CN-224233910-U - High-strength double-layer PCB circuit board

Abstract

The utility model relates to the technical field of PCB (printed circuit board), in particular to a high-strength double-layer PCB, which comprises a heat dissipation frame, wherein the top surface and the bottom surface of the heat dissipation frame are fixedly connected with frames, and the inner wall of each frame is connected with a circuit board main body in a sliding manner. The utility model has the advantages that the assembly of the circuit board main body is replaced by the mode of glue bonding through the mode of bolt locking, so that the single circuit board main body is convenient to disassemble and overhaul, after the circuit board main bodies are assembled on the heat dissipation frame by workers, heat generated by the inner sides of the two circuit board main bodies can be transferred to the heat dissipation frame, the contact area between the circuit board main bodies and the heat dissipation frame can be increased through the arrangement of the heat conduction plates, the heat transfer efficiency can be improved, the heat on the heat dissipation frame can be transferred to a plurality of heat exchange plates and is discharged from a plurality of heat dissipation cavities, the heat dissipation effect of the joint of the two circuit board main bodies is greatly improved, the heat accumulation is prevented, and the performance of the circuit board is reduced.

Inventors

• ZHU TIEJUN
• Zhao ao

Assignees

• 深圳市鑫联精密电路有限公司

Dates

Publication Date

20260512

Application Date

20250522

Claims (6)

1. 1. The utility model provides a double-deck PCB circuit board of high strength, includes heat dissipation frame (1), the top surface and the equal fixedly connected with frame (2) of bottom surface of heat dissipation frame (1), every the inner wall sliding connection of frame (2) has a circuit board main part (3), two the one side that circuit board main part (3) are close to heat dissipation frame (1) all is laminated mutually with heat dissipation frame (1), every the left and right sides of heat dissipation frame (1) all has locking plate (4) through bolt fixed mounting, every locking plate (4) inboard fixedly connected with splice plate (5), splice plate (5) and frame (2) sliding connection, every splice plate (5) are close to one side fixedly connected with cardboard (6) of circuit board main part (3), two cardboard (6) all are with circuit board main part (3) looks joint, the inner wall fixedly connected with a plurality of linear array's heat transfer board (7) of heat dissipation chamber (8) have been formed between two adjacent heat transfer board (7) and the heat dissipation chamber (1).
2. 2. The high-strength double-layer PCB of claim 1, wherein splice grooves (9) are formed in the left side and the right side of the frame (2), the splice plates (5) are connected with the frame (2) in a sliding mode through the splice grooves (9), and the thickness of the splice plates (5) is equal to the depth of the splice grooves (9).
3. 3. The high-strength double-layer PCB of claim 2, wherein the left side and the right side of the main circuit board body (3) are provided with clamping grooves (10), and the two clamping plates (6) are clamped with the main circuit board body (3) through the two clamping grooves (10).
4. 4. The high-strength double-layer PCB circuit board according to claim 3, wherein the top surface and the bottom surface of the heat dissipation frame (1) are fixedly connected with a plurality of linear array heat conduction plates (11), a plurality of linear array embedded grooves (12) are formed in one side, close to the heat dissipation frame (1), of the circuit board main body (3), and the heat plate (11) is in sliding connection with the circuit board main body (3) through the embedded grooves (12).
5. 5. The high-strength double-layer PCB of claim 4, wherein the heat dissipation frame (1), the heat exchange plate (7) and the heat conduction plate (11) are all made of aluminum alloy, and the height of the frame (2) is equal to the thickness of the main circuit board body (3).
6. 6. The high-strength double-layer PCB of claim 5, wherein the top surface and the bottom surface of the heat dissipation frame (1) are provided with a plurality of symmetrically arranged positioning pins (13), one side of the circuit board main body (3) close to the heat dissipation frame (1) is provided with a plurality of symmetrically arranged positioning holes (14), and the positioning pins (13) are in sliding connection with the circuit board main body (3) through the positioning holes (14).

