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CN-224234037-U - Power device mounting structure

CN224234037UCN 224234037 UCN224234037 UCN 224234037UCN-224234037-U

Abstract

The application discloses a power device mounting structure, which belongs to the technical field of electronic component mounting and comprises a heat conduction shell, a first insulating layer, a plurality of second insulating layers, a heat conduction layer and a power device, wherein the first insulating layer is attached to one side surface of the heat conduction shell, the plurality of second insulating layers are distributed on one side surface of the first insulating layer, which is away from the heat conduction shell, at intervals, the plurality of second insulating layers are enclosed to form a mounting space, part of the first insulating layer is exposed in the mounting space, the heat conduction layer is attached to the part of the first insulating layer exposed in the mounting space, the power device is positioned on one side surface of the heat conduction layer, which is away from the first insulating layer, and the structure achieves the effect of improving the pressure resistance value between a wiring part of the power device and the heat conduction layer. The first insulating layer and the plurality of second insulating layers form a multi-layer insulating structure, so that current can be effectively blocked, the voltage withstand capability is enhanced, and the problem that the voltage withstand of the low-voltage class power device in a high-voltage system is insufficient is solved.

Inventors

  • LI HUI
  • SUN LIWEN
  • WANG LIRONG
  • LI JIANLIN
  • WANG LIUJIE
  • WANG KAI

Assignees

  • 山西华鑫图科电机驱动有限公司

Dates

Publication Date
20260512
Application Date
20250516

Claims (8)

  1. 1. A power device mounting structure, comprising: a heat conductive housing (1); a first insulating layer (2) attached to one side surface of the heat conductive housing (1); The second insulating layers (3) are distributed on the surface of one side, away from the heat conduction shell (1), of the first insulating layers (2) at intervals, the second insulating layers (3) are enclosed to form an installation space, and part of the first insulating layers (2) are exposed in the installation space; A heat conduction layer (7) attached to the first insulating layer (2) at a part exposed in the installation space; And the power device (8) is positioned on the surface of one side of the heat conduction layer (7) away from the first insulating layer (2).
  2. 2. The power device mounting structure according to claim 1, further comprising a third insulating layer (9) located within the mounting space and between the heat conducting layer (7) and the first insulating layer (2).
  3. 3. The power device mounting structure of claim 2, further comprising: The insulation limiting piece (4) stretches into the installation space and is abutted to the first insulation layer (2) in the installation space, the insulation limiting piece (4) is provided with a first groove and a second groove which are oppositely arranged, the first groove is communicated with the second groove, the third insulation layer (9) is abutted to the inner wall of the first groove, and the heat conducting layer (7) is abutted to the inner wall of the second groove.
  4. 4. The power device mounting structure of claim 3, further comprising: Insulating butt piece (6), with heat conduction layer (7) deviate from the laminating of one side surface of third insulating layer (9), and with insulating locating part (4) deviate from the laminating of one side surface of first insulating layer (2), insulating butt piece (6) are through first bolt (5) and heat conduction casing (1) fixed connection.
  5. 5. The power device mounting structure according to any one of claims 1 to 4, characterized in that the first insulating layer (2) is fixedly connected with the heat conductive housing (1) by means of a second bolt.
  6. 6. The power device mounting structure according to claim 5, further comprising a plurality of heat dissipation fins, which are spaced apart on an inner wall of the heat conductive housing (1).
  7. 7. The power device mounting structure of claim 6, further comprising: a liquid supply source; A coolant pipe (101) having a first pipe section which is coiled in the heat conducting shell (1), wherein one end of the coolant pipe (101) is communicated with the liquid supply; A recovery source, the other end of the cooling liquid pipeline (101) is communicated with the recovery source; the pump body is arranged on the cooling liquid pipeline (101); and a valve body (13) arranged on the cooling liquid pipeline (101).
  8. 8. The power device mounting structure of claim 7, further comprising: The temperature detection piece (10) is provided with a detection end positioned in the heat conduction shell (1) and is used for acquiring the temperature in the heat conduction shell (1); And a control unit (11) electrically connected to the temperature detecting member (10) and the valve body (13).

Description

Power device mounting structure Technical Field The application relates to the technical field of electronic component installation, in particular to a power device installation structure. Background The power device is an electronic element for controlling and converting electric energy, can process high voltage and high current, is widely applied to electric energy conversion and control circuits of electric power equipment, and is mainly used for frequency conversion, voltage transformation, current transformation and the like. In order to ensure the normal operation of the power device, the power device is often arranged on an aluminum heat dissipation plate, and the aluminum heat dissipation plate can effectively reduce the temperature of the power device and prolong the service life of the power device due to good heat dissipation performance of the aluminum heat dissipation plate, so that the stability and the reliability of the whole electronic system are improved. Along with the development of electronic components, the voltage on the power device is higher and higher, however, along with the rise of the voltage, the voltage withstand value between the wiring part of the power device and the aluminum radiator mounting plate does not meet the requirement of high voltage withstand, and at present, the power device with higher voltage class is generally adopted to solve the problem, but the high voltage power device has high cost, so that the competitiveness of the product is reduced. Disclosure of utility model In view of this, the present application provides a power device mounting structure to solve the problem that the voltage withstand value between the wiring portion of the power device and the aluminum radiator mounting board does not meet the requirement of high voltage withstand as the voltage increases, and at present, the power device with higher voltage class is generally replaced to solve the problem, but the high voltage power device has high cost, so that the competitiveness of the product decreases. The application provides a power device mounting structure, which comprises: a thermally conductive housing; the first insulating layer is attached to one side surface of the heat conducting shell; the second insulating layers are distributed on the surface of one side, away from the heat conduction shell, of the first insulating layer at intervals, the second insulating layers are enclosed to form an installation space, and part of the first insulating layer is exposed out of the installation space; The heat conducting layer is attached to the part of the first insulating layer exposed in the installation space; And the power device is positioned on the surface of one side of the heat conduction layer, which is away from the first insulating layer. The multi-layer insulation design of the first insulation layer and the plurality of second insulation layers has the advantages that the voltage withstand value between the wiring part of the power device and the heat conducting layer is remarkably improved, the problem that the voltage withstand of the power device with low voltage level is insufficient in a high-voltage system is effectively solved, meanwhile, heat generated by the power device during operation can be conducted to the heat conducting shell through the heat conducting layer, the heat dissipation problem of the high-power device is solved, the power module with low voltage level can be safely used in the high-voltage system, and the market competitiveness of products is enhanced. In an alternative embodiment, a third insulating layer is further included in the installation space and between the heat conducting layer and the first insulating layer. The power device has the beneficial effects that the third insulating layer is arranged in the installation space and between the heat conducting layer and the first insulating layer, and the first insulating layer and the plurality of second insulating layers are matched, so that the multi-layer insulating design is further enhanced, the voltage withstand value between the wiring part of the power device and the heat conducting layer can be remarkably improved, the problem that the voltage withstand of the power device with low voltage level is insufficient in a high-voltage system is effectively solved, the power module with low voltage level can be safely used in the high-voltage system, and the competitiveness of a final product in the market is further enhanced. In an alternative embodiment, the method further comprises: The insulation limiting piece stretches into the installation space and is abutted to the first insulation layer in the installation space, the insulation limiting piece is provided with a first groove and a second groove which are oppositely arranged, the first groove is communicated with the second groove, the third insulation layer is abutted to the inner wall of the first groove, and the heat conducting laye