CN-224234074-U - Intelligent power module

CN224234074UCN 224234074 UCN224234074 UCN 224234074UCN-224234074-U

Abstract

The intelligent power module is internally provided with a first substrate, a second substrate, an isolation driving circuit module and a power circuit module, wherein the isolation driving circuit module is arranged on the first substrate, the power circuit module is arranged on the second substrate, the first substrate is electrically connected with the power circuit module, and the isolation driving circuit module is used for receiving external control signals and sending internal control signals corresponding to the external control signals to the power circuit module. Through with keep apart drive circuit integration in intelligent power module for can satisfy the isolation demand of electrical safety, promote the system integration level, reduce whole parasitic inductance, simultaneously, set up isolation drive circuit on first base plate, make can reduce the setting of intelligent power module internal lead wire, reduced common mode interference, improved intelligent power module's reliability, on this basis, can realize the setting of higher voltage, frequency.

Inventors

LIU ZILING
HONG GUANGJIE
LI PENGZHAO

Assignees

珠海格力电子元器件有限公司

Dates

Publication Date: 20260512
Application Date: 20250529

Claims (10)

1. The intelligent power module is characterized in that a first substrate, a second substrate, an isolation driving circuit module and a power circuit module are arranged in the intelligent power module, wherein the isolation driving circuit module is arranged on the first substrate, the power circuit module is arranged on the second substrate, and the first substrate is electrically connected with the power circuit module; The isolation driving circuit module is used for receiving an external control signal and sending an internal control signal corresponding to the external control signal to the power circuit module.
2. The intelligent power module according to claim 1, wherein the first substrate is a printed circuit board and the second substrate is a ceramic copper-clad plate.
3. The intelligent power module according to claim 1, wherein the isolation driving circuit module comprises an isolation unit and a signal output unit, the power circuit module comprises a plurality of power devices, the signal output unit is connected with the power devices in a one-to-one correspondence manner, wherein: And a group of output ends of the isolation units are correspondingly connected with one signal output unit.
4. The intelligent power module according to claim 3, wherein said set of outputs of said isolation unit comprises a signal output, said signal output unit comprises a first resistor, wherein: The first resistor is connected between the signal output end of the isolation unit and the grid electrode of the power device.
5. The intelligent power module according to claim 4, wherein the signal output unit further comprises a second resistor and a first diode, wherein: The negative electrode of the first diode is connected with the signal output end of the isolation unit, the positive electrode of the first diode is connected with the first end of the second resistor, and the second end of the second resistor is connected with the grid electrode of the power device.
6. The intelligent power module according to claim 3, wherein the isolation unit comprises an upper pipe output terminal comprising an upper pipe high voltage terminal and an upper pipe ground terminal, the signal output unit comprises a negative voltage driving subunit comprising a first capacitor, a second capacitor, a first zener diode, and a third resistor, wherein: The positive pole of zener diode with the ground of isolation unit is connected, zener diode's negative pole with power device's source connection, zener diode's negative pole still with the first end of third resistance is connected, the second end of third resistance with the high-voltage end of isolation unit is connected, first electric capacity with the third resistance is parallelly connected, the second electric capacity with zener diode is parallelly connected.
7. The intelligent power module according to claim 3, wherein the isolation unit comprises an upper pipe output terminal comprising an upper pipe high voltage terminal and an upper pipe ground terminal, the isolation driving circuit module further comprises a bootstrap unit comprising a fourth resistor, a second diode and a third capacitor, wherein: The first end of the fourth resistor is connected with the driving power supply, the second end of the fourth resistor is connected with the positive electrode of the second diode, the negative electrode of the second diode is connected with the upper pipe high-voltage end of the isolation unit, the first end of the third capacitor is connected with the upper pipe high-voltage end of the isolation unit, and the second end of the third capacitor is connected with the upper pipe ground end of the isolation unit.
8. The smart power module of claim 1, wherein the smart power module further comprises a lead frame, wherein: the lead frame is electrically connected with the first substrate, the second substrate and the power circuit module respectively and is used for leading out electrodes on the first substrate, the second substrate and the power circuit module to corresponding pins.
9. The intelligent power module according to claim 8, wherein the pins comprise input pins and output pins, the input pins are disposed on a first side of the intelligent power module, the output pins are disposed on a second side of the intelligent power module, the first side and the second side are opposite sides of the intelligent power module, wherein: The first substrate is arranged close to the first side, and the second substrate is arranged close to the second side; The isolation driving circuit module comprises an isolation unit and a signal output unit, wherein the isolation unit is arranged on the first substrate and close to the first side, and the signal output unit is arranged on the first substrate and close to the second side.
10. The intelligent power module according to claim 8, wherein the pins comprise input pins comprising a power supply pin and a signal pin, wherein: The creepage distance between the adjacent power supply pins and the signal pins is larger than a preset safety distance.