Description

High-strength double-layer PCB circuit board Technical Field The utility model relates to the technical field of PCB (printed circuit board), in particular to a high-strength double-layer PCB. Background A Double-layer PCB, namely Double-SIDED PRINTED Circuit Board (DSPCB for short), is one of the indispensable components in modern electronic devices. It forms a complex circuit structure by printing conductive traces on two layers of insulating substrates (typically glass fiber or epoxy composites, etc.), respectively, and connecting the traces in the vertical direction through metallized vias. The design of the double-layer PCB circuit board not only improves the flexibility of circuit layout, but also greatly saves the space of the circuit board, so that the electronic equipment can be more compact and efficient. Double-layer PCB boards present several challenges while providing many advantages. Since the two circuit boards are connected through the metallized through holes and are usually tightly attached together, heat generated by the circuit boards during operation is difficult to effectively dissipate. Especially in the application scene of high power and high frequency, the problem of heat accumulation is particularly remarkable. Long heat build-up not only reduces the performance of the circuit board, but may also cause circuit failure and even damage to the circuit board. Disclosure of utility model The object of the present utility model is to solve at least one of the technical drawbacks. Therefore, an objective of the present utility model is to provide a high-strength double-layer PCB circuit board, which solves the problems mentioned in the background art and overcomes the shortcomings in the prior art. In order to achieve the above object, an embodiment of an aspect of the present utility model provides a high-strength double-layer PCB, which includes a heat dissipation frame, wherein a border is fixedly connected to each of a top surface and a bottom surface of the heat dissipation frame, a circuit board main body is slidably connected to an inner wall of each border, one sides of the two circuit board main bodies, which are close to the heat dissipation frame, are respectively attached to the heat dissipation frame, locking plates are fixedly mounted on left and right sides of each heat dissipation frame through bolts, a splice plate is fixedly connected to an inner side of each locking plate, the splice plates are slidably connected to the border, a clamping plate is fixedly connected to one side, which is close to the circuit board main body, of each splice plate, two clamping plates are respectively clamped to the circuit board main body, a plurality of heat exchange plates in linear arrays are fixedly connected to an inner wall of the heat dissipation frame, and a heat dissipation cavity is formed between two adjacent heat exchange plates and the heat dissipation frame. By the above-mentioned scheme preferred, splice groove has all been seted up to the left and right sides of frame, splice plate passes through splice groove and frame sliding connection, splice plate's thickness equals with splice groove's degree of depth. By the above-mentioned scheme is preferred, the draw-in groove has all been seted up to the left and right sides of circuit board main part, two the cardboard passes through two draw-in grooves and circuit board bulk phase joint. By any of the above schemes, preferably, the top surface and the bottom surface of the heat dissipation frame are fixedly connected with a plurality of linear array heat conduction plates, one side of the circuit board main body, which is close to the heat dissipation frame, is provided with a plurality of linear array embedded grooves, and the heat conduction plates are in sliding connection with the circuit board main body through the embedded grooves By any of the above schemes, preferably, the heat dissipation frame, the heat exchange plate and the heat conduction plate are all made of aluminum alloy, and the height of the frame is equal to the thickness of the circuit board main body. By the above-mentioned scheme preferred, the locating pin that a plurality of symmetry set up has all been seted up to the top surface and the bottom surface of heat dissipation frame, the locating hole that a plurality of symmetry set up has been seted up to one side that the circuit board main part is close to the heat dissipation frame, locating pin passes through locating hole and circuit board main part sliding connection. Compared with the prior art, the utility model has the following advantages and beneficial effects: 1. When the double-layer circuit board is required to be assembled, a worker can insert two circuit board bodies into the two frames until the inner sides of the circuit board bodies are tightly attached to the heat dissipation frames, the locating pins can be inserted into the locating holes, the circuit board bodies can be located, t