CN-224234005-U - High-density interconnection circuit board structure based on stepped micro blind holes

CN224234005UCN 224234005 UCN224234005 UCN 224234005UCN-224234005-U

Abstract

The high-density interconnection circuit board structure comprises a multi-layer board body and auxiliary mounting pieces, wherein the multi-layer board body and the auxiliary mounting pieces are sequentially stacked up and down, the auxiliary mounting pieces are arranged at the bottom and on two sides of the multi-layer board body, a plurality of positioning through holes penetrating up and down are formed in the multi-layer board body, the positioning through holes between the upper and lower layer board bodies are correspondingly arranged up and down, the auxiliary mounting pieces comprise mounting seats and two connecting rods connected with the mounting seats, the mounting seats are symmetrically arranged left and right, the cross section of each mounting seat is L-shaped, a plurality of mounting rods are further arranged on each mounting seat, the left and right ends of the multi-layer board body are sequentially stacked on the mounting seats, the positioning through holes correspondingly penetrate through the mounting rods, the two connecting rods are arranged in an X-shaped shaft connection mode, and two ends of each connecting rod are respectively connected with the mounting seats on the left and right sides. The utility model can prevent the problem of interlayer deviation and reduce the risk of deformation of the board body by designing the circuit board with the auxiliary mounting piece, has strong practicability and has stronger popularization significance.

Inventors

WEN WEIFENG
LI JIN
PAN BING
SHEN ZAIPENG

Assignees

江西红森科技有限公司

Dates

Publication Date: 20260512
Application Date: 20250522

Claims (7)

1. The high-density interconnection circuit board structure based on the stepped micro blind holes is characterized by comprising a plurality of layers of board bodies and auxiliary mounting pieces, wherein the layers of board bodies are sequentially stacked up and down, the auxiliary mounting pieces are arranged at the bottoms and on two sides of the layers of board bodies, a plurality of positioning through holes penetrating up and down are formed in the layers of board bodies, the positioning through holes between the upper layer board body and the lower layer board body are correspondingly arranged up and down, the auxiliary mounting pieces comprise mounting seats and two connecting rods, the mounting seats are symmetrically arranged left and right, the cross sections of the mounting seats are L-shaped, a plurality of mounting rods are further arranged on the mounting seats, the left and right ends of the layers of board bodies are sequentially stacked on the mounting seats, the positioning through holes correspondingly penetrate through the mounting rods, the two connecting rods are arranged in an X-shaped shaft connection mode, and two ends of the two connecting rods are respectively connected with the mounting seats on the left side and the right side of the mounting seats.
2. The high-density interconnection circuit board structure based on stepped blind holes of claim 1, wherein the auxiliary mounting piece further comprises a limiting buckle, an adjusting chute is arranged on the inner side of the mounting seat, the end portion of the connecting rod is clamped in the adjusting chute and can be adjusted in a sliding mode, and the limiting buckle is clamped at the shaft joint of the two groups of connecting rods and can limit the connecting rods.
3. The high-density interconnected circuit board structure based on stepped blind holes of claim 1, further comprising two groups of heat dissipation plates, wherein the ends of the two groups of heat dissipation plates are respectively clamped on the mounting seat, and the two groups of heat dissipation plates are respectively attached to the front side and the rear side of the multilayer board body.
4. The high-density interconnected circuit board structure based on stepped blind holes of claim 3, wherein a plurality of radiating fins extending outwards are further arranged on the outer side of the radiating plate, and the radiating fins are designed to be inclined downwards.
5. The high-density interconnection circuit board structure based on stepped blind holes of claim 1, further comprising a cover plate, wherein a penetrating lock hole and an elastic limiting piece are further arranged on the cover plate, a limiting lock groove is correspondingly formed in the upper portion of the mounting rod, the cover plate is covered on the uppermost plate body and penetrates through the mounting rod through the lock hole, and the elastic limiting piece and the limiting lock groove of the mounting rod are mutually clamped and limited.
6. The high-density interconnection circuit board structure based on stepped blind holes of claim 1, further comprising a plurality of buffer support legs, wherein buffer through holes are correspondingly formed in the outer sides of the mounting seats, the buffer support legs comprise mounting plates, buffer rods and buffer springs, the buffer rods are integrally arranged on the mounting plates and movably penetrate through the buffer through holes, the buffer springs are sleeved on the buffer rods, and two ends of the buffer springs are respectively propped against the bottoms of the buffer through holes and the tops of the mounting plates.
7. The high-density interconnected circuit board structure based on stepped blind holes of claim 1, wherein fool-proof protruding positions are further arranged on the inner side of the mounting seat, fool-proof notches are formed on the left side and the right side of the multilayer board body, and the fool-proof notches and the fool-proof protruding positions are mutually clamped and limited.

