated by a first interval groove; the patch component comprises a patch component and a second circuit board, the patch component is arranged on the second circuit board, the second circuit board comprises at least two second welding parts, the two second welding parts are arranged at intervals along the first direction and separated by a second spacing groove, the first welding parts are welded with the second welding parts, and the first spacing groove is communicated with the second spacing groove. The circuit board module can promote the heat conduction of hot air current to first welding part and second welding part in the welding furnace through setting up first spacing groove and second spacing groove, can effectively promote the welding effect of paster components and parts and circuit board under the prerequisite of guaranteeing paster components and parts safety.

Inventors

  • XIE YEFEI

Assignees

  • 广州视琨电子科技有限公司

Dates

Publication Date
20260512
Application Date
20250423

Claims (10)

  1. 1. A circuit board module, comprising: the first circuit board comprises at least two first welding parts which are arranged at intervals along a first direction and are separated by a first interval groove; The patch assembly comprises a patch component and a second circuit board, wherein the patch component is arranged on the second circuit board, the second circuit board comprises at least two second welding parts, the two second welding parts are arranged along the first direction at intervals and are separated by a second interval groove, the first welding parts are in welded connection with the second welding parts, and the first interval groove is communicated with the second interval groove.
  2. 2. The circuit board module according to claim 1, wherein, Along a second direction, the length L1 of the first spacing groove and the length L2 of the second spacing groove meet the condition that L1 is more than or equal to L2, and the second direction is perpendicular to the first direction.
  3. 3. The circuit board module according to claim 1, wherein, And a welding port is arranged on one side, far away from the surface-mounted component, of the second welding part along a second direction, the distance L3 between the welding port and the surface-mounted component is more than or equal to 8mm, and the second direction is perpendicular to the first direction.
  4. 4. The circuit board module according to claim 1, wherein, The first circuit board is provided with a first containing groove and a first through groove which penetrate through, the patch components are contained in the first containing groove, the first through groove is located between the first containing groove and the first interval groove along a second direction, the part of the second circuit board is exposed to the first through groove, and the second direction is perpendicular to the first direction.
  5. 5. The circuit board module of claim 4, wherein, The first through groove is communicated with the first accommodating groove and the first spacing groove.
  6. 6. The circuit board module of claim 4, wherein, At least partial groove wall of the first accommodating groove is abutted with the side wall of the patch component.
  7. 7. The circuit board module of claim 4, wherein, The first welding part is provided with a plurality of first through holes, the second circuit board avoids at least part of the first through holes, and/or the second welding part is provided with a plurality of second through holes, and at least part of the second through holes are communicated with the first through grooves.
  8. 8. The circuit board module of claim 7, wherein the circuit board module comprises a plurality of circuit boards, The first welding part comprises a first heat conducting piece, the first through hole is formed in the first heat conducting piece, and/or the second welding part comprises a second heat conducting piece, and the second through hole is formed in the second heat conducting piece.
  9. 9. The circuit board module of claim 7, wherein the circuit board module comprises a plurality of circuit boards, Along the first direction, the width K1 of the first spacing groove is more than or equal to 3mm, the width K2 of the second spacing groove is more than or equal to 3mm, and/or, The diameter D1 of the first through hole is more than or equal to 0.2mm and less than or equal to 1mm, and the diameter D2 of the second through hole is more than or equal to 0.2mm and less than or equal to 1mm.
  10. 10. An electronic device comprising a circuit board module according to any one of claims 1-9.

Description

Circuit board module and electronic equipment Technical Field The embodiment of the application relates to the technical field of circuit boards, in particular to a circuit board module and electronic equipment. Background Various components are usually welded on a PCBA circuit board of electronic equipment, and in the traditional welding technology, plug-in components are plugged on the circuit board for welding, so that the welding efficiency of the method is low. Therefore, the prior art is developed into a patch type welding process, namely, the welding part of the component and the welding part of the circuit board are welded in a surface-to-surface contact manner, and the welding method is rapid and efficient. However, the inventors of the present application found that the chip-type soldering process is prone to have a problem that the temperature of the two soldering portions is low at the conventional soldering temperature, cold soldering or cold soldering is likely to occur between the component and the circuit board, and the component is likely to be burned out by increasing the temperature in the soldering furnace. Therefore, how to improve the welding effect on the premise of ensuring the safety of the components is a difficult problem to be solved. Disclosure of utility model The embodiment of the application provides a circuit board module and electronic equipment, which can effectively improve the welding effect of a patch element and a circuit board on the premise of ensuring the safety of the patch element. In a first aspect, the embodiment of the application adopts a technical scheme that a circuit board module is provided and comprises a first circuit board and a patch assembly. The first circuit board comprises at least two first welding parts which are arranged at intervals along the first direction and are separated by first interval grooves. The patch component comprises a patch component and a second circuit board, the patch component is arranged on the second circuit board, the second circuit board comprises at least two second welding parts, the two second welding parts are arranged at intervals along the first direction and separated by a second spacing groove, the first welding parts are welded with the second welding parts, and the first spacing groove is communicated with the second spacing groove. In some embodiments, the length L1 of the first spacing groove and the length L2 of the second spacing groove along the second direction satisfy that L1 is equal to or greater than L2, and the second direction is perpendicular to the first direction. In some embodiments, a welding port is arranged on one side of the second welding part far away from the surface mount component along the second direction, and the distance L3 between the welding port and the surface mount component is equal to or more than 8mm, wherein the second direction is perpendicular to the first direction. In some embodiments, the first circuit board is provided with a first accommodating groove and a first through groove, the patch component is accommodated in the first accommodating groove, the first through groove is located between the first accommodating groove and the first spacing groove along the second direction, and the part of the second circuit board is exposed to the first through groove. In some embodiments, the first through slot communicates with the first receiving slot and the first spacing slot. In some embodiments, at least a partial groove wall of the first accommodating groove is abutted with a side wall of the patch component. In some embodiments, the first solder portion is provided with a plurality of first through holes, and the second circuit board is free from at least a portion of the first through holes, and/or the second solder portion is provided with a plurality of second through holes, and at least a portion of the second through holes are communicated with the first through grooves. In some embodiments, the first weld includes a first thermally conductive member with a first through hole disposed therein, and/or the second weld includes a second thermally conductive member with a second through hole disposed therein. In some embodiments, in the first direction, the width K1 of the first spacing groove satisfies that K1 is greater than or equal to 3mm, the width K2 of the second spacing groove satisfies that K2 is greater than or equal to 3mm, and/or the diameter D1 of the first through hole satisfies that D1 is greater than or equal to 0.2mm and less than or equal to 1mm, and the diameter D2 of the second through hole satisfies that D2 is greater than or equal to 0.2mm and less than or equal to 1mm. In a second aspect, another technical scheme adopted by the embodiment of the application is to provide electronic equipment, which comprises a circuit board module. The heat transfer type circuit board module has the advantages that the distance between the first welding part of t