CN-224234073-U - Intelligent power module

CN224234073UCN 224234073 UCN224234073 UCN 224234073UCN-224234073-U

Abstract

The intelligent power module is internally provided with a first substrate, a second substrate, an optical coupler isolation driving circuit module and a power circuit module, wherein the optical coupler isolation driving circuit module is arranged on the first substrate, the power circuit module is arranged on the second substrate, the first substrate is electrically connected with the power circuit module, and the optical coupler isolation driving circuit module is used for receiving external control signals and sending internal control signals corresponding to the external control signals to the power circuit module. Through with keep apart drive circuit integration in intelligent power module for can satisfy the isolation demand of electrical safety, promote the system integration level, reduce whole parasitic inductance, simultaneously, set up isolation drive circuit on first base plate, make can reduce the setting of intelligent power module internal lead wire, reduced common mode interference, improved intelligent power module's reliability, on this basis, can realize the setting of higher voltage, frequency.

Inventors

LIU ZILING
LI PENGZHAO
HONG GUANGJIE

Assignees

珠海格力电子元器件有限公司

Dates

Publication Date: 20260512
Application Date: 20250529

Claims (10)

1. The intelligent power module is characterized in that a first substrate, a second substrate, an optical coupling isolation driving circuit module and a power circuit module are arranged in the intelligent power module, wherein the optical coupling isolation driving circuit module is arranged on the first substrate, the power circuit module is arranged on the second substrate, and the first substrate is electrically connected with the power circuit module; The optical coupling isolation driving circuit module is used for receiving an external control signal, performing optical coupling isolation on a driving side receiving the external control signal and a power side where the power circuit module is located, and then sending an internal control signal corresponding to the external control signal to the power circuit module.
2. The intelligent power module according to claim 1, wherein the first substrate is a printed circuit board and the second substrate is a ceramic copper-clad plate.
3. The intelligent power module according to claim 1, wherein the optocoupler isolation driving circuit module comprises an isolation unit and a signal output unit, the power circuit module comprises a plurality of power devices, the signal output unit is connected with the power devices in a one-to-one correspondence manner, wherein: And a group of output ends of the isolation units are correspondingly connected with one signal output unit.
4. The intelligent power module according to claim 3, wherein the isolation unit comprises a processing chip and an optocoupler subunit, wherein the optocoupler subunit comprises a plurality of optocoupler components, and an output end of the optocoupler components is used as an output end of the isolation unit; The output ends of the processing chips are respectively connected with the control ends of the optocoupler components in a one-to-one correspondence manner, wherein: The processing chip is used for receiving an external control signal and controlling the conduction state of the corresponding optical coupler subunit according to the external control signal so as to enable the optical coupler subunit to output the corresponding internal control signal.
5. The intelligent power module of claim 4, wherein the optocoupler assembly comprises a plastic package, a reflective layer, a transparent material, a light emitting diode, and a light sensitive driving chip, wherein: the plastic package body and the first substrate form an accommodating space, the light emitting diode and the photosensitive driving chip are arranged on the first substrate in the accommodating space, the transparent material is filled in the accommodating space to form a transmission layer, the reflection layer is arranged between the plastic package body and the transmission layer, the positive electrode of the light emitting diode is connected with the output end of the processing chip, the negative electrode of the light emitting diode is grounded, and the output end of the photosensitive driving chip is used as the output end of the optocoupler assembly.
6. The intelligent power module according to claim 5, wherein the two electrodes of the light emitting diode are arranged on the same surface, the positive electrode of the light emitting diode is connected with the output end of the processing chip through the internal circuit of the first substrate, and the negative electrode of the light emitting diode is grounded through the internal circuit of the first substrate.
7. The intelligent power module according to claim 5, wherein two poles of the light emitting diode are disposed on opposite sides, a first pole of the light emitting diode is externally connected through an internal circuit of the first substrate, and a second pole of the light emitting diode is connected to a corresponding bonding pad on the first substrate through a bonding wire, and the bonding pad is externally connected through the internal circuit of the first substrate.
8. The intelligent power module according to claim 3, wherein the isolation unit comprises an upper pipe output terminal comprising an upper pipe high voltage terminal and an upper pipe ground terminal, the signal output unit comprises a negative voltage driving subunit comprising a first capacitor, a second capacitor, a first zener diode, and a third resistor, wherein: The positive pole of zener diode with the ground of isolation unit is connected, zener diode's negative pole with power device's source connection, zener diode's negative pole still with the first end of third resistance is connected, the second end of third resistance with the high-voltage end of isolation unit is connected, first electric capacity with the third resistance is parallelly connected, the second electric capacity with zener diode is parallelly connected.
9. The intelligent power module according to claim 3, wherein the isolation unit comprises an upper pipe output end comprising an upper pipe high voltage end and an upper pipe ground end, the optocoupler isolation driving circuit module further comprises a bootstrap unit comprising a fourth resistor, a second diode and a third capacitor, wherein: The first end of the fourth resistor is connected with the driving power supply, the second end of the fourth resistor is connected with the positive electrode of the second diode, the negative electrode of the second diode is connected with the upper pipe high-voltage end of the isolation unit, the first end of the third capacitor is connected with the upper pipe high-voltage end of the isolation unit, and the second end of the third capacitor is connected with the upper pipe ground end of the isolation unit.
10. The smart power module of claim 1, wherein the smart power module further comprises a lead frame, wherein: the lead frame is electrically connected with the first substrate, the second substrate and the power circuit module respectively and is used for leading out electrodes on the first substrate, the second substrate and the power circuit module to corresponding pins.

