CN-224233957-U - Analog signal acquisition device based on three-dimensional packaging

Abstract

The utility model provides an analog signal acquisition device based on three-dimensional packaging. The three-dimensional packaging structure is characterized by comprising a shell, wherein a three-dimensional packaging structure is arranged inside the shell, a signal circuit board, a power circuit board and an analog circuit board are sequentially stacked from bottom to top, resin is filled between the signal circuit board and the power circuit board, laser etching lines are arranged on side end faces of the three-dimensional packaging structure, the signal circuit board, the power circuit board and the analog circuit board are electrically connected through the laser etching lines, and a connecting port is further formed in one end of the three-dimensional packaging structure. The utility model relates to the field of analog signal acquisition devices.

Inventors

• WU WEIZHONG
• CHEN XIANG
• TANG ZHIHUA
• GUAN XIAOHUI

Assignees

• 珠海航宇微科技股份有限公司

Dates

Publication Date

20260512

Application Date

20250512

Claims (5)

1. 1. The utility model provides an analog signal collection system based on three-dimensional encapsulation, its characterized in that includes shell (1), the inside three-dimensional packaging structure (2) that is provided with of shell (1), three-dimensional packaging structure (2) are piled up in proper order from bottom to top and are provided with signal circuit board (3), power circuit board (4) and analog circuit board (5), signal circuit board (3) power circuit board (4) with fill between analog circuit board (5) resin (6), the side terminal surface of three-dimensional packaging structure (2) is provided with laser etching line, signal circuit board (3) power circuit board (4) with analog circuit board (5) are through laser etching line carries out electric connection, the one end of three-dimensional packaging structure (2) still is provided with connecting port (7).
2. 2. The analog signal acquisition device based on three-dimensional packaging according to claim 1, wherein windows (8) are symmetrically arranged at the front end and the rear end of the shell (1), the connecting port (7) is opposite to the windows (8), a disassembly opening (9) is formed in the lower end face of the shell (1), and a lower cover is matched with the disassembly opening (9).
3. 3. The stereoscopic packaging-based analog signal acquisition device according to claim 1, wherein an analog-to-digital converter (11) is arranged on the analog circuit board (5), the analog circuit board (5) converts an acquired analog signal into a digital signal through the analog-to-digital converter (11), and the converted digital signal is transmitted into the signal circuit board (3).
4. 4. The three-dimensional packaging-based analog signal acquisition device according to claim 1, wherein the signal circuit board (3) is provided with a micro control unit module (12), and the micro control unit module (12) is used for calculating and processing received digital signals.
5. 5. The analog signal acquisition device based on the three-dimensional package according to claim 1, wherein mounting blocks (14) with mounting holes (13) are symmetrically arranged at the front end and the rear end of the lower part of the shell (1).

Description

Analog signal acquisition device based on three-dimensional packaging Technical Field The utility model relates to the field of analog signal acquisition devices, in particular to an analog signal acquisition device based on three-dimensional packaging. Background With the progress of technology, circuit functions are becoming more and more rich, so that devices are highly dense, system-level circuits are excessively large, and planar space of a Printed Circuit Board (PCB) is excessively occupied, which is unfavorable for complex and changeable equipment conditions with harsh design conditions. The circuit connection of the traditional analog signal acquisition device is complex and various, the occupied space is large, and the fault rate and the maintenance cost are high. Disclosure of utility model Aiming at the problems in the prior art, the utility model provides an analog signal acquisition device based on three-dimensional packaging, which aims to adopt a strategy of exchanging three-dimensional space for planar space so that a system-level circuit tends to be miniaturized. In order to achieve the above purpose, the technical scheme includes that the analog signal acquisition device based on three-dimensional packaging comprises a shell, wherein a three-dimensional packaging structure is arranged inside the shell, a signal circuit board, a power circuit board and an analog circuit board are sequentially stacked from bottom to top, resin is filled between the signal circuit board, the power circuit board and the analog circuit board, laser etching lines are arranged on side end faces of the three-dimensional packaging structure, the signal circuit board, the power circuit board and the analog circuit board are electrically connected through the laser etching lines, and a connecting port is further arranged at one end of the three-dimensional packaging structure. Based on the above, the signal circuit board, the power circuit board and the analog circuit board are stacked from bottom to top in sequence, and the electronic elements at each height are avoided from each other, so that the effect of maximizing the utilization of the three-dimensional space is achieved, the space utilization rate is improved, and one huge circuit system is integrated, modularized and miniaturized. In addition, the signal circuit board, the power supply circuit board and the analog circuit board are solidified into a whole through the resin, so that the anti-seismic performance and the oxidation resistance are improved, the integrity and the stability of the system-level circuit function are ensured, the utility model can better cope with severe environments, meanwhile, the problem of cold joint process of the traditional BGA or PGA welding module is eliminated, and the product quality is improved. The power circuit board converts an external input power supply into an internal required power supply and provides power for the signal circuit board and the analog circuit board. The analog circuit board converts an externally input analog signal into a digital signal and transmits the digital signal to the signal circuit board, and the signal circuit board performs operation and processing on the received digital signal and outputs the processed data to the outside. Further, windows are symmetrically arranged at the front end and the rear end of the shell, the connecting ports are opposite to the windows, a disassembly opening is formed in the lower end face of the shell, and a lower cover is matched with the disassembly opening. Based on the above, the three-dimensional packaging structure is mounted in the housing through the mounting and dismounting opening, and is packaged by the lower cover. Further, an analog-to-digital converter is arranged on the analog circuit board, and the analog circuit board converts the acquired analog signals into digital signals through the analog-to-digital converter and transmits the converted digital signals to the signal circuit board. Further, a micro-control unit module is arranged on the signal circuit board and is used for calculating and processing the received digital signals. Further, the front end and the rear end of the lower part of the shell are symmetrically provided with mounting blocks with mounting holes. Based on the above, the housing may be mounted into an external device through the mounting block. In order to more clearly illustrate the above-mentioned features of the present utility model and its intended objects, the present utility model will be further described with reference to the accompanying drawings and examples. Drawings FIG. 1 is a schematic perspective view of the present utility model; FIG. 2 is a schematic diagram of a three-dimensional package structure according to the present utility model; FIG. 3 is a perspective view of a three-dimensional package structure of the present utility model with the resin poured thereon; FIG. 4 is a bottom view of the utilit