CN-224234075-U - Intelligent power module

CN224234075UCN 224234075 UCN224234075 UCN 224234075UCN-224234075-U

Abstract

The intelligent power module is internally provided with a first substrate, a second substrate, a capacitive isolation driving circuit module and a power circuit module, wherein the capacitive isolation driving circuit module is arranged on the first substrate, the power circuit module is arranged on the second substrate, the first substrate is electrically connected with the power circuit module, and the capacitive isolation driving circuit module is used for receiving external control signals and sending internal control signals corresponding to the external control signals to the power circuit module. Through with keep apart drive circuit integration in intelligent power module for can satisfy the isolation demand of electrical safety, promote the system integration level, reduce whole parasitic inductance, simultaneously, set up isolation drive circuit on first base plate, make can reduce the setting of intelligent power module internal lead wire, reduced common mode interference, improved intelligent power module's reliability, on this basis, can realize the setting of higher voltage, frequency.

Inventors

LIU ZILING
HONG GUANGJIE
LI PENGZHAO

Assignees

珠海格力电子元器件有限公司

Dates

Publication Date: 20260512
Application Date: 20250529

Claims (10)

1. The intelligent power module is characterized in that a first substrate, a second substrate, a capacitive isolation driving circuit module and a power circuit module are arranged in the intelligent power module, wherein the capacitive isolation driving circuit module is arranged on the first substrate, the power circuit module is arranged on the second substrate, and the first substrate is electrically connected with the power circuit module; The capacitive isolation driving circuit module is used for receiving an external control signal, performing capacitive isolation on a driving side receiving the external control signal and a power side where the power circuit module is located, and then sending an internal control signal corresponding to the external control signal to the power circuit module.
2. The intelligent power module according to claim 1, wherein the first substrate is a printed circuit board and the second substrate is a ceramic copper-clad plate.
3. The intelligent power module according to claim 1, wherein the capacitive isolation driving circuit module comprises an isolation unit and a signal output unit, the power circuit module comprises a plurality of power devices, the signal output unit is connected with the power devices in a one-to-one correspondence manner, wherein: And a group of output ends of the isolation units are correspondingly connected with one signal output unit.
4. The intelligent power module according to claim 3, wherein said isolation unit comprises a processing chip and a capacitive sub-unit, said capacitive sub-unit comprising a plurality of capacitive components, an output of said capacitive components being an output of said isolation unit; The output ends of the processing chips are respectively connected with the input ends of the capacitance components in a one-to-one correspondence manner, wherein: The processing chip is used for receiving an external control signal, converting the external control signal into alternating current and outputting the alternating current to the capacitor assembly so that the capacitor assembly outputs a corresponding internal control signal.
5. The intelligent power module according to claim 4, wherein the capacitor assembly comprises an isolation capacitor and a drive output chip, wherein: The first end of the isolation capacitor is connected with a group of output ends of the processing chip, the second end of the isolation capacitor is connected with the input end of the driving output chip, and the output end of the driving output chip is used as the output end of the capacitor assembly, wherein: The driving output chip is used for converting the signal received by the isolation capacitor into direct current to obtain the internal control signal and transmitting the internal control signal to the corresponding power device.
6. The intelligent power module according to claim 5, wherein the isolation capacitor comprises a first metal electrode, a second metal electrode, a third metal electrode and a fourth metal electrode, wherein an insulating material is filled between the first metal electrode and the second metal electrode, and an insulating material is filled between the third metal electrode and the fourth metal electrode, wherein: The first metal electrode is connected with the output end of the processing chip, the second metal electrode is electrically connected with the third metal electrode, and the fourth metal electrode is connected with the input end of the driving output chip.
7. The intelligent power module according to claim 5, wherein a modulator is disposed in the processing chip and a demodulator is disposed in the drive output chip, wherein: The processing chip is used for converting the external control signal into alternating current, modulating the alternating current into preset frequency through the modulator and outputting the frequency to the capacitor assembly so that the capacitor assembly outputs a corresponding internal control signal; The driving output chip is used for demodulating the internal control signal through the demodulator and converting the demodulated signal into direct current.
8. The intelligent power module according to claim 3, wherein the isolation unit comprises an upper pipe output terminal comprising an upper pipe high voltage terminal and an upper pipe ground terminal, the signal output unit comprises a negative voltage driving subunit comprising a first capacitor, a second capacitor, a first zener diode, and a third resistor, wherein: The positive pole of zener diode with the ground of isolation unit is connected, zener diode's negative pole with power device's source connection, zener diode's negative pole still with the first end of third resistance is connected, the second end of third resistance with the high-voltage end of isolation unit is connected, first electric capacity with the third resistance is parallelly connected, the second electric capacity with zener diode is parallelly connected.
9. The intelligent power module according to claim 3, wherein the isolation unit comprises an upper pipe output terminal comprising an upper pipe high voltage terminal and an upper pipe ground terminal, the capacitive isolation driving circuit module further comprises a bootstrap unit comprising a fourth resistor, a second diode and a third capacitor, wherein: The first end of the fourth resistor is connected with the driving power supply, the second end of the fourth resistor is connected with the positive electrode of the second diode, the negative electrode of the second diode is connected with the upper pipe high-voltage end of the isolation unit, the first end of the third capacitor is connected with the upper pipe high-voltage end of the isolation unit, and the second end of the third capacitor is connected with the upper pipe ground end of the isolation unit.
10. The smart power module of claim 1, wherein the smart power module further comprises a lead frame, wherein: the lead frame is electrically connected with the first substrate, the second substrate and the power circuit module respectively and is used for leading out electrodes on the first substrate, the second substrate and the power circuit module to corresponding pins.