Description

Intelligent power module Technical Field The utility model relates to the field of electronic devices, in particular to an intelligent power module. Background IPM (INTELLIGENT POWER MOUDLE, intelligent power module) is a multi-chip architecture module that packages the power device chip and the protection driver chip or circuit into the same insulator. With the development of power semiconductor technology, the power that IPM can carry is gradually increasing. The voltage and switching frequency that conventional silicon-based chips can withstand have failed to meet the ever-increasing demands. With the technical development of the third generation semiconductor material silicon carbide capable of bearing higher voltage and higher frequency, the silicon carbide discrete device and the integrated power module are already used in the fields of household appliances, new energy automobiles and the like. However, for IPMs that integrate drive and protection functions into the same module, common mode interference and lack of electrical isolation are reliability issues that limit the implementation of IPMs for higher voltage, higher frequency specifications. Disclosure of utility model The utility model mainly aims to provide an intelligent power module, which aims to solve the problem that the IPM in the prior art has reliability so that specifications of higher voltage and higher frequency cannot be applied. In order to achieve the above purpose, the utility model provides an intelligent power module, wherein a first substrate, a second substrate, an optical coupling isolation driving circuit module and a power circuit module are arranged in the intelligent power module, the optical coupling isolation driving circuit module is arranged on the first substrate, the power circuit module is arranged on the second substrate, and the first substrate is electrically connected with the power circuit module, wherein the first substrate is electrically connected with the power circuit module; The optical coupling isolation driving circuit module is used for receiving an external control signal, carrying out optical coupling isolation on the external control signal, and then sending an internal control signal corresponding to the external control signal to the power circuit module. Optionally, the first substrate is a printed circuit board, and the second substrate is a ceramic copper-clad plate. Optionally, the optocoupler isolation driving circuit module comprises an isolation unit and a signal output unit, the power circuit module comprises a plurality of power devices, and the signal output unit is connected with the power devices in a one-to-one correspondence manner, wherein: And a group of output ends of the isolation units are correspondingly connected with one signal output unit. Optionally, the isolation unit comprises a processing chip and an optical coupler subunit, wherein the optical coupler subunit comprises a plurality of optical coupler components, and the output end of the optical coupler component is used as the output end of the isolation unit; The output ends of the processing chips are respectively connected with the control ends of the optocoupler components in a one-to-one correspondence manner, wherein: The processing chip is used for receiving an external control signal and controlling the conduction state of the corresponding optical coupler subunit according to the external control signal so as to enable the optical coupler subunit to output the corresponding internal control signal. Optionally, the optocoupler assembly comprises a plastic package body, a reflecting layer, a transparent material, a light emitting diode and a photosensitive driving chip, wherein: the plastic package body and the first substrate form an accommodating space, the light emitting diode and the photosensitive driving chip are arranged on the first substrate in the accommodating space, the transparent material is filled in the accommodating space to form a transmission layer, the reflection layer is arranged between the plastic package body and the transmission layer, the positive electrode of the light emitting diode is connected with the output end of the processing chip, the negative electrode of the light emitting diode is grounded, and the output end of the photosensitive driving chip is used as the output end of the optocoupler assembly. Optionally, the two poles of the light emitting diode are arranged on the same surface, the positive pole of the light emitting diode is connected with the output end of the processing chip through the internal circuit of the first substrate, and the negative pole of the light emitting diode is grounded through the internal circuit of the first substrate. Optionally, two poles of the light emitting diode are arranged on two opposite sides, a first pole of the light emitting diode is externally connected through an internal circuit of the first substrate, a second pole of the lig