CN-224233896-U - Riveting type multi-layer circuit board structure

Abstract

The present disclosure provides a riveted multi-layer circuit board structure. The riveting type multi-layer circuit board structure comprises two first core boards, two second core boards and riveting assemblies, wherein a first prepreg layer is connected between the two first core boards in a pressing mode to form a first pressing board assembly, a plurality of first riveting through holes are formed in the first pressing board assembly, a second prepreg layer is connected between the two second core boards in a pressing mode to form a second pressing board assembly, the second pressing board assembly and the first pressing board assembly are arranged in a stacked mode, a plurality of second riveting through holes are formed in the second pressing board assembly, each second riveting through hole is communicated with the corresponding first riveting through hole to form a riveting through hole, the riveting assemblies comprise a plurality of riveting parts, each riveting part penetrates through the corresponding riveting through hole, one end of each riveting part is connected with the first pressing board assembly in a pressing mode, and the other end of each riveting part is connected with the second pressing board assembly in a riveting mode. The riveting type multilayer circuit board structure has higher production efficiency.

Inventors

• CHEN WENLI
• HE HAIDONG

Assignees

• 惠州市煜翔科技有限公司

Dates

Publication Date

20260512

Application Date

20250514

Claims (10)

1. 1. A riveted multi-layer circuit-board structure, comprising: The first prepreg layers are connected between the two first core boards in a pressing mode to form a first pressing plate assembly, a plurality of first riveting through holes are formed in the first pressing plate assembly, and the first riveting through holes are arranged at intervals; The second laminating plate assembly is arranged in a lamination mode with the first laminating plate assembly, a plurality of second riveting through holes are formed in the second laminating plate assembly, each second riveting through hole is communicated with the corresponding first riveting through hole to form a riveting through hole together, and each second riveting through hole is correspondingly arranged with the corresponding first riveting through hole; The riveting assembly comprises a plurality of riveting parts, each riveting part penetrates through the corresponding riveting through hole, one end of each riveting part is connected with the first pressing plate assembly in a riveting mode, the other end of each riveting part is connected with the second pressing plate assembly in a riveting mode, and each riveting part is correspondingly arranged with the corresponding riveting through hole.
2. 2. The structure of claim 1, further comprising at least two intermediate core boards, wherein an intermediate prepreg layer is pressed between the two intermediate core boards to form an intermediate lamination board assembly, the first lamination board assembly, the intermediate lamination board assembly and the second lamination board assembly are sequentially stacked, the intermediate lamination board assembly is provided with a plurality of intermediate riveting through holes, each intermediate riveting through hole is respectively communicated with the corresponding first riveting through hole and the corresponding second riveting through hole to form the riveting through hole, and each riveting part is connected with the intermediate lamination board assembly.
3. 3. The riveted multi-layer circuit-board structure of claim 2, wherein the number of intermediate core boards is 2n, the number of intermediate prepreg layers is n, the number of intermediate laminate assemblies is n, and n is an integer greater than or equal to 1.
4. 4. A riveted multi-layer circuit card structure according to claim 3, wherein when n is equal to 2, the number of said intermediate lamination plate assemblies is two, two said intermediate lamination plate assemblies are located between said first lamination plate assembly and said second lamination plate assembly, two said intermediate lamination plate assemblies are stacked, an intermediate adhesive layer is provided at the junction between two said intermediate lamination plate assemblies, and the number of said intermediate adhesive layers is n-1.
5. 5. The riveted multi-layer circuit-board structure of claim 3, wherein when n is greater than or equal to 3, the number of said intermediate laminated board assemblies is plural, a plurality of said intermediate laminated board assemblies are located between said first laminated board assembly and said second laminated board assembly, a plurality of said intermediate laminated board assemblies are sequentially stacked, an intermediate adhesive layer is disposed at the junction between two adjacent said intermediate laminated board assemblies, and the number of said intermediate adhesive layers is n-1.
6. 6. The riveted multi-layer circuit-plate structure of claim 5, wherein each of the intermediate adhesive layers is a yellow adhesive layer structure.
7. 7. The riveted multi-layer circuit board structure of claim 2, wherein a first adhesive layer is disposed at a junction between the first pressboard assembly and the intermediate pressboard assembly and a second adhesive layer is disposed at a junction between the second pressboard assembly and the intermediate pressboard assembly.
8. 8. The riveted multi-layer circuit-board structure of claim 7, wherein the first and second adhesive layers are each a yellow adhesive layer structure.
9. 9. The riveted multi-layer circuit-board structure of claim 1, wherein each of the rivet portions is a rivet structure.
10. 10. The riveted multi-layer circuit-board structure of claim 1, wherein the aperture of each of the rivet through holes is greater than or equal to 2mm.