Description

High-density interconnection circuit board structure based on stepped micro blind holes Technical Field The utility model relates to the technical field of circuit boards, in particular to a high-density interconnection circuit board structure based on stepped blind micro holes. Background The circuit board, which is also commonly called a printed circuit board or a printed circuit board, is called a PCB for short, is an important electronic component, is a support for electronic components, and is a carrier for electrical connection of the electronic components. The high-density interconnection circuit board interconnects a plurality of circuit boards, so as to meet different equipment requirements, and the conventional high-density interconnection circuit board often stacks a plurality of circuit boards. The circuit board with the multilayer structure is more precise in internal circuit, on one hand, the problem of interlayer deviation easily occurs in the conventional multilayer circuit board lamination forming process in the production and processing process, and on the other hand, the multilayer circuit board is easily bent, contracted or expanded and deformed once being influenced by the environment (such as temperature, humidity and the like) or external force and the like. When the layers of the multi-layer circuit board are deviated or the board body is deformed, the circuit function is often damaged or even completely fails. Disclosure of utility model Based on this, it is necessary to provide a high-density interconnection circuit board structure based on stepped blind vias, which aims at the defects in the prior art. A high-density interconnection circuit board structure based on stepped micro blind holes, it comprises a multi-layer plate body which is sequentially laminated up and down and is arranged on auxiliary installation parts at the bottom and two sides of the multilayer plate body. The multilayer all be equipped with a plurality of location through-holes that run through from top to bottom on the plate body, and the location through-hole between the upper and lower plate body corresponds the setting from top to bottom. The auxiliary mounting piece comprises a mounting seat and two connecting rods, wherein the mounting seat is arranged in a bilateral symmetry mode, the two connecting rods are connected with the mounting seat, the cross section of the mounting seat is of an L-shaped design, a plurality of mounting rods are further arranged on the mounting seat, the left end and the right end of the plate body are sequentially stacked on the mounting seat, the positioning through holes correspondingly penetrate through the mounting rods, the two connecting rods are arranged in an X-shaped shaft connection mode, and the two ends of the two connecting rods are connected with the mounting seats on the left side and the right side respectively. Further, the auxiliary mounting piece further comprises a limiting buckle, and an adjusting chute is arranged on the inner side of the mounting seat. The end part of the connecting rod is clamped in the adjusting chute and can be adjusted in a sliding way, and the limiting buckle is clamped at the shaft joint of the two groups of connecting rods and can limit the connecting rods. Further, the high-density interconnection circuit board structure based on the stepped blind holes further comprises two groups of radiating boards, the ends of the two groups of radiating boards are respectively clamped on the mounting seat, and the two groups of radiating boards are respectively attached to the front side and the rear side of the multilayer board body. Further, a plurality of radiating fins extending outwards are further arranged on the outer side of the radiating plate, and the radiating fins are designed to be inclined downwards. Further, the high-density interconnection circuit board structure based on the stepped micro blind holes further comprises a cover plate, a through lock hole and an elastic limiting piece are further arranged on the cover plate, and a limiting locking groove is correspondingly formed in the upper portion of the mounting rod. The cover plate is covered on the uppermost plate body and penetrates through the lock hole to penetrate through the mounting rod, and the elastic limiting piece and the limiting locking groove of the mounting rod are mutually clamped and limited. Further, the high-density interconnection circuit board structure based on the stepped micro blind holes further comprises a plurality of buffer support legs, and buffer through holes are correspondingly formed in the outer side of the mounting seat. The buffer support leg comprises a mounting plate, a buffer rod and a buffer spring, wherein the buffer rod is integrally arranged on the mounting plate, the buffer rod is movably arranged in the buffer through hole in a penetrating mode, the buffer spring is sleeved on the buffer rod, and two ends of the buffer spring ar