Description

Intelligent power module Technical Field The utility model relates to the field of electronic devices, in particular to an intelligent power module. Background IPM (INTELLIGENT POWER MOUDLE, intelligent power module) is a multi-chip architecture module that packages the power device chip and the protection driver chip or circuit into the same insulator. With the development of power semiconductor technology, the power that IPM can carry is gradually increasing. The voltage and switching frequency that conventional silicon-based chips can withstand have failed to meet the ever-increasing demands. With the technical development of the third generation semiconductor material silicon carbide capable of bearing higher voltage and higher frequency, the silicon carbide discrete device and the integrated power module are already used in the fields of household appliances, new energy automobiles and the like. However, for IPMs that integrate drive and protection functions into the same module, common mode interference and lack of electrical isolation are reliability issues that limit the implementation of IPMs for higher voltage, higher frequency specifications. Disclosure of utility model The utility model mainly aims to provide an intelligent power module, which aims to solve the problem that the IPM in the prior art has reliability so that specifications of higher voltage and higher frequency cannot be applied. In order to achieve the above purpose, the utility model provides an intelligent power module, wherein a first substrate, a second substrate, an isolation driving circuit module and a power circuit module are arranged in the intelligent power module, the isolation driving circuit module is arranged on the first substrate, the power circuit module is arranged on the second substrate, and the first substrate is electrically connected with the power circuit module; The isolation driving circuit module is used for receiving an external control signal and sending an internal control signal corresponding to the external control signal to the power circuit module. Optionally, the first substrate is a printed circuit board, and the second substrate is a ceramic copper-clad plate. Optionally, the isolation driving circuit module comprises an isolation unit and a signal output unit, the power circuit module comprises a plurality of power devices, and the signal output unit is connected with the power devices in a one-to-one correspondence manner, wherein: And a group of output ends of the isolation units are correspondingly connected with one signal output unit. Optionally, the set of output terminals of the isolation unit includes a signal output terminal, the signal output unit includes a first resistor, wherein: The first resistor is connected between the signal output end of the isolation unit and the grid electrode of the power device. Optionally, the signal output unit further comprises a second resistor and a first diode, wherein: The negative electrode of the first diode is connected with the signal output end of the isolation unit, the positive electrode of the first diode is connected with the first end of the second resistor, and the second end of the second resistor is connected with the grid electrode of the power device. Optionally, the isolation unit comprises an upper pipe output end, the upper pipe output end comprises an upper pipe high-voltage end and an upper pipe ground end, the signal output unit comprises a negative pressure driving subunit, the negative pressure driving subunit comprises a first capacitor, a second capacitor, a first zener diode and a third resistor, wherein: The positive pole of zener diode with the ground of isolation unit is connected, zener diode's negative pole with power device's source connection, zener diode's negative pole still with the first end of third resistance is connected, the second end of third resistance with the high-voltage end of isolation unit is connected, first electric capacity with the third resistance is parallelly connected, the second electric capacity with zener diode is parallelly connected. Optionally, the isolation unit comprises an upper pipe output end, the upper pipe output end comprises an upper pipe high voltage end and an upper pipe ground end, the isolation driving circuit module further comprises a bootstrap unit, the bootstrap unit comprises a fourth resistor, a second diode and a third capacitor, wherein: The first end of the fourth resistor is connected with the driving power supply, the second end of the fourth resistor is connected with the positive electrode of the second diode, the negative electrode of the second diode is connected with the upper pipe high-voltage end of the isolation unit, the first end of the third capacitor is connected with the upper pipe high-voltage end of the isolation unit, and the second end of the third capacitor is connected with the upper pipe ground end of the isolation unit. Optionally, the inte