Description

Intelligent power module Technical Field The utility model relates to the field of electronic devices, in particular to an intelligent power module. Background IPM (INTELLIGENT POWER MOUDLE, intelligent power module) is a multi-chip architecture module that packages the power device chip and the protection driver chip or circuit into the same insulator. With the development of power semiconductor technology, the power that IPM can carry is gradually increasing. The voltage and switching frequency that conventional silicon-based chips can withstand have failed to meet the ever-increasing demands. With the technical development of the third generation semiconductor material silicon carbide capable of bearing higher voltage and higher frequency, the silicon carbide discrete device and the integrated power module are already used in the fields of household appliances, new energy automobiles and the like. However, for IPMs that integrate drive and protection functions into the same module, common mode interference and lack of electrical isolation are reliability issues that limit the implementation of IPMs for higher voltage, higher frequency specifications. Disclosure of utility model The utility model mainly aims to provide an intelligent power module, which aims to solve the problem that the IPM in the prior art has reliability so that specifications of higher voltage and higher frequency cannot be applied. In order to achieve the above purpose, the utility model provides an intelligent power module, wherein a first substrate, a second substrate, a capacitive isolation driving circuit module and a power circuit module are arranged in the intelligent power module, the capacitive isolation driving circuit module is arranged on the first substrate, the power circuit module is arranged on the second substrate, and the first substrate is electrically connected with the power circuit module, wherein the first substrate is electrically connected with the power circuit module; The capacitive isolation driving circuit module is used for receiving an external control signal, performing capacitive isolation on a driving side receiving the external control signal and a power side where the power circuit module is located, and then sending an internal control signal corresponding to the external control signal to the power circuit module. Optionally, the first substrate is a printed circuit board, and the second substrate is a ceramic copper-clad plate. Optionally, the capacitive isolation driving circuit module comprises an isolation unit and a signal output unit, the power circuit module comprises a plurality of power devices, and the signal output unit is connected with the power devices in a one-to-one correspondence manner, wherein: And a group of output ends of the isolation units are correspondingly connected with one signal output unit. Optionally, the isolation unit comprises a processing chip and a capacitor subunit, wherein the capacitor subunit comprises a plurality of capacitor components, and the output end of each capacitor component is used as the output end of the isolation unit; The output ends of the processing chips are respectively connected with the input ends of the capacitance components in a one-to-one correspondence manner, wherein: The processing chip is used for receiving an external control signal, converting the external control signal into alternating current and outputting the alternating current to the capacitor assembly so that the capacitor assembly outputs a corresponding internal control signal. Optionally, the capacitor assembly comprises an isolation capacitor and a driving output chip, wherein: The first end of the isolation capacitor is connected with a group of output ends of the processing chip, the second end of the isolation capacitor is connected with the input end of the driving output chip, and the output end of the driving output chip is used as the output end of the capacitor assembly, wherein: The driving output chip is used for converting the signal received by the isolation capacitor into direct current to obtain the internal control signal and transmitting the internal control signal to the corresponding power device. Optionally, the isolation capacitor comprises a first metal electrode, a second metal electrode, a third metal electrode and a fourth metal electrode, wherein an insulating material is filled between the first metal electrode and the second metal electrode, and an insulating material is filled between the third metal electrode and the fourth metal electrode, and the isolation capacitor comprises: The first metal electrode is connected with the output end of the processing chip, the second metal electrode is electrically connected with the third metal electrode, and the fourth metal electrode is connected with the input end of the driving output chip. Optionally, a modulator is disposed in the processing chip, and a demodulator is disposed in the driving o