Description

Riveting type multi-layer circuit board structure Technical Field The disclosure relates to the technical field of multilayer circuit boards, and in particular relates to a riveting type multilayer circuit board structure. Background The multilayer circuit board is a circuit board which is provided with three or more conductive layers, adjacent conductive layers are separated by a dielectric layer, and meanwhile, the adjacent conductive layers are connected with each other in a through hole plating mode. The multilayer circuit board is widely applied to the fields of communication equipment, computers, consumer electronics, medical equipment, industrial control, automobile electronics and the like. The related art multilayer circuit board includes a plurality of core boards, the plurality of core boards are stacked in turn, a prepreg layer is disposed between two adjacent core boards, and the plurality of core boards and the corresponding prepreg layer are subjected to lamination treatment, so that the prepreg layer is respectively in lamination connection with the two adjacent core boards, each core board is formed with a circuit pattern, and copper-deposited through holes are formed between the two adjacent core boards, so that the two adjacent core boards are connected with each other, for example, in chinese patent No. CN 201811562035.9. However, as the plurality of core plates are sequentially stacked, the prepreg layers are arranged between the two adjacent core plates, and the plurality of core plates and the corresponding prepreg layers are subjected to lamination treatment, the number of layers required to be subjected to lamination treatment each time in the manufacturing process of the multi-layer circuit board is more, so that the difficulty of lamination treatment of the multi-layer circuit board is higher, and the production efficiency of the multi-layer circuit board is lower. Disclosure of utility model The purpose of this disclosure is to overcome the shortcoming among the prior art, provides a riveting type multilayer circuit board structure that production efficiency is higher. The aim of the disclosure is achieved by the following technical scheme: a riveted multi-layer circuit-board structure comprising: The first prepreg layers are connected between the two first core boards in a pressing mode to form a first pressing plate assembly, a plurality of first riveting through holes are formed in the first pressing plate assembly, and the first riveting through holes are arranged at intervals; The second laminating plate assembly is arranged in a lamination mode with the first laminating plate assembly, a plurality of second riveting through holes are formed in the second laminating plate assembly, each second riveting through hole is communicated with the corresponding first riveting through hole to form a riveting through hole together, and each second riveting through hole is correspondingly arranged with the corresponding first riveting through hole; The riveting assembly comprises a plurality of riveting parts, each riveting part penetrates through the corresponding riveting through hole, one end of each riveting part is connected with the first pressing plate assembly in a riveting mode, the other end of each riveting part is connected with the second pressing plate assembly in a riveting mode, and each riveting part is correspondingly arranged with the corresponding riveting through hole. In one embodiment, the riveted multi-layer circuit board structure further comprises at least two middle core boards, wherein a middle prepreg layer is connected between the two middle core boards in a pressing manner to form a middle pressing board assembly, the first pressing board assembly, the middle pressing board assembly and the second pressing board assembly are sequentially stacked, the middle pressing board assembly is provided with a plurality of middle riveting through holes, each middle riveting through hole is respectively communicated with the corresponding first riveting through hole and the corresponding second riveting through hole to form a riveting through hole together, and each riveting part is connected with the middle pressing board assembly. In one embodiment, the number of intermediate core boards is 2n, the number of intermediate prepreg layers is n, the number of intermediate laminate assemblies is n, and n is an integer greater than or equal to 1. In one embodiment, when n is equal to 2, the number of the intermediate lamination plate assemblies is two, the two intermediate lamination plate assemblies are located between the first lamination plate assembly and the second lamination plate assembly, the two intermediate lamination plate assemblies are stacked, an intermediate bonding layer is arranged at the joint between the two intermediate lamination plate assemblies, and the number of the intermediate bonding layers is n-1. In one embodiment, when n is greater than or e