CN-224234033-U - Electronic device and vehicle

CN224234033UCN 224234033 UCN224234033 UCN 224234033UCN-224234033-U

Abstract

The application relates to electronic equipment and a vehicle, wherein a heat exchange device is used for forming heat exchange with a piece to be exchanged, and the electronic equipment comprises a circuit board, a base and a first heat exchanger, wherein the base is provided with an inner cavity for accommodating the circuit board, the first heat exchanger is used for exchanging heat with the circuit board, a first part of the first heat exchanger is positioned outside the inner cavity, an opening communicated with the inner cavity is formed in the base, the opening is suitable for accommodating the first heat exchanger so that a second part of the first heat exchanger is positioned in the inner cavity, at least part of the circuit board is positioned between a cavity wall and the second part of the inner cavity, and the second part of the first heat exchanger is fixedly connected with the base. Through the technical scheme, the second part of the heat exchanger can be used for limiting the circuit board, and the circuit board is relatively close to or in direct contact with the first heat exchanger, so that a heat transfer path between the first heat exchanger and the circuit board can be shortened, the first heat exchanger can exchange heat with the circuit board more fully, and the heat exchange effect of the electronic equipment is improved.

Inventors

XIANG QIANG
ZHOU HONGTAO
WANG YAONONG
ZHANG CHAO
Tao Qinhui

Assignees

浙江零跑科技股份有限公司

Dates

Publication Date: 20260512
Application Date: 20250514

Claims (10)

1. An electronic device, comprising: A circuit board; A base formed with an inner cavity for accommodating the circuit board; The first heat exchanger is used for exchanging heat with the circuit board, and a first part of the first heat exchanger is positioned outside the inner cavity; The base is provided with: an opening in communication with the interior cavity and adapted to receive the first heat exchanger such that a second portion of the first heat exchanger is located in the interior cavity; At least part of the circuit board is positioned between the cavity wall of the inner cavity and the second part, and the second part of the first heat exchanger is fixedly connected with the base.
2. The electronic device of claim 1, wherein the electronic device comprises a memory device, The second part is provided with a first connecting hole; the base is provided with a second connecting hole; Wherein, the first connecting hole is opposite to the second connecting hole along the extending direction.
3. The electronic device of claim 2, wherein the electronic device comprises a memory device, The circuit board is provided with a third connecting hole; Wherein the third connecting hole is opposite to the first connecting hole and the second connecting hole along the extending direction.
4. An electronic device as claimed in any one of claims 1 to 3, characterized in that, The first heat exchanger includes: A heat conducting layer disposed on the second portion for conducting heat between the first portion and the circuit board; Wherein at least a portion of the circuit board is located between the cavity wall of the inner cavity and the thermally conductive layer.
5. The electronic device of claim 4, wherein the electronic device comprises a memory device, The heat conducting layer is configured to cover at least a partial area of the surface of the circuit board.
6. The electronic device of claim 4, wherein the electronic device comprises a memory device, The first heat exchanger further includes: a heat pipe connected to the second portion and at least partially located outside the inner cavity; A plurality of first heat exchange fins which are arranged on the first part at intervals and are in contact with the heat pipe; The heat pipe comprises a heat pipe body, a heat conducting layer, a heat conducting plane, a heat conducting layer and a heat conducting layer, wherein at least part of the heat pipe extends along a first straight line direction, the surface of the heat conducting layer, which is close to one side of the circuit board, is configured to be the heat conducting plane, and the first straight line direction is parallel to or perpendicular to the heat conducting plane.
7. The electronic device of claim 6, wherein the electronic device comprises a memory device, The electronic device further includes: a fan adapted to supply air to the first heat exchanger when in operation; The fan is arranged on the base and located outside the inner cavity, and the fan is exposed in the interval between at least two first heat exchange fins.
8. The electronic device of claim 6, wherein the electronic device comprises a memory device, The electronic device further includes: a second heat exchanger having a plurality of spaced apart second heat exchange fins located outside the inner cavity; wherein the second heat exchanger is detachably arranged on the base.
9. The electronic device of claim 8, wherein the electronic device comprises a memory device, The thickness of the first heat exchange fin is 1-2mm, the thickness of the second heat exchange fin is 0.2-0.5 mm, and/or, The distance between the adjacent first heat exchange fins is 4-6mm, and the distance between the adjacent second heat exchange fins is 1-1.5mm.
10. A vehicle comprising an electronic device as claimed in any one of claims 1 to 9.

