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CN-224233900-U - High-precision circuit board with multiple interfaces

CN224233900UCN 224233900 UCN224233900 UCN 224233900UCN-224233900-U

Abstract

The utility model provides a multi-interface high-precision circuit board which comprises a board body, positioning holes and a pin group, wherein the four corners of the board body are provided with the positioning holes. The heat-collecting layer is uniformly led to the heat-collecting layer, a plurality of through holes are formed in the heat-collecting layer, the through holes are arranged in a honeycomb shape, the heat-radiating area of the heat-collecting layer is large, fans can be arranged above and below the heat-collecting layer, high-speed air flows quickly pass through the through holes, and the heat of the heat-collecting layer is quickly radiated, so that a plurality of first interfaces and second interfaces are quickly radiated, the quick heat radiation of the circuit board with multiple interfaces is prevented, the heat radiation performance is good, heat accumulation is not easy, and heat accumulation can be effectively prevented. Through efficient heat conduction and heat dissipation design, heat on the circuit board can be taken away rapidly, and heat accumulation is avoided. This helps to reduce the temperature of the circuit board and improve the stability and reliability of the circuit. The good heat dissipation performance can ensure that the circuit board can work normally under a high-temperature environment, so that the performance and stability of the whole system are improved.

Inventors

  • LIU ZHIZHE
  • LIU ZAN
  • DENG XIAOFANG

Assignees

  • 深圳市奔力达电路科技有限公司

Dates

Publication Date
20260512
Application Date
20250522

Claims (6)

  1. 1. The high-precision circuit board with multiple interfaces is characterized by comprising a board body (1), positioning holes (2) and contact pin groups (3), wherein the positioning holes (2) are formed in four corners of the board body (1), and the contact pin groups (3) are fixedly connected to the edge of the top surface of the board body (1); A chip (4) is arranged in the middle of the top surface of the plate body (1); a plurality of first interfaces (5) are arranged at the other edge of the top surface of the plate body (1), and the first interfaces (5) are arranged side by side to form a group; A plurality of second interfaces (6) are arranged at the other edge of the top surface of the plate body (1), and the second interfaces (6) are arranged side by side to form a group; The top surfaces of the first interface (5) and the second interface (6) are attached with heat conduction belts (7), and the bottom surfaces of the heat conduction belts (7) are attached to the top surfaces of the first interface (5) and the second interface (6) through silicone grease layers (8); the heat conduction belt (7) descends after passing through the first connector (5) and extends to the top surface of the second connector (6) in a stepped manner; The end part of the heat conduction belt (7) extends out of the upper part of the plate body (1), the end part of the heat conduction belt (7) is fixedly connected with a heat collection layer (9), a plurality of through holes (10) are formed in the heat collection layer (9), and the through holes (10) are arranged in a honeycomb shape.
  2. 2. The multi-interface high-precision circuit board according to claim 1, wherein the substrate of the board body (1) is epoxy resin, and the top surface of the board body (1) is covered with an insulating layer.
  3. 3. The multi-interface high-precision circuit board according to claim 2, wherein the first interface (5) is a network port or a USB port, and the height of the first interface (5) is larger than that of the second interface (6).
  4. 4. The multi-interface high-precision circuit board according to claim 3, wherein the second interface (6) is a TYPE-C interface, and the heat conducting strip (7) is made of polyimide.
  5. 5. The multi-interface high-precision circuit board as claimed in claim 4, wherein the heat collecting layer (9) is located on the side face of the board body (1), the thickness of the heat collecting layer (9) is larger than that of the heat conducting strip (7), and the heat collecting layer (9) is made of polyimide.
  6. 6. A multi-interface high-precision circuit board according to claim 5, wherein the through holes (10) are in the shape of regular hexagons.

Description

High-precision circuit board with multiple interfaces Technical Field The utility model relates to the technical field of precise circuit boards, in particular to a multi-interface high-precision circuit board. Background The multi-interface circuit board, although capable of connecting more devices or connectors, is deficient in heat dissipation because the multi-interface design means that more connectors and components are required to be disposed on the circuit board, and these connectors and components generate heat during operation. The interface is dense to cause heat to be concentrated in a limited space, so that the difficulty of heat dissipation is increased. Wiring is complicated-wiring of high-precision wiring boards is often very complicated, and the line width, line spacing, and wiring direction all need to be carefully designed. The complicated wiring causes heat to accumulate in a local area, and is not easy to dissipate. Disclosure of utility model The object of the present utility model is to solve at least one of the technical drawbacks. Therefore, an object of the present utility model is to provide a multi-interface high-precision circuit board, which solves the problems mentioned in the background art and overcomes the shortcomings in the prior art. In order to achieve the above purpose, an embodiment of an aspect of the present utility model provides a multi-interface high-precision circuit board, which includes a board body, positioning holes, and pin groups, wherein the four corners of the board body are provided with the positioning holes, and the edge of the top surface of the board body is fixedly connected with the pin groups; A chip is arranged in the middle of the top surface of the plate body; a plurality of first interfaces are arranged at the other edge of the top surface of the plate body, and the first interfaces are arranged side by side to form a group; A plurality of second interfaces are arranged at the other edge of the top surface of the plate body, and the second interfaces are arranged side by side to form a group; The top surfaces of the first interface and the second interface are attached with heat conducting strips, and the bottom surfaces of the heat conducting strips are attached to the top surfaces of the first interface and the second interface through silicone grease layers; The heat conduction belt descends after passing through the first connector and extends to the top surface of the second connector in a stepped manner; The end part of the heat conducting belt extends out of the upper part of the plate body, the end part of the heat conducting belt is fixedly connected with a heat collecting layer, a plurality of through holes are formed in the heat collecting layer, and the through holes are arranged in a honeycomb shape. In any of the above embodiments, preferably, the substrate of the board body is epoxy resin, and the top surface of the board body is covered with an insulating layer. By adopting the technical scheme, the precise PCB circuit board consists of a board body, a pin group, a chip, elements on the board, a plurality of first interfaces and a plurality of second interfaces. The components on the board are fixed on the board body by adopting the mode of pin connection and then welding. Preferably, in any of the above schemes, the first interface is a network port or a USB port, and the height of the first interface is greater than the height of the second interface. In any of the above embodiments, it is preferable that the second interface is a TYPE-C port, and the heat conduction band is made of polyimide. The circuit board adopts the technical scheme that the circuit board has the core structure of a heat conduction belt, a silicone grease layer, a heat collection layer and a through hole. Firstly, the heat conduction band is provided with a silicone grease layer which is attached to the top surfaces of the first interface and the second interface in a large area, the heat conduction band is made of heat conduction insulating materials, and descends and extends to the top surface of the second interface in a stepped mode after passing through the first interface. The heat-collecting layer is uniformly led to the heat-collecting layer, a plurality of through holes are formed in the heat-collecting layer, the through holes are arranged in a honeycomb shape, the heat-radiating area of the heat-collecting layer is large, fans can be arranged above and below the heat-collecting layer, high-speed air flows quickly pass through the through holes, and the heat of the heat-collecting layer is quickly radiated, so that a plurality of first interfaces and second interfaces are quickly radiated, the quick heat radiation of the circuit board with multiple interfaces is prevented, the heat radiation performance is good, heat accumulation is not easy, and heat accumulation can be effectively prevented. Through efficient heat conduction and heat dissip