Description

Electronic device and vehicle Technical Field The application relates to the technical field of first heat exchangers, in particular to electronic equipment and a vehicle. Background The air-cooled radiator has the advantages of simpler structure, easier maintenance and the like compared with a liquid cooling scheme, is applied to a vehicle, and can be suitable for radiating electronic equipment integrated on the vehicle, such as a domain controller, display equipment used on a cabin and the like. Air-cooled heat sinks often include fans and fins. In the related art, a circuit board of an electronic device is often arranged in a shell for isolation protection, and a radiator is thermally conducted with the shell and then cooled by a fan. With the increasing number of components on a circuit board in an electronic device, the heat exchange mode cannot meet the high heat dissipation requirement on the electronic device. Disclosure of utility model The embodiment of the application provides electronic equipment and a vehicle, which improve the heat exchange effect of the electronic equipment so as to at least partially solve the technical problems. In order to achieve the above object, according to a first aspect of the present application, there is provided an electronic apparatus comprising: A circuit board; A base formed with an inner cavity for accommodating the circuit board; The first heat exchanger is used for exchanging heat with the circuit board, and a first part of the first heat exchanger is positioned outside the inner cavity; The base is provided with: an opening in communication with the interior cavity and adapted to receive the first heat exchanger such that a second portion of the first heat exchanger is located in the interior cavity; At least part of the circuit board is positioned between the cavity wall of the inner cavity and the second part, and the second part of the first heat exchanger is fixedly connected with the base. In some embodiments, the second portion is provided with a first connection hole; the base is provided with a second connecting hole; Wherein, the first connecting hole is opposite to the second connecting hole along the extending direction. In some embodiments, the circuit board is provided with a third connecting hole; Wherein the third connecting hole is opposite to the first connecting hole and the second connecting hole along the extending direction. In some embodiments, the first heat exchanger comprises: A heat conducting layer disposed on the second portion for conducting heat between the first portion and the circuit board; Wherein at least a portion of the circuit board is located between the cavity wall of the inner cavity and the thermally conductive layer. In some embodiments, the thermally conductive layer is configured as a thermally conductive copper layer covering at least a partial area of the circuit board surface. In some embodiments, the first heat exchanger further comprises: a heat pipe connected to the second portion and at least partially located outside the inner cavity; A plurality of first heat exchange fins which are arranged on the first part at intervals and are in contact with the heat pipe; The heat pipe comprises a heat pipe body, a heat conducting layer, a heat conducting plane, a heat conducting layer and a heat conducting layer, wherein at least part of the heat pipe extends along a first straight line direction, the surface of the heat conducting layer, which is close to one side of the circuit board, is configured to be the heat conducting plane, and the first straight line direction is parallel to or perpendicular to the heat conducting plane. In some embodiments, the electronic device further comprises: a fan adapted to supply air to the first heat exchanger when in operation; The fan is arranged on the base and located outside the inner cavity, and the fan is exposed in the interval between at least two first heat exchange fins. In some embodiments, the electronic device further comprises: a second heat exchanger having a plurality of spaced apart second heat exchange fins located outside the inner cavity; wherein the second heat exchanger is detachably arranged on the base; In some embodiments, the first heat exchange fin has a thickness ranging from 1 to 2mm, the second heat exchange fin has a thickness ranging from 0.2mm to 0.5mm, and/or, The distance between the adjacent first heat exchange fins is 4-6mm, and the distance between the adjacent second heat exchange fins is 1-1.5mm. According to a second aspect of the application there is also provided a vehicle comprising an electronic device as described above. According to the heat exchange device provided by the embodiment of the application, through the technical scheme, the second part of the heat exchanger can be used for limiting the circuit board, and the circuit board is relatively close to or in direct contact with the first heat exchanger, so that the